DE69923916D1 - Haftklebefolie und Verfahren zu deren Verwendung - Google Patents

Haftklebefolie und Verfahren zu deren Verwendung

Info

Publication number
DE69923916D1
DE69923916D1 DE69923916T DE69923916T DE69923916D1 DE 69923916 D1 DE69923916 D1 DE 69923916D1 DE 69923916 T DE69923916 T DE 69923916T DE 69923916 T DE69923916 T DE 69923916T DE 69923916 D1 DE69923916 D1 DE 69923916D1
Authority
DE
Germany
Prior art keywords
pressure
sensitive adhesive
adhesive film
film
sensitive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69923916T
Other languages
English (en)
Other versions
DE69923916T2 (de
Inventor
Takeshi Kondo
Kazuhiro Takahashi
Yoshihisa Mineura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of DE69923916D1 publication Critical patent/DE69923916D1/de
Application granted granted Critical
Publication of DE69923916T2 publication Critical patent/DE69923916T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/31—Applications of adhesives in processes or use of adhesives in the form of films or foils as a masking tape for painting
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C09J2433/006—Presence of (meth)acrylic polymer in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • C09J2475/006—Presence of polyurethane in the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2861—Adhesive compositions having readily strippable combined with readily readhearable properties [e.g., stick-ons, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE69923916T 1998-11-20 1999-11-19 Haftklebefolie und Verfahren zu deren Verwendung Expired - Lifetime DE69923916T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP33166198 1998-11-20
JP33166198 1998-11-20

Publications (2)

Publication Number Publication Date
DE69923916D1 true DE69923916D1 (de) 2005-04-07
DE69923916T2 DE69923916T2 (de) 2005-07-21

Family

ID=18246174

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69923916T Expired - Lifetime DE69923916T2 (de) 1998-11-20 1999-11-19 Haftklebefolie und Verfahren zu deren Verwendung

Country Status (8)

Country Link
US (2) US6524701B1 (de)
EP (1) EP1002845B1 (de)
KR (1) KR100584026B1 (de)
CN (1) CN1137028C (de)
DE (1) DE69923916T2 (de)
MY (1) MY123013A (de)
SG (1) SG81332A1 (de)
TW (1) TWI238182B (de)

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JP2001240842A (ja) * 2000-02-28 2001-09-04 Nitto Denko Corp 紫外線硬化型粘着剤組成物とその粘着シ―ト類
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JP4812963B2 (ja) * 2001-05-18 2011-11-09 リンテック株式会社 半導体ウエハ加工用粘着シートおよび半導体ウエハの加工方法
US7238421B2 (en) 2002-03-28 2007-07-03 Mitsui Chemicals, Inc. Pressure sensitive adhesive film for protection of semiconductor wafer surface and method of protecting semiconductor wafer with the pressure sensitive adhesive film
DE10233521A1 (de) * 2002-07-23 2004-02-05 Basf Ag Strahlungshärtbare Lacksysteme mit tieftemperaturelastischer Unterschicht
KR101016081B1 (ko) * 2002-07-26 2011-02-17 닛토덴코 가부시키가이샤 점착 시트와 그의 제조방법, 상기 점착 시트의 사용방법,및 상기 점착 시트에 사용되는 다층 시트와 그의 제조방법
TWI310230B (en) * 2003-01-22 2009-05-21 Lintec Corp Adhesive sheet, method for protecting surface of semiconductor wafer and method for processing work
JP4017156B2 (ja) * 2003-01-27 2007-12-05 日東電工株式会社 粘着型光学補償層付偏光板および画像表示装置
JP4278653B2 (ja) * 2003-03-17 2009-06-17 リンテック株式会社 表面保護用粘着シート及びその製造方法
JP4566527B2 (ja) 2003-08-08 2010-10-20 日東電工株式会社 再剥離型粘着シート
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JP5027460B2 (ja) 2006-07-28 2012-09-19 東京応化工業株式会社 ウエハの接着方法、薄板化方法、及び剥離方法
JP2008060151A (ja) * 2006-08-29 2008-03-13 Nitto Denko Corp 半導体ウエハ裏面加工方法、基板裏面加工方法、及び放射線硬化型粘着シート
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JP5318435B2 (ja) * 2008-02-29 2013-10-16 日東電工株式会社 半導体ウエハの裏面研削用粘着シート及びこの裏面研削用粘着シートを用いる半導体ウエハの裏面研削方法
US20100098846A1 (en) * 2008-09-29 2010-04-22 Scapa North America Patterned soft adhesives and method of manufacture
KR100983026B1 (ko) * 2008-12-18 2010-09-17 주식회사 엘지화학 점착제 조성물, 편광판 및 액정표시장치
JP5491049B2 (ja) * 2009-03-11 2014-05-14 日東電工株式会社 半導体ウエハ保護用基材レス粘着シート、その粘着シートを用いた半導体ウエハ裏面研削方法及びその粘着シートの製造方法
JP5501060B2 (ja) * 2009-04-02 2014-05-21 日東電工株式会社 半導体ウエハ保護用粘着シートの貼り合わせ方法、及びこの貼り合わせ方法に用いる半導体ウエハ保護用粘着シート
US20120094037A1 (en) * 2009-06-18 2012-04-19 Nitto Denko Corporation Pressure-sensitive adhesive sheet for optical use
JP2011054940A (ja) * 2009-08-07 2011-03-17 Nitto Denko Corp 半導体ウェハ保持保護用粘着シート及び半導体ウェハの裏面研削方法
JP5068793B2 (ja) 2009-09-24 2012-11-07 リンテック株式会社 粘着シート
JP5762781B2 (ja) * 2011-03-22 2015-08-12 リンテック株式会社 基材フィルムおよび該基材フィルムを備えた粘着シート
US20140017467A1 (en) * 2011-03-31 2014-01-16 Lintec Corporation Pressure sensitive adhesive sheet
JP5770038B2 (ja) * 2011-07-25 2015-08-26 リンテック株式会社 粘着シート
JP6175717B2 (ja) * 2011-08-19 2017-08-09 エルジー・ケム・リミテッド 偏光板
JP5975621B2 (ja) * 2011-11-02 2016-08-23 リンテック株式会社 ダイシングシートおよび半導体チップの製造方法
US9097600B2 (en) * 2011-11-06 2015-08-04 Mehdi Kalantari Khandani System and method for strain and acoustic emission monitoring
WO2015064574A1 (ja) * 2013-10-30 2015-05-07 リンテック株式会社 半導体接合用接着シートおよび半導体装置の製造方法
CN106062928B (zh) * 2014-03-03 2018-08-14 琳得科株式会社 半导体相关构件加工用片材以及利用该片材的晶片的制造方法
TWI671379B (zh) * 2014-04-11 2019-09-11 日商琳得科股份有限公司 背面研磨膠帶用基材、及背面研磨膠帶
TWI526505B (zh) 2014-09-11 2016-03-21 財團法人工業技術研究院 硬塗層組成物及應用其之偏光膜和顯示器
JP6632846B2 (ja) 2014-09-30 2020-01-22 日東電工株式会社 粘着シート
WO2016104322A1 (ja) * 2014-12-24 2016-06-30 リンテック株式会社 粘着シート
CN107207920B (zh) * 2015-01-30 2021-02-09 琳得科株式会社 半导体加工用粘合片
KR102528633B1 (ko) * 2015-04-30 2023-05-03 린텍 가부시키가이샤 워크 가공용 점착 테이프
WO2017104478A1 (ja) * 2015-12-17 2017-06-22 Dic株式会社 易剥離性粘着テープ、物品及び物品の解体方法
CN109937245B (zh) * 2016-11-17 2022-01-18 琳得科株式会社 半导体加工用粘合片
CN111417513B (zh) * 2018-03-09 2022-06-03 琳得科株式会社 保护膜形成用复合片及带保护膜的半导体芯片的制造方法
JP7162679B2 (ja) * 2018-10-26 2022-10-28 三井化学株式会社 基板積層体の製造方法及び積層体
JPWO2020195744A1 (de) * 2019-03-27 2020-10-01
KR20210011552A (ko) * 2019-07-22 2021-02-02 삼성디스플레이 주식회사 표시모듈
KR20210075246A (ko) 2019-12-12 2021-06-23 삼성디스플레이 주식회사 표시 장치

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CN1254743A (zh) 2000-05-31
MY123013A (en) 2006-05-31
DE69923916T2 (de) 2005-07-21
US20030104199A1 (en) 2003-06-05
CN1137028C (zh) 2004-02-04
SG81332A1 (en) 2001-06-19
KR100584026B1 (ko) 2006-05-29
EP1002845A2 (de) 2000-05-24
TWI238182B (en) 2005-08-21
EP1002845A3 (de) 2000-10-25
EP1002845B1 (de) 2005-03-02
US6878441B2 (en) 2005-04-12
KR20000035577A (ko) 2000-06-26
US6524701B1 (en) 2003-02-25

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