DE69902599T2 - Widerstand und sein Herstellungsverfahren - Google Patents

Widerstand und sein Herstellungsverfahren

Info

Publication number
DE69902599T2
DE69902599T2 DE69902599T DE69902599T DE69902599T2 DE 69902599 T2 DE69902599 T2 DE 69902599T2 DE 69902599 T DE69902599 T DE 69902599T DE 69902599 T DE69902599 T DE 69902599T DE 69902599 T2 DE69902599 T2 DE 69902599T2
Authority
DE
Germany
Prior art keywords
resistance
manufacturing process
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69902599T
Other languages
English (en)
Other versions
DE69902599D1 (de
Inventor
Hiroyuki Yamada
Masato Hashimoto
Seiji Tsuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP10002002A external-priority patent/JPH11204303A/ja
Priority claimed from JP10002001A external-priority patent/JPH11204302A/ja
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE69902599D1 publication Critical patent/DE69902599D1/de
Application granted granted Critical
Publication of DE69902599T2 publication Critical patent/DE69902599T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Non-Adjustable Resistors (AREA)
  • Details Of Resistors (AREA)
DE69902599T 1998-01-08 1999-01-08 Widerstand und sein Herstellungsverfahren Expired - Fee Related DE69902599T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10002002A JPH11204303A (ja) 1998-01-08 1998-01-08 抵抗器およびその製造方法
JP10002001A JPH11204302A (ja) 1998-01-08 1998-01-08 抵抗器

Publications (2)

Publication Number Publication Date
DE69902599D1 DE69902599D1 (de) 2002-10-02
DE69902599T2 true DE69902599T2 (de) 2003-01-09

Family

ID=26335314

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69902599T Expired - Fee Related DE69902599T2 (de) 1998-01-08 1999-01-08 Widerstand und sein Herstellungsverfahren

Country Status (5)

Country Link
US (1) US6023217A (de)
EP (1) EP0929083B1 (de)
CN (1) CN1158676C (de)
DE (1) DE69902599T2 (de)
TW (1) TW424245B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006060387A1 (de) * 2006-12-20 2008-06-26 Isabellenhütte Heusler Gmbh & Co. Kg Widerstand, insbesondere SMD-Widerstand, und zugehöriges Herstellungsverfahren

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100333298B1 (ko) * 1997-07-03 2002-04-25 모리시타 요이찌 저항기 및 그 제조방법
JPH11204315A (ja) * 1998-01-12 1999-07-30 Matsushita Electric Ind Co Ltd 抵抗器の製造方法
KR100328255B1 (ko) * 1999-01-27 2002-03-16 이형도 칩 부품 및 그 제조방법
KR100365692B1 (ko) 2000-02-24 2002-12-26 삼성전자 주식회사 토너 화상 정착을 위한 직접 가열 롤러 및 그 제조 방법
JP2002025802A (ja) * 2000-07-10 2002-01-25 Rohm Co Ltd チップ抵抗器
JP3985441B2 (ja) * 2000-08-22 2007-10-03 松下電器産業株式会社 抵抗素子の製造方法
US7057490B2 (en) * 2000-08-30 2006-06-06 Matsushita Electric Industrial Co. Ltd. Resistor and production method therefor
JP2002260901A (ja) * 2001-03-01 2002-09-13 Matsushita Electric Ind Co Ltd 抵抗器
US7214295B2 (en) * 2001-04-09 2007-05-08 Vishay Dale Electronics, Inc. Method for tantalum pentoxide moisture barrier in film resistors
US7518223B2 (en) * 2001-08-24 2009-04-14 Micron Technology, Inc. Semiconductor devices and semiconductor device assemblies including a nonconfluent spacer layer
AU2002324848A1 (en) * 2002-09-03 2004-03-29 Vishay Intertechnology, Inc. Flip chip resistor and its manufacturing method
JP3967272B2 (ja) * 2003-02-25 2007-08-29 ローム株式会社 チップ抵抗器
JP2004259864A (ja) * 2003-02-25 2004-09-16 Rohm Co Ltd チップ抵抗器
JP3971335B2 (ja) * 2003-04-08 2007-09-05 ローム株式会社 チップ抵抗器およびその製造方法
US7786842B2 (en) * 2005-03-02 2010-08-31 Rohm Co., Ltd. Chip resistor and manufacturing method thereof
KR20080027951A (ko) 2005-08-18 2008-03-28 로무 가부시키가이샤 칩 저항기
JP3983264B2 (ja) * 2005-09-27 2007-09-26 北陸電気工業株式会社 チップ状電気部品の端子構造
TW200733149A (en) * 2006-02-22 2007-09-01 Walsin Technology Corp Manufacturing method of chip resistor
TWI287806B (en) * 2006-02-22 2007-10-01 Walsin Technology Corp Method of manufacturing chip resistor
KR100843216B1 (ko) * 2006-12-11 2008-07-02 삼성전자주식회사 솔더볼 접합이 가능한 칩 네트워크 저항기 및 이를포함하는 반도체 모듈
JP4264463B2 (ja) * 2007-08-30 2009-05-20 釜屋電機株式会社 金属板チップ抵抗器の製造方法及び製造装置
CN101206939B (zh) * 2007-12-14 2011-11-09 广东风华高新科技股份有限公司 一种片式贱金属电阻器的制造方法
JP4498433B2 (ja) * 2008-06-05 2010-07-07 北陸電気工業株式会社 チップ状電気部品及びその製造方法
JP2010161135A (ja) * 2009-01-07 2010-07-22 Rohm Co Ltd チップ抵抗器およびその製造方法
JP5543146B2 (ja) * 2009-07-27 2014-07-09 ローム株式会社 チップ抵抗器およびチップ抵抗器の製造方法
WO2012114673A1 (ja) * 2011-02-24 2012-08-30 パナソニック株式会社 チップ抵抗器およびその製造方法
JP6134507B2 (ja) * 2011-12-28 2017-05-24 ローム株式会社 チップ抵抗器およびその製造方法
JP2014072242A (ja) * 2012-09-27 2014-04-21 Rohm Co Ltd チップ部品およびその製造方法
KR101883039B1 (ko) * 2016-01-08 2018-07-27 삼성전기주식회사 칩 저항 소자
KR101883040B1 (ko) * 2016-01-08 2018-07-27 삼성전기주식회사 칩 저항 소자
CN105679478B (zh) * 2016-01-27 2018-07-03 深圳顺络电子股份有限公司 一种小尺寸片式热敏电阻及其制作方法
US10312317B2 (en) 2017-04-27 2019-06-04 Samsung Electro-Mechanics Co., Ltd. Chip resistor and chip resistor assembly
US10937573B2 (en) * 2017-11-02 2021-03-02 Rohm Co., Ltd. Chip resistor

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3611275A (en) * 1970-01-15 1971-10-05 Bell Telephone Labor Inc Thin film clip-lead device
DE3122612A1 (de) * 1981-06-06 1982-12-23 Draloric Electronic GmbH, 8672 Selb "verfahren zur herstellung von chipwiderstaenden"
JPS59185801U (ja) * 1983-05-26 1984-12-10 アルプス電気株式会社 チツプ抵抗
US4792781A (en) * 1986-02-21 1988-12-20 Tdk Corporation Chip-type resistor
US4884053A (en) * 1988-08-26 1989-11-28 Dale Electronics, Inc. Surface mount wirewound resistor and method of making the same
JP2535441B2 (ja) * 1990-08-21 1996-09-18 ローム株式会社 チップ型抵抗器の製造方法
US5379017A (en) * 1993-10-25 1995-01-03 Rohm Co., Ltd. Square chip resistor
JPH0969406A (ja) * 1995-08-31 1997-03-11 Matsushita Electric Ind Co Ltd 角形薄膜チップ抵抗器の製造方法
DE69715091T2 (de) * 1996-05-29 2003-01-02 Matsushita Electric Ind Co Ltd Widerstand für Oberflächenmontage

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006060387A1 (de) * 2006-12-20 2008-06-26 Isabellenhütte Heusler Gmbh & Co. Kg Widerstand, insbesondere SMD-Widerstand, und zugehöriges Herstellungsverfahren
US8013713B2 (en) 2006-12-20 2011-09-06 Isabellenhutte Heusler Gmbh & Co. Kg Resistor, particularly SMD resistor, and associated production method

Also Published As

Publication number Publication date
DE69902599D1 (de) 2002-10-02
TW424245B (en) 2001-03-01
EP0929083B1 (de) 2002-08-28
EP0929083A1 (de) 1999-07-14
CN1226067A (zh) 1999-08-18
US6023217A (en) 2000-02-08
CN1158676C (zh) 2004-07-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee