DE69829018D1 - Substrat und Verfahren zu dessen Herstellung - Google Patents
Substrat und Verfahren zu dessen HerstellungInfo
- Publication number
- DE69829018D1 DE69829018D1 DE69829018T DE69829018T DE69829018D1 DE 69829018 D1 DE69829018 D1 DE 69829018D1 DE 69829018 T DE69829018 T DE 69829018T DE 69829018 T DE69829018 T DE 69829018T DE 69829018 D1 DE69829018 D1 DE 69829018D1
- Authority
- DE
- Germany
- Prior art keywords
- substrate
- preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9335—Product by special process
- Y10S428/934—Electrical process
- Y10S428/935—Electroplating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9335—Product by special process
- Y10S428/936—Chemical deposition, e.g. electroless plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12944—Ni-base component
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15223697 | 1997-06-10 | ||
JP15223697 | 1997-06-10 | ||
JP6123398 | 1998-03-12 | ||
JP6123498 | 1998-03-12 | ||
JP6123498 | 1998-03-12 | ||
JP6123398 | 1998-03-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69829018D1 true DE69829018D1 (de) | 2005-03-24 |
DE69829018T2 DE69829018T2 (de) | 2006-03-23 |
Family
ID=27297433
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69829018T Expired - Lifetime DE69829018T2 (de) | 1997-06-10 | 1998-06-09 | Substrat und Verfahren zu dessen Herstellung |
Country Status (3)
Country | Link |
---|---|
US (1) | US6127052A (de) |
EP (1) | EP0884934B1 (de) |
DE (1) | DE69829018T2 (de) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6695458B2 (en) * | 2000-09-12 | 2004-02-24 | Canon Kabushiki Kaisha | High-reflectance silver mirror and reflecting optical element |
WO2002032199A1 (de) * | 2000-10-13 | 2002-04-18 | Ppc Electronic Ag | Leiterplatte sowie verfahren zum herstellen einer solchen leiterplatte und eines schichtverbundmaterials für eine solche leiterplatte |
SG98017A1 (en) * | 2000-12-19 | 2003-08-20 | Inst Materials Research & Eng | Method of forming selective electronics plating on polymer surfaces |
US7569132B2 (en) | 2001-10-02 | 2009-08-04 | Henkel Kgaa | Process for anodically coating an aluminum substrate with ceramic oxides prior to polytetrafluoroethylene or silicone coating |
US7820300B2 (en) * | 2001-10-02 | 2010-10-26 | Henkel Ag & Co. Kgaa | Article of manufacture and process for anodically coating an aluminum substrate with ceramic oxides prior to organic or inorganic coating |
US7578921B2 (en) * | 2001-10-02 | 2009-08-25 | Henkel Kgaa | Process for anodically coating aluminum and/or titanium with ceramic oxides |
US7452454B2 (en) | 2001-10-02 | 2008-11-18 | Henkel Kgaa | Anodized coating over aluminum and aluminum alloy coated substrates |
JP2003146704A (ja) * | 2001-11-09 | 2003-05-21 | Nippon Sheet Glass Co Ltd | 情報記録媒体用ガラス基板の化学強化処理装置 |
US20030159941A1 (en) * | 2002-02-11 | 2003-08-28 | Applied Materials, Inc. | Additives for electroplating solution |
JP4539282B2 (ja) * | 2004-04-16 | 2010-09-08 | 富士電機デバイステクノロジー株式会社 | 垂直磁気記録媒体用ディスク基板及びそれを用いた垂直磁気記録媒体 |
US20060210837A1 (en) * | 2004-04-16 | 2006-09-21 | Fuji Electric Device | Method of plating on a glass base plate, a method of manufacturing a disk substrate for a perpendicular magnetic recording medium, a disk substrate for a perpendicular magnetic recording medium, and a perpendicular magnetic recording medium |
JP4475026B2 (ja) * | 2004-06-11 | 2010-06-09 | 富士電機デバイステクノロジー株式会社 | 無電解めっき方法、磁気記録媒体および磁気記録装置 |
JP4479528B2 (ja) * | 2004-07-27 | 2010-06-09 | 富士電機デバイステクノロジー株式会社 | ガラス基体へのめっき方法、そのめっき方法を用いる磁気記録媒体用ディスク基板の製造方法及び垂直磁気記録媒体の製造方法 |
JP4479493B2 (ja) * | 2004-12-14 | 2010-06-09 | 富士電機デバイステクノロジー株式会社 | ガラス基板へのめっき方法及びそれを用いた磁気記録媒体の製造方法 |
JP4479571B2 (ja) * | 2005-04-08 | 2010-06-09 | 富士電機デバイステクノロジー株式会社 | 磁気記録媒体の製造方法 |
GB0518613D0 (en) * | 2005-09-13 | 2005-10-19 | Eastman Kodak Co | Method of forming conductive tracks |
US20080136019A1 (en) * | 2006-12-11 | 2008-06-12 | Johnson Michael E | Solder Bump/Under Bump Metallurgy Structure for High Temperature Applications |
DE102006060634A1 (de) | 2006-12-21 | 2008-06-26 | Robert Bosch Gmbh | Verfahren zur Herstellung eines elektrischen Widerstands auf einem Substrat |
JP4706690B2 (ja) * | 2007-11-05 | 2011-06-22 | パナソニック電工株式会社 | 回路基板及びその製造方法 |
US9701177B2 (en) | 2009-04-02 | 2017-07-11 | Henkel Ag & Co. Kgaa | Ceramic coated automotive heat exchanger components |
TWI396771B (zh) * | 2009-08-25 | 2013-05-21 | 羅門哈斯電子材料有限公司 | 形成矽化鎳之強化方法 |
US20120086101A1 (en) * | 2010-10-06 | 2012-04-12 | International Business Machines Corporation | Integrated circuit and interconnect, and method of fabricating same |
KR101897013B1 (ko) * | 2011-12-08 | 2018-10-29 | 엘지이노텍 주식회사 | 인쇄회로기판 및 이의 제조 방법 |
JP2017028079A (ja) * | 2015-07-22 | 2017-02-02 | イビデン株式会社 | プリント配線板の製造方法およびプリント配線板 |
US9603258B2 (en) * | 2015-08-05 | 2017-03-21 | Uyemura International Corporation | Composition and method for electroless plating of palladium phosphorus on copper, and a coated component therefrom |
CN110024213A (zh) | 2016-11-25 | 2019-07-16 | 古河电气工业株式会社 | 传输线路 |
CN110219009B (zh) * | 2019-07-26 | 2021-07-16 | 阜阳市路兴公路工程检测有限公司 | 一种中性环保五金清洗剂及其制备方法 |
JP7160024B2 (ja) * | 2019-12-20 | 2022-10-25 | 株式会社村田製作所 | 電子部品 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3162512A (en) * | 1961-03-21 | 1964-12-22 | Engelhard Ind Inc | Immersion plating with noble metals and the product thereof |
GB1030545A (en) * | 1964-04-28 | 1966-05-25 | Int Nickel Ltd | Process and solutions for coating metals and alloys |
US3664860A (en) * | 1968-12-06 | 1972-05-23 | Nihon Kagaku Kizai Kk | Electrolessly nickel plating on a non-metallic basis material |
NL7204641A (de) * | 1972-04-07 | 1973-10-09 | ||
JPS5428831B2 (de) * | 1973-05-18 | 1979-09-19 | ||
US4259409A (en) * | 1980-03-06 | 1981-03-31 | Ses, Incorporated | Electroless plating process for glass or ceramic bodies and product |
JPS6041867B2 (ja) * | 1980-09-25 | 1985-09-19 | 京セラ株式会社 | 多金属層を有する電子部品 |
US4849303A (en) * | 1986-07-01 | 1989-07-18 | E. I. Du Pont De Nemours And Company | Alloy coatings for electrical contacts |
JPH0417211A (ja) * | 1990-05-09 | 1992-01-22 | Akira Fujishima | 絶縁体への導電性層形成法 |
US5206055A (en) * | 1991-09-03 | 1993-04-27 | General Electric Company | Method for enhancing the uniform electroless deposition of gold onto a palladium substrate |
JPH0661619A (ja) * | 1992-05-29 | 1994-03-04 | Akira Fujishima | 回路基板の製造方法 |
JP2785102B2 (ja) * | 1994-03-31 | 1998-08-13 | 株式会社ジャパンエナジー | 無電解金めっき方法 |
JPH08227656A (ja) * | 1995-02-20 | 1996-09-03 | Merutetsukusu Kk | プラズマディスプレイの導電パターン形成方法 |
JPH08271869A (ja) * | 1995-03-30 | 1996-10-18 | Kyocera Corp | 液晶表示パネルの製造方法 |
-
1998
- 1998-06-09 DE DE69829018T patent/DE69829018T2/de not_active Expired - Lifetime
- 1998-06-09 EP EP98304561A patent/EP0884934B1/de not_active Expired - Lifetime
- 1998-06-09 US US09/093,351 patent/US6127052A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0884934A3 (de) | 2000-03-15 |
DE69829018T2 (de) | 2006-03-23 |
US6127052A (en) | 2000-10-03 |
EP0884934A2 (de) | 1998-12-16 |
EP0884934B1 (de) | 2005-02-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |