DE69914402D1 - Durch Energiestrahl härtbare, hydrophile und druckempfindliche Klebstoffzusammensetzung und deren Verwendung - Google Patents

Durch Energiestrahl härtbare, hydrophile und druckempfindliche Klebstoffzusammensetzung und deren Verwendung

Info

Publication number
DE69914402D1
DE69914402D1 DE69914402T DE69914402T DE69914402D1 DE 69914402 D1 DE69914402 D1 DE 69914402D1 DE 69914402 T DE69914402 T DE 69914402T DE 69914402 T DE69914402 T DE 69914402T DE 69914402 D1 DE69914402 D1 DE 69914402D1
Authority
DE
Germany
Prior art keywords
curable
hydrophilic
energy
pressure
sensitive adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69914402T
Other languages
English (en)
Other versions
DE69914402T2 (de
Inventor
Takeshi Kondo
Kiichiro Kato
Kazuhiro Takahashi
Yoshihisa Mineura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Application granted granted Critical
Publication of DE69914402D1 publication Critical patent/DE69914402D1/de
Publication of DE69914402T2 publication Critical patent/DE69914402T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/12—Polymers provided for in subclasses C08C or C08F
    • C08F290/126—Polymers of unsaturated carboxylic acids or derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/12—Polymers provided for in subclasses C08C or C08F
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2809—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including irradiated or wave energy treated component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Polymerisation Methods In General (AREA)
  • Dicing (AREA)
DE69914402T 1998-05-22 1999-05-19 Durch Energiestrahl härtbare, hydrophile und druckempfindliche Klebstoffzusammensetzung und deren Verwendung Expired - Fee Related DE69914402T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP14153498 1998-05-22
JP14153498A JP4053656B2 (ja) 1998-05-22 1998-05-22 エネルギー線硬化型親水性粘着剤組成物およびその利用方法

Publications (2)

Publication Number Publication Date
DE69914402D1 true DE69914402D1 (de) 2004-03-04
DE69914402T2 DE69914402T2 (de) 2004-07-08

Family

ID=15294213

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69914402T Expired - Fee Related DE69914402T2 (de) 1998-05-22 1999-05-19 Durch Energiestrahl härtbare, hydrophile und druckempfindliche Klebstoffzusammensetzung und deren Verwendung

Country Status (9)

Country Link
US (1) US6403215B1 (de)
EP (1) EP0959117B1 (de)
JP (1) JP4053656B2 (de)
KR (1) KR100568040B1 (de)
CN (1) CN1163565C (de)
DE (1) DE69914402T2 (de)
HK (1) HK1024258A1 (de)
SG (1) SG76618A1 (de)
TW (1) TWI247032B (de)

Families Citing this family (32)

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JP4667561B2 (ja) * 2000-06-15 2011-04-13 古河電気工業株式会社 放射線硬化性粘着テープ
US6534618B1 (en) 2000-11-27 2003-03-18 Corning Incorporated Methods of drying optical fiber coatings
JP2004010779A (ja) * 2002-06-07 2004-01-15 Nippon Paint Co Ltd 紫外線硬化型水性塗料組成物
JP3998548B2 (ja) * 2002-09-25 2007-10-31 日東電工株式会社 粘着除塵クリーナー
KR101170845B1 (ko) 2003-02-05 2012-08-02 후루카와 덴키 고교 가부시키가이샤 다이싱 다이본딩 테이프
JP4592291B2 (ja) * 2004-01-15 2010-12-01 日東電工株式会社 粘着剤組成物及びそれを用いてなる表面保護フィルム
JP3958297B2 (ja) * 2004-03-24 2007-08-15 住友ベークライト株式会社 ダイシングシート機能付き半導体用接着フィルム、それを用いた半導体装置の製造方法及び半導体装置
JP4439990B2 (ja) * 2004-04-28 2010-03-24 株式会社ディスコ レーザー加工方法
JP4776189B2 (ja) * 2004-08-03 2011-09-21 古河電気工業株式会社 ウエハ加工用テープ
JP4776188B2 (ja) 2004-08-03 2011-09-21 古河電気工業株式会社 半導体装置製造方法およびウエハ加工用テープ
JP4800778B2 (ja) * 2005-05-16 2011-10-26 日東電工株式会社 ダイシング用粘着シート及びそれを用いた被加工物の加工方法
JP4970863B2 (ja) * 2006-07-13 2012-07-11 日東電工株式会社 被加工物の加工方法
WO2009041681A1 (ja) * 2007-09-28 2009-04-02 Deos Laboratory Inc. 共重合体、樹脂組成物、表示パネル用スペーサー、平坦化膜、熱硬化性保護膜、マイクロレンズ、および共重合体の製造方法
JP4717051B2 (ja) * 2007-11-08 2011-07-06 日東電工株式会社 ダイシング・ダイボンドフィルム
JP4717085B2 (ja) * 2008-01-18 2011-07-06 日東電工株式会社 ダイシング・ダイボンドフィルム
JP2012054431A (ja) * 2010-09-01 2012-03-15 Nitto Denko Corp 半導体ウエハ保護用粘着シート
JP5600564B2 (ja) * 2010-11-24 2014-10-01 株式会社日本触媒 光学用紫外線硬化型樹脂組成物
JP5376345B2 (ja) * 2011-10-11 2013-12-25 綜研化学株式会社 光重合性粘着剤組成物及びこれを使用した粘着シート
JP5376346B2 (ja) * 2011-10-18 2013-12-25 綜研化学株式会社 光重合性粘着剤組成物及びこれを利用した粘着シート
JP5100902B1 (ja) * 2012-03-23 2012-12-19 古河電気工業株式会社 半導体ウエハ表面保護用粘着テープ
JP5882107B2 (ja) * 2012-03-30 2016-03-09 リンテック株式会社 粘着性組成物、粘着剤および粘着シート
JP6412873B2 (ja) * 2013-09-27 2018-10-24 リンテック株式会社 粘着シート
WO2016100085A1 (en) * 2014-12-16 2016-06-23 Ashland Licensing And Intellectual Property Llc Electron beam curable pressure sensitive adhesive comprising acrylic polymer with bound vinyl group
JP6055494B2 (ja) * 2015-01-27 2016-12-27 碁達科技股▲ふん▼有限公司 レーザーダイシング方法
JP6819051B2 (ja) * 2015-03-04 2021-01-27 住友化学株式会社 硬化性樹脂組成物
KR20180066043A (ko) * 2015-10-05 2018-06-18 린텍 가부시키가이샤 반도체 가공용 시트
JP2017200975A (ja) * 2016-05-06 2017-11-09 王子ホールディングス株式会社 粘着シート及び積層体
TW201825583A (zh) * 2016-11-16 2018-07-16 日商東亞合成股份有限公司 樹脂片材製造用硬化型組成物
JP2021114586A (ja) * 2020-01-21 2021-08-05 日東電工株式会社 紫外線硬化型粘着シート
CN112391131B (zh) * 2020-11-16 2022-10-28 中山市皇冠胶粘制品有限公司 环保水溶性丙烯酸酯压敏胶、胶粘带及其制备方法和应用
WO2023054086A1 (ja) * 2021-09-29 2023-04-06 日東電工株式会社 粘着剤組成物及び該粘着剤組成物を用いた粘着シート
WO2024038798A1 (ja) * 2022-08-19 2024-02-22 日東電工株式会社 粘着剤付き部材の解体方法

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US4033920A (en) * 1974-06-14 1977-07-05 Kansai Paint Company, Ltd. Process for producing unsaturated resin emulsion
US5714029A (en) 1984-03-12 1998-02-03 Nitto Electric Industrial Co., Ltd. Process for working a semiconductor wafer
JPH0616524B2 (ja) 1984-03-12 1994-03-02 日東電工株式会社 半導体ウエハ固定用接着薄板
JPS60223139A (ja) 1984-04-18 1985-11-07 Nitto Electric Ind Co Ltd 半導体ウエハ固定用接着薄板
JPH0811788B2 (ja) 1985-10-30 1996-02-07 日東電工株式会社 半導体ウエハの保護部材
DE3787680T2 (de) 1986-07-09 1994-03-10 Lintec Corp Klebestreifen zum Kleben von Plättchen.
CA1339485C (en) * 1988-05-17 1997-09-30 Kenji Seko Active energy ray-curable unsaturated resin composition
JPH0712631B2 (ja) 1992-03-23 1995-02-15 株式会社リコー 射出成形金型およびその射出成形方法
US5302629A (en) * 1992-05-15 1994-04-12 Berejka Anthony J Hydrophilic acrylic pressure sensitive adhesives
JP2673766B2 (ja) * 1992-08-25 1997-11-05 株式会社半導体エネルギー研究所 炭素を主成分とする材料の作製方法
JPH06151300A (ja) * 1992-11-06 1994-05-31 Nitto Denko Corp レジスト膜画像の除去方法、及びそれに用いる硬化型感圧性接着剤あるいは接着シート類
JP2590682B2 (ja) 1993-03-30 1997-03-12 荒川化学工業株式会社 活性エネルギー線硬化性含水樹脂組成物
JPH07201787A (ja) * 1993-12-28 1995-08-04 Lintec Corp ウエハ表面保護シートおよびその利用方法
JP2984549B2 (ja) 1994-07-12 1999-11-29 リンテック株式会社 エネルギー線硬化型感圧粘着剤組成物およびその利用方法
WO1997024378A1 (en) * 1995-12-29 1997-07-10 Minnesota Mining And Manufacturing Company Use of pendant free-radically polymerizable moieties with polar polymers to prepare hydrophilic pressure sensitive adhesive compositions
JP3388674B2 (ja) * 1996-04-19 2003-03-24 リンテック株式会社 エネルギー線硬化型感圧接着剤組成物およびその利用方法
JP4256481B2 (ja) * 1997-02-14 2009-04-22 リンテック株式会社 粘着剤組成物およびその利用方法
JP4072927B2 (ja) * 1997-08-28 2008-04-09 リンテック株式会社 エネルギー線硬化型親水性粘着剤組成物およびその利用方法

Also Published As

Publication number Publication date
JPH11335655A (ja) 1999-12-07
SG76618A1 (en) 2000-11-21
JP4053656B2 (ja) 2008-02-27
KR19990088426A (ko) 1999-12-27
DE69914402T2 (de) 2004-07-08
HK1024258A1 (en) 2000-10-05
CN1163565C (zh) 2004-08-25
US6403215B1 (en) 2002-06-11
EP0959117B1 (de) 2004-01-28
EP0959117A1 (de) 1999-11-24
KR100568040B1 (ko) 2006-04-05
TWI247032B (en) 2006-01-11
CN1238367A (zh) 1999-12-15

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8339 Ceased/non-payment of the annual fee