DE69835234D1 - Behälter für staubfreie Gegenstände (FOUP) - Google Patents

Behälter für staubfreie Gegenstände (FOUP)

Info

Publication number
DE69835234D1
DE69835234D1 DE69835234T DE69835234T DE69835234D1 DE 69835234 D1 DE69835234 D1 DE 69835234D1 DE 69835234 T DE69835234 T DE 69835234T DE 69835234 T DE69835234 T DE 69835234T DE 69835234 D1 DE69835234 D1 DE 69835234D1
Authority
DE
Germany
Prior art keywords
foup
dust
container
free objects
objects
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69835234T
Other languages
English (en)
Other versions
DE69835234T2 (de
Inventor
Toshio Ishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainichi Shoji KK
Original Assignee
Dainichi Shoji KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainichi Shoji KK filed Critical Dainichi Shoji KK
Publication of DE69835234D1 publication Critical patent/DE69835234D1/de
Application granted granted Critical
Publication of DE69835234T2 publication Critical patent/DE69835234T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • Closures For Containers (AREA)
DE69835234T 1998-12-02 1998-12-02 Behälter für staubfreie Gegenstände (FOUP) Expired - Lifetime DE69835234T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP1998/005417 WO2000033376A1 (fr) 1998-12-02 1998-12-02 Contenant

Publications (2)

Publication Number Publication Date
DE69835234D1 true DE69835234D1 (de) 2006-08-24
DE69835234T2 DE69835234T2 (de) 2007-05-31

Family

ID=14209517

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69835234T Expired - Lifetime DE69835234T2 (de) 1998-12-02 1998-12-02 Behälter für staubfreie Gegenstände (FOUP)

Country Status (6)

Country Link
US (1) US6398475B1 (de)
EP (1) EP1052692B1 (de)
JP (1) JP3917371B2 (de)
KR (1) KR100495434B1 (de)
DE (1) DE69835234T2 (de)
WO (1) WO2000033376A1 (de)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE59611078D1 (de) * 1995-03-28 2004-10-14 Brooks Automation Gmbh Be- und Entladestation für Halbleiterbearbeitungsanlagen
US8083272B1 (en) * 1998-06-29 2011-12-27 Industrial Technology Research Institute Mechanically actuated air tight device for wafer carrier
KR100757000B1 (ko) * 2001-07-14 2007-09-11 주식회사 신성이엔지 웨이퍼이송용기 오프너의 도어홀딩장치
JP3581310B2 (ja) * 2000-08-31 2004-10-27 Ｔｄｋ株式会社 防塵機能を備えた半導体ウェーハ処理装置
WO2002048487A1 (en) * 2000-12-13 2002-06-20 Entegris Cayman Ltd. Latch hub assembly
TW514073U (en) * 2001-09-13 2002-12-11 Fortrend Taiwan Scient Corp Alignment device capable of elastic stretch
EP1315198B1 (de) * 2001-11-21 2006-08-30 RIGHT MFG. Co. Ltd. Entfernungs- und Einbringungsvorrichtung für einen Behälterdeckel
US7344349B2 (en) * 2001-11-30 2008-03-18 Right Mfg. Co., Ltd. Pod cover removing-installing apparatus
JP2003168727A (ja) * 2001-11-30 2003-06-13 Dainichi Shoji Kk エクスチェンジャーおよびガス置換方法
US20080206028A1 (en) * 2001-11-30 2008-08-28 Tatsuhiko Nagata Pod cover removing-installing apparatus
DE10164529C1 (de) * 2001-12-18 2003-10-09 Jenoptik Laser Optik Sys Gmbh Einrichtung zur Aufbewahrung und zum Transport von mindestens einem optischen Bauelement
US7121414B2 (en) * 2001-12-28 2006-10-17 Brooks Automation, Inc. Semiconductor cassette reducer
US6955382B2 (en) * 2002-01-15 2005-10-18 Entegris, Inc. Wafer carrier door and latching mechanism with c-shaped cam follower
US6835039B2 (en) * 2002-03-15 2004-12-28 Asm International N.V. Method and apparatus for batch processing of wafers in a furnace
US6858085B1 (en) * 2002-08-06 2005-02-22 Tegal Corporation Two-compartment chamber for sequential processing
US7360985B2 (en) * 2002-12-30 2008-04-22 Tdk Corporation Wafer processing apparatus including clean box stopping mechanism
JP2005026513A (ja) * 2003-07-03 2005-01-27 Tokyo Electron Ltd 処理装置
US7201276B2 (en) * 2003-11-07 2007-04-10 Entegris, Inc. Front opening substrate container with bottom plate
KR100981804B1 (ko) * 2006-04-11 2010-09-13 히라따기꼬오 가부시키가이샤 Ｆｏｕｐ오프너의 ｆｏｕｐ도어 위치결정장치
JP4194051B2 (ja) * 2006-05-31 2008-12-10 Ｔｄｋ株式会社 防塵機能を備えたロードポート装置及びミニエンバイロンメントシステム
US8297319B2 (en) * 2006-09-14 2012-10-30 Brooks Automation, Inc. Carrier gas system and coupling substrate carrier to a loadport
TWI475627B (zh) * 2007-05-17 2015-03-01 Brooks Automation Inc 基板運送機、基板處理裝置和系統、於基板處理期間降低基板之微粒污染的方法，及使運送機與處理機結合之方法
US8528947B2 (en) * 2008-09-08 2013-09-10 Tdk Corporation Closed container and lid opening/closing system therefor
JP4624458B2 (ja) * 2008-11-11 2011-02-02 Ｔｄｋ株式会社 密閉容器及び該密閉容器の蓋開閉システム
JP4748816B2 (ja) * 2008-11-28 2011-08-17 Ｔｄｋ株式会社 密閉容器の蓋開閉システム
JP4919123B2 (ja) * 2010-03-08 2012-04-18 Ｔｄｋ株式会社 処理基板収納ポッド及び処理基板収納ポッドの蓋開閉システム
JP5024422B2 (ja) * 2010-05-06 2012-09-12 株式会社デンソー 搬送システム
JP5617708B2 (ja) * 2011-03-16 2014-11-05 東京エレクトロン株式会社 蓋体開閉装置
JP5894825B2 (ja) * 2012-03-21 2016-03-30 東京エレクトロン株式会社 プローブ装置及びウエハ搬送ユニット
US8915368B2 (en) * 2012-09-20 2014-12-23 Shenzhen China Star Optoelectronics Technology Co., Ltd LCD glass substrate storage tray
CN111819677A (zh) * 2018-03-22 2020-10-23 徽拓真空阀门有限公司 保护装置、具有至少一个保护装置的晶圆运输容器、具有该保护装置的保护系统及方法
KR20210100798A (ko) 2020-02-06 2021-08-18 삼성디스플레이 주식회사 기판용 카세트
KR102244136B1 (ko) * 2020-12-10 2021-04-23 (주)상아프론테크 수납용기

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4674939A (en) * 1984-07-30 1987-06-23 Asyst Technologies Sealed standard interface apparatus
US4842680A (en) * 1985-10-24 1989-06-27 Texas Instruments Incorporated Advanced vacuum processor
EP0574893A3 (en) * 1992-06-19 1996-01-10 Ibm Method of printed circuit panel manufacture
DE59611078D1 (de) 1995-03-28 2004-10-14 Brooks Automation Gmbh Be- und Entladestation für Halbleiterbearbeitungsanlagen
DE19542646C2 (de) * 1995-03-28 2003-04-30 Brooks Automation Gmbh Be- und Entladestation für Halbleiterbearbeitungsanlagen
JP3657695B2 (ja) * 1996-05-13 2005-06-08 東京エレクトロン株式会社 被処理基板の移載装置
US5980195A (en) 1996-04-24 1999-11-09 Tokyo Electron, Ltd. Positioning apparatus for substrates to be processed

Also Published As

Publication number Publication date
KR100495434B1 (ko) 2005-06-14
EP1052692A4 (de) 2002-05-02
EP1052692A1 (de) 2000-11-15
JP3917371B2 (ja) 2007-05-23
WO2000033376A1 (fr) 2000-06-08
US6398475B1 (en) 2002-06-04
KR20010040518A (ko) 2001-05-15
DE69835234T2 (de) 2007-05-31
EP1052692B1 (de) 2006-07-12

Similar Documents

Publication Publication Date Title
DE69835234D1 (de) Behälter für staubfreie Gegenstände (FOUP)
DE69712561D1 (de) Vertikale Behälter für wafer
DE69825458D1 (de) Speicheranordnung für wafer
DE69511487D1 (de) Versandverpackung für Halbleiterplättchen
DE19781631T1 (de) Wärmeleitendes Spannfutter für Vakuumbearbeitungsvorrichtung
DE59904028D1 (de) Behälterträger
DE69923769D1 (de) Asynchrones halbleiterspeicher-fliessband
IT1308715B1 (it) Macchina di ispezione di contenitori
DE19882662T1 (de) Wafertransportvorrichtung für Mehrstationswerkzeug
DE69513361D1 (de) Trägerbehälter für Substratscheiben
DE69940029D1 (de) Halbleiterbauelement
NL1010321A1 (nl) Wafeldrager.
DE69834778D1 (de) Haltevorrichtung für Halbleiter
DE69838566D1 (de) III-V-Verbindungshalbleiter-Scheibe
IT1313979B1 (it) Cassetta di trasporto di wafer di semiconduttore
DE59811654D1 (de) Vorrichtung für rieselfähige Schüttgüter
EP1035574A4 (de) Behälter zur übertragung von halbleiterwafern
DE69804161D1 (de) Bauteil für Halbleiterapparatur
KR960019164U (ko) 반도체디바이스용 소켓
KR970052858U (ko) 웨이퍼 캐리어 박스
DE69527132D1 (de) Behälter für Halbleiterplättchen
KR980005422U (ko) 반도체 웨이퍼 캐리어
DE59712806D1 (de) Transfervorrichtung für Halbleiterscheiben
FR2785257B1 (fr) Caisse pour plaquettes semiconductrices
KR970056082U (ko) 반도체 웨이퍼 자동반송용 캐리어

Legal Events

Date Code Title Description
8364 No opposition during term of opposition