JP5024422B2 - 搬送システム - Google Patents
搬送システム Download PDFInfo
- Publication number
- JP5024422B2 JP5024422B2 JP2010106273A JP2010106273A JP5024422B2 JP 5024422 B2 JP5024422 B2 JP 5024422B2 JP 2010106273 A JP2010106273 A JP 2010106273A JP 2010106273 A JP2010106273 A JP 2010106273A JP 5024422 B2 JP5024422 B2 JP 5024422B2
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- Prior art keywords
- opener
- case
- manufacturing apparatus
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- transporter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 claims description 74
- 230000003287 optical effect Effects 0.000 claims description 31
- 238000004891 communication Methods 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 8
- 230000032258 transport Effects 0.000 description 38
- 238000012546 transfer Methods 0.000 description 9
- 239000000725 suspension Substances 0.000 description 5
- 238000012790 confirmation Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67733—Overhead conveying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
本発明の第1実施形態にかかる搬送システムについて説明する。図1は、本実施形態における搬送システムの概略斜視図であり、この図に基づいて説明する。
本発明の第2実施形態について説明する。本実施形態の搬送システムは、上記第1実施形態に対して、製造装置およびオープナ20を複数含むようにしたものであり、その他に関しては第1実施形態と同様であるため、ここでは説明を省略する。図3は、本実施形態における搬送システムの概略斜視図である。
上記第1実施形態では、搬送機40としてOHTであるものを例に挙げて説明したが、もちろんこれに限定されるものではなく、例えば、搬送機40として、工場等の床に設置されたレールを走行するRGV(Rail Guided Vehicle)や、工場等の床に備えられたガイドテープ等を追従するAGV(Automated Guided Vehicle)等とすることも可能である。
20 オープナ
21 オープナ制御盤
30 ケース
40 搬送機
42 光通信器
50 レール
51 光通信器
Claims (2)
- 被搬送物に対して所定の処理を施す製造装置(10、70〜90)と、ケース(30)に収容された被搬送物を搬送する搬送機(40)と、前記製造装置(10、70〜90)に備えられ、前記搬送機(40)から前記ケース(30)が載置されるオープナ(20)と、を含む搬送システムであって、
前記オープナ(20)は、前記搬送機(40)との間で信号の送受信を行うことにより、前記ケース(30)の昇降を制御するオープナ制御盤(21)を備えており、
前記搬送機(40)は、前記オープナ制御盤(21)と信号の送受信を行うことにより、前記ケース(30)を前記オープナ(20)に載置することを特徴とする搬送システム。 - 前記搬送機(40)は、光通信器(42)を備え、前記オープナ(20)の直上を含む位置に備えられたレール(50)を走行するものであり、
前記レール(50)には、前記光通信器(42)と信号の送受信が可能とされていると共に、前記オープナ制御盤(21)と信号の送受信が可能とされている光通信器(51)が備えられており、
前記搬送機(40)は、前記レール(50)に備えられた光通信器(51)を介して前記オープナ制御盤(21)と信号の送受信を行うことにより、前記ケース(30)を前記オープナ(20)に載置することを特徴とする請求項1に記載の搬送システム。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010106273A JP5024422B2 (ja) | 2010-05-06 | 2010-05-06 | 搬送システム |
US13/049,059 US8620469B2 (en) | 2010-05-06 | 2011-03-16 | Carrier system and method for handling carried object using the same |
TW100109708A TWI437657B (zh) | 2010-05-06 | 2011-03-22 | 搬運系統 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010106273A JP5024422B2 (ja) | 2010-05-06 | 2010-05-06 | 搬送システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011238646A JP2011238646A (ja) | 2011-11-24 |
JP5024422B2 true JP5024422B2 (ja) | 2012-09-12 |
Family
ID=44902038
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010106273A Active JP5024422B2 (ja) | 2010-05-06 | 2010-05-06 | 搬送システム |
Country Status (3)
Country | Link |
---|---|
US (1) | US8620469B2 (ja) |
JP (1) | JP5024422B2 (ja) |
TW (1) | TWI437657B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5676294B2 (ja) * | 2011-02-07 | 2015-02-25 | 東洋電機株式会社 | 空間光伝送装置 |
US8881297B2 (en) * | 2012-09-06 | 2014-11-04 | Brooks Automation, Inc. | Access arbitration module and system for semiconductor fabrication equipment and methods for using and operating the same |
JP2023035305A (ja) * | 2021-09-01 | 2023-03-13 | 村田機械株式会社 | 搬送システム |
JP2023059083A (ja) * | 2021-10-14 | 2023-04-26 | 北陽電機株式会社 | 通信システム、光伝送装置および通信方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2874559B2 (ja) | 1994-06-10 | 1999-03-24 | 株式会社豊田自動織機製作所 | 移載通信装置における台車側移載装置の制御方法 |
JP3614312B2 (ja) | 1998-11-20 | 2005-01-26 | 株式会社リコー | 画像形成装置 |
WO2000033376A1 (fr) * | 1998-12-02 | 2000-06-08 | Dainichi Shoji K.K. | Contenant |
JP3917777B2 (ja) | 1999-04-12 | 2007-05-23 | 村田機械株式会社 | 光データ伝送装置 |
JP2004031579A (ja) * | 2002-06-25 | 2004-01-29 | Renesas Technology Corp | 半導体製造システムの制御装置 |
JP3982395B2 (ja) * | 2002-11-25 | 2007-09-26 | 株式会社安川電機 | ロードポート |
US7074000B2 (en) * | 2002-12-31 | 2006-07-11 | Applied Materials, Inc. | Method and apparatus for undocking substrate pod with door status check |
JP4442096B2 (ja) * | 2003-01-24 | 2010-03-31 | 株式会社安川電機 | Foupロードポート制御方法および制御装置 |
JP4221603B2 (ja) * | 2005-03-31 | 2009-02-12 | 村田機械株式会社 | 天井走行車システム |
JP2008311419A (ja) * | 2007-06-14 | 2008-12-25 | Hitachi High-Tech Control Systems Corp | ロードポート装置及びウェーハ状態修正方法 |
-
2010
- 2010-05-06 JP JP2010106273A patent/JP5024422B2/ja active Active
-
2011
- 2011-03-16 US US13/049,059 patent/US8620469B2/en active Active
- 2011-03-22 TW TW100109708A patent/TWI437657B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW201206809A (en) | 2012-02-16 |
JP2011238646A (ja) | 2011-11-24 |
US20110274521A1 (en) | 2011-11-10 |
US8620469B2 (en) | 2013-12-31 |
TWI437657B (zh) | 2014-05-11 |
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