DE19882662T1 - Wafertransportvorrichtung für Mehrstationswerkzeug - Google Patents

Wafertransportvorrichtung für Mehrstationswerkzeug

Info

Publication number
DE19882662T1
DE19882662T1 DE19882662T DE19882662T DE19882662T1 DE 19882662 T1 DE19882662 T1 DE 19882662T1 DE 19882662 T DE19882662 T DE 19882662T DE 19882662 T DE19882662 T DE 19882662T DE 19882662 T1 DE19882662 T1 DE 19882662T1
Authority
DE
Germany
Prior art keywords
transport device
wafer transport
station tools
tools
station
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19882662T
Other languages
English (en)
Inventor
Mehrdad M Moslehi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CVC Products Inc
Original Assignee
CVC Products Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CVC Products Inc filed Critical CVC Products Inc
Publication of DE19882662T1 publication Critical patent/DE19882662T1/de
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • B65G1/02—Storage devices
    • B65G1/04—Storage devices mechanical
    • B65G1/06—Storage devices mechanical with means for presenting articles for removal at predetermined position or level
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Specific Conveyance Elements (AREA)
DE19882662T 1997-08-28 1998-08-27 Wafertransportvorrichtung für Mehrstationswerkzeug Ceased DE19882662T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US5771597P 1997-08-28 1997-08-28
PCT/US1998/017806 WO1999010257A1 (en) 1997-08-28 1998-08-27 Wafer handler for multi-station tool

Publications (1)

Publication Number Publication Date
DE19882662T1 true DE19882662T1 (de) 2000-08-03

Family

ID=22012315

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19882662T Ceased DE19882662T1 (de) 1997-08-28 1998-08-27 Wafertransportvorrichtung für Mehrstationswerkzeug

Country Status (6)

Country Link
US (1) US6048162A (de)
JP (1) JP2001514439A (de)
KR (1) KR20010023014A (de)
DE (1) DE19882662T1 (de)
GB (1) GB2343672B (de)
WO (1) WO1999010257A1 (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW401582B (en) * 1997-05-15 2000-08-11 Tokyo Electorn Limtied Apparatus for and method of transferring substrates
US6244121B1 (en) * 1998-03-06 2001-06-12 Applied Materials, Inc. Sensor device for non-intrusive diagnosis of a semiconductor processing system
US6073828A (en) * 1998-06-30 2000-06-13 Lam Research Corporation End effector for substrate handling and method for making the same
US6450755B1 (en) 1998-07-10 2002-09-17 Equipe Technologies Dual arm substrate handling robot with a batch loader
JP3863671B2 (ja) * 1998-07-25 2006-12-27 株式会社ダイヘン 搬送用ロボット装置
KR100655007B1 (ko) * 1999-01-12 2006-12-07 동경 엘렉트론 주식회사 진공처리장치
US6415802B1 (en) * 2000-05-05 2002-07-09 Cd Holdings, Inc. Acid etching machine
US6585478B1 (en) * 2000-11-07 2003-07-01 Asm America, Inc. Semiconductor handling robot with improved paddle-type end effector
EP1610927A2 (de) * 2002-12-13 2006-01-04 Recif Gerät zur handhabung von halbleiterscheiben zum durchqueren einer öffnung bei nutzung der verschlussvorrichtung der öffnung
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
EP1684951B1 (de) * 2003-11-10 2014-05-07 Brooks Automation, Inc. System zur handhabung von werkstücken in einem halbleiterhandhabungssystem auf vakuumbasis
US7458763B2 (en) 2003-11-10 2008-12-02 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system
US20070269297A1 (en) 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
KR100595135B1 (ko) * 2004-12-29 2006-06-30 동부일렉트로닉스 주식회사 두 개의 웨이퍼 이송용 모듈을 갖는 웨이퍼 이송장치
US7690881B2 (en) * 2006-08-30 2010-04-06 Asm Japan K.K. Substrate-processing apparatus with buffer mechanism and substrate-transferring apparatus
US8950998B2 (en) * 2007-02-27 2015-02-10 Brooks Automation, Inc. Batch substrate handling
US9117870B2 (en) * 2008-03-27 2015-08-25 Lam Research Corporation High throughput cleaner chamber
US20100147396A1 (en) * 2008-12-15 2010-06-17 Asm Japan K.K. Multiple-Substrate Transfer Apparatus and Multiple-Substrate Processing Apparatus
US8562272B2 (en) * 2010-02-16 2013-10-22 Lam Research Corporation Substrate load and unload mechanisms for high throughput
US8282698B2 (en) * 2010-03-24 2012-10-09 Lam Research Corporation Reduction of particle contamination produced by moving mechanisms in a process tool
US8893642B2 (en) 2010-03-24 2014-11-25 Lam Research Corporation Airflow management for low particulate count in a process tool
US20120136472A1 (en) * 2010-11-25 2012-05-31 Li Yan-Ze Dual-arm type robotic arm and its method of transporting panels
US9214369B2 (en) * 2013-11-01 2015-12-15 Varian Semiconductor Equipment Associates, Inc. Dynamic pitch substrate lift
KR102181121B1 (ko) * 2016-09-20 2020-11-20 주식회사 원익아이피에스 기판 이송 장치 및 기판 이송 장치의 제어 방법
JP6991243B2 (ja) 2017-04-20 2022-01-12 ダイフク アメリカ コーポレイション 高密度ストッカ
US10943805B2 (en) 2018-05-18 2021-03-09 Applied Materials, Inc. Multi-blade robot apparatus, electronic device manufacturing apparatus, and methods adapted to transport multiple substrates in electronic device manufacturing
KR20200057161A (ko) 2018-11-15 2020-05-26 주식회사 쎄믹스 웨이퍼 보관이 가능한 웨이퍼 프로버용 로더
US11276593B2 (en) 2019-07-22 2022-03-15 Rorze Automation, Inc. Systems and methods for horizontal wafer packaging
CN111092039B (zh) * 2019-12-30 2022-04-15 武汉大学 一种晶片传输系统

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4909314A (en) * 1979-12-21 1990-03-20 Varian Associates, Inc. Apparatus for thermal treatment of a wafer in an evacuated environment
US4775281A (en) * 1986-12-02 1988-10-04 Teradyne, Inc. Apparatus and method for loading and unloading wafers
US4949783A (en) * 1988-05-18 1990-08-21 Veeco Instruments, Inc. Substrate transport and cooling apparatus and method for same
JP2808826B2 (ja) * 1990-05-25 1998-10-08 松下電器産業株式会社 基板の移し換え装置
US5192849A (en) * 1990-08-10 1993-03-09 Texas Instruments Incorporated Multipurpose low-thermal-mass chuck for semiconductor processing equipment
JPH0536809A (ja) * 1991-07-31 1993-02-12 Mitsubishi Electric Corp 半導体基板処理装置に於ける半導体基板搬送アーム
US5397212A (en) * 1992-02-21 1995-03-14 Ebara Corporation Robot with dust-free and maintenance-free actuators
US5404894A (en) * 1992-05-20 1995-04-11 Tokyo Electron Kabushiki Kaisha Conveyor apparatus
US5567267A (en) * 1992-11-20 1996-10-22 Tokyo Electron Limited Method of controlling temperature of susceptor
JP2913439B2 (ja) * 1993-03-18 1999-06-28 東京エレクトロン株式会社 移載装置及び移載方法
JP2969034B2 (ja) * 1993-06-18 1999-11-02 東京エレクトロン株式会社 搬送方法および搬送装置
US5590996A (en) * 1994-10-13 1997-01-07 Semitherm Wafer transfer apparatus
US5647724A (en) * 1995-10-27 1997-07-15 Brooks Automation Inc. Substrate transport apparatus with dual substrate holders

Also Published As

Publication number Publication date
US6048162A (en) 2000-04-11
GB0002672D0 (en) 2000-03-29
JP2001514439A (ja) 2001-09-11
GB2343672A (en) 2000-05-17
KR20010023014A (ko) 2001-03-26
WO1999010257A1 (en) 1999-03-04
GB2343672B (en) 2001-04-04

Similar Documents

Publication Publication Date Title
DE19882662T1 (de) Wafertransportvorrichtung für Mehrstationswerkzeug
DE69820355D1 (de) Poliervorrichtung für Halbleiterscheibe
DE69806578D1 (de) Waferhaltevorrichtung
DE69712561T2 (de) Vertikale Behälter für wafer
DE69834778D1 (de) Haltevorrichtung für Halbleiter
DE69924680T8 (de) Scheibentransfervorrichtung
DE60022221D1 (de) Apparat für die bearbeitung von halbleitern
DE69922319D1 (de) Werkstückübergabevorrichtung
DE69835234D1 (de) Behälter für staubfreie Gegenstände (FOUP)
DE69825458D1 (de) Speicheranordnung für wafer
DE69826204D1 (de) Werkzeughaltevorrichtung für werkzeugmaschinen
DE69927166T2 (de) Pneumatische übergabevorrichtung
DE59910443D1 (de) Bearbeitungsvorrichtung für Werkstücke
DE69527668D1 (de) Anschlussstelle für Halbleiterbauelement
DE59409425D1 (de) Umsetzeinrichtung für den Werkstücktransport
DE50005030D1 (de) Positioniervorrichtung für werkstückträger oder werkstücke
DE50008108D1 (de) Bearbeitungseinrichtung für plattenförmige werkstücke
DE60007248D1 (de) Werkzeugtransfervorrichtung für Werkzeugmaschinen
DE59801477D1 (de) Spanneinrichtung für werkstücke
DE69939827D1 (de) Beschichtungshaltevorrichtung für wafer
DE69826062D1 (de) Montierungsverfahren für eine Halbleiteranordnung
DE69730805D1 (de) Übergabestation für Gegenstände
DE69711813T2 (de) Transfereinrichtung für Werkzeugmaschinen
DE69804161T2 (de) Bauteil für Halbleiterapparatur
DE69529386D1 (de) Verbesserungen für Halbleiteranordnungen

Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8125 Change of the main classification

Ipc: B25J 9/06

8607 Notification of search results after publication
8131 Rejection