DE69826370T2 - Silikongel-Zusammensetzung zur Versiegelung und Füllung von elektrischen und elektronischen Bauelementen - Google Patents
Silikongel-Zusammensetzung zur Versiegelung und Füllung von elektrischen und elektronischen Bauelementen Download PDFInfo
- Publication number
- DE69826370T2 DE69826370T2 DE69826370T DE69826370T DE69826370T2 DE 69826370 T2 DE69826370 T2 DE 69826370T2 DE 69826370 T DE69826370 T DE 69826370T DE 69826370 T DE69826370 T DE 69826370T DE 69826370 T2 DE69826370 T2 DE 69826370T2
- Authority
- DE
- Germany
- Prior art keywords
- component
- organopolysiloxane
- silicon
- groups
- hydrogen atoms
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920001296 polysiloxane Polymers 0.000 title claims description 121
- 239000000203 mixture Substances 0.000 title claims description 80
- 238000007789 sealing Methods 0.000 title claims description 13
- -1 diamine compound Chemical class 0.000 claims description 34
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 33
- 229920005645 diorganopolysiloxane polymer Polymers 0.000 claims description 31
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 26
- 125000003342 alkenyl group Chemical group 0.000 claims description 22
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 19
- 125000000217 alkyl group Chemical group 0.000 claims description 13
- 239000000377 silicon dioxide Substances 0.000 claims description 12
- 239000003054 catalyst Substances 0.000 claims description 10
- 229910052697 platinum Inorganic materials 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 9
- 125000004432 carbon atom Chemical group C* 0.000 claims description 7
- 238000006459 hydrosilylation reaction Methods 0.000 claims description 7
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 125000002947 alkylene group Chemical group 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 claims description 3
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 1
- 239000000499 gel Substances 0.000 description 82
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 15
- 239000007789 gas Substances 0.000 description 12
- 239000000945 filler Substances 0.000 description 11
- 229920000642 polymer Polymers 0.000 description 10
- 239000000565 sealant Substances 0.000 description 10
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 6
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 6
- 239000003063 flame retardant Substances 0.000 description 6
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 6
- 239000004205 dimethyl polysiloxane Substances 0.000 description 5
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 5
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 5
- 238000002485 combustion reaction Methods 0.000 description 4
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 4
- 150000002430 hydrocarbons Chemical group 0.000 description 4
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 125000006038 hexenyl group Chemical group 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 125000003944 tolyl group Chemical group 0.000 description 3
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 2
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 2
- 125000005375 organosiloxane group Chemical group 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- 235000009781 Myrtillocactus geometrizans Nutrition 0.000 description 1
- 240000009125 Myrtillocactus geometrizans Species 0.000 description 1
- 229910004283 SiO 4 Inorganic materials 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 125000005677 ethinylene group Chemical group [*:2]C#C[*:1] 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000005055 methyl trichlorosilane Substances 0.000 description 1
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 description 1
- PWNDYKKNXVKQJO-UHFFFAOYSA-N n',n'-dibutylethane-1,2-diamine Chemical compound CCCCN(CCN)CCCC PWNDYKKNXVKQJO-UHFFFAOYSA-N 0.000 description 1
- UDGSVBYJWHOHNN-UHFFFAOYSA-N n',n'-diethylethane-1,2-diamine Chemical compound CCN(CC)CCN UDGSVBYJWHOHNN-UHFFFAOYSA-N 0.000 description 1
- DILRJUIACXKSQE-UHFFFAOYSA-N n',n'-dimethylethane-1,2-diamine Chemical compound CN(C)CCN DILRJUIACXKSQE-UHFFFAOYSA-N 0.000 description 1
- DIHKMUNUGQVFES-UHFFFAOYSA-N n,n,n',n'-tetraethylethane-1,2-diamine Chemical compound CCN(CC)CCN(CC)CC DIHKMUNUGQVFES-UHFFFAOYSA-N 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- 150000003961 organosilicon compounds Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000012763 reinforcing filler Substances 0.000 description 1
- 150000004819 silanols Chemical class 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Silicon Polymers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20086197A JP3765444B2 (ja) | 1997-07-10 | 1997-07-10 | 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル |
| JP20086197 | 1997-07-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69826370D1 DE69826370D1 (de) | 2004-10-28 |
| DE69826370T2 true DE69826370T2 (de) | 2005-09-29 |
Family
ID=16431450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69826370T Expired - Lifetime DE69826370T2 (de) | 1997-07-10 | 1998-07-08 | Silikongel-Zusammensetzung zur Versiegelung und Füllung von elektrischen und elektronischen Bauelementen |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6001918A (enExample) |
| EP (1) | EP0890617B1 (enExample) |
| JP (1) | JP3765444B2 (enExample) |
| DE (1) | DE69826370T2 (enExample) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3746394B2 (ja) * | 1999-04-14 | 2006-02-15 | 東レ・ダウコーニング株式会社 | シリコーンゲル組成物 |
| US6458461B1 (en) | 2000-12-06 | 2002-10-01 | Lexmark International, Inc | Release agent composition |
| JP4530137B2 (ja) | 2003-09-17 | 2010-08-25 | 信越化学工業株式会社 | 精密電子部品封止・シール用オルガノポリシロキサン組成物、精密電子部品の腐蝕防止又は遅延方法、並びに銀含有精密電子部品 |
| JP4908736B2 (ja) * | 2003-10-01 | 2012-04-04 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
| US7767754B2 (en) * | 2005-11-08 | 2010-08-03 | Momentive Performance Materials Inc. | Silicone composition and process of making same |
| BRPI0621973A2 (pt) * | 2006-12-18 | 2014-04-29 | Lg Electronics Inc | Componentes eletrônicos |
| JP2009054983A (ja) * | 2007-01-17 | 2009-03-12 | Mitsubishi Pencil Co Ltd | 電波吸収材およびその製造方法 |
| WO2009044960A1 (en) * | 2007-10-02 | 2009-04-09 | Cheil Industries Inc. | Gap-filling composition with excellent shelf life by end-capping |
| JP2009191119A (ja) * | 2008-02-13 | 2009-08-27 | Kaneka Corp | シリコーン系重合体粒子を含有するシリコーン系硬化性組成物 |
| WO2012053526A1 (ja) * | 2010-10-20 | 2012-04-26 | 旭化成イーマテリアルズ株式会社 | 酸化物ナノ粒子反応生成物及びシリコーン組成物 |
| EP2733178A4 (en) * | 2011-07-14 | 2015-03-04 | Sekisui Chemical Co Ltd | SEALANT FOR OPTICAL SEMICONDUCTOR COMPONENTS AND OPTICAL SEMICONDUCTOR ELEMENT |
| WO2013052838A1 (en) | 2011-10-06 | 2013-04-11 | Dow Corning Corporation | Method of forming a gel having improved thermal stability |
| CN103946313B (zh) * | 2011-10-06 | 2016-11-09 | 道康宁公司 | 具有改善的热稳定性的凝胶 |
| JP5983519B2 (ja) * | 2012-04-24 | 2016-08-31 | 信越化学工業株式会社 | ウエハ加工体、ウエハ加工用部材、ウエハ加工用仮接着材、及び薄型ウエハの製造方法 |
| JP5975528B2 (ja) * | 2012-10-11 | 2016-08-23 | 信越化学工業株式会社 | ウエハ加工体、ウエハ加工用部材、ウエハ加工用仮接着材、及び薄型ウエハの製造方法 |
| JP6213257B2 (ja) * | 2013-01-25 | 2017-10-18 | セントラル硝子株式会社 | シリコーンを含む硬化性組成物およびその硬化物 |
| WO2014160112A1 (en) | 2013-03-14 | 2014-10-02 | Dow Corning Corporation | Metal thermal stabilization of polydiethylsiloxane and copolymers thereof |
| WO2015034029A1 (en) * | 2013-09-03 | 2015-03-12 | Dow Corning Toray Co., Ltd. | Silicone gel composition and use thereof |
| CN106103594B (zh) | 2014-01-27 | 2019-06-28 | 陶氏东丽株式会社 | 有机硅凝胶组合物 |
| JP2015212318A (ja) * | 2014-05-01 | 2015-11-26 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物 |
| PL3239004T3 (pl) * | 2015-06-23 | 2019-04-30 | Pma/Tools Ag | Elastomer silikonowy, mieszanka i optyczny element łączący |
| US20250092283A1 (en) * | 2022-01-12 | 2025-03-20 | Shin-Etsu Chemical Co., Ltd. | Thixotropic silicone gel composition for spot potting, cured product thereof, and photocoupler |
| JP2024087720A (ja) * | 2022-12-19 | 2024-07-01 | 信越化学工業株式会社 | 導電性シリコーン組成物及びその製造方法、並びに、接着剤及び導電性シリコーン硬化物 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4340709A (en) * | 1980-07-16 | 1982-07-20 | General Electric Company | Addition curing silicone compositions |
| JPS587452A (ja) * | 1981-07-06 | 1983-01-17 | ダウ コ−ニング コ−ポレ−ション | 硬化性シロキサン組成物 |
| JPS59204259A (ja) * | 1983-05-06 | 1984-11-19 | Hitachi Ltd | 半導体装置の封止方法 |
| JPS6148945A (ja) * | 1984-08-16 | 1986-03-10 | Toshiba Corp | ハイプリツドｉｃモジユ−ル |
| US4584361A (en) * | 1985-06-03 | 1986-04-22 | Dow Corning Corporation | Storage stable, one part polyorganosiloxane compositions |
| JPS62104145A (ja) * | 1985-10-31 | 1987-05-14 | Mitsubishi Electric Corp | 半導体装置 |
| US4801642A (en) * | 1987-12-28 | 1989-01-31 | Dow Corning Corporation | Thermally stable organosiloxane compositions and method for preparing same |
| JPH0319269A (ja) * | 1989-06-15 | 1991-01-28 | Fujitsu Ltd | 半導体装置の製造方法 |
| US5334687A (en) * | 1989-09-08 | 1994-08-02 | Shin-Etsu Chemical Co., Ltd. | Organopolysiloxane composition |
| US5059649A (en) * | 1989-11-08 | 1991-10-22 | Dow Corning Corporation | Storage stable one-part fluorosilicone gel compositions exhibiting improved thermal stability |
| JP2582690B2 (ja) * | 1991-09-13 | 1997-02-19 | 信越化学工業株式会社 | 防振特性に優れたシリコーンゲル組成物 |
| JPH05204259A (ja) * | 1992-01-28 | 1993-08-13 | Sharp Corp | 電子写真装置 |
| US5270422A (en) * | 1992-07-02 | 1993-12-14 | Dow Corning Corporation | Curing catalyst compositions and method for preparing same |
| US5371162A (en) * | 1992-07-09 | 1994-12-06 | Minnesota Mining And Manufacturing Company | Storage-stable silicone composition |
| JP2864944B2 (ja) * | 1993-04-30 | 1999-03-08 | 信越化学工業株式会社 | 難燃性シリコーン組成物 |
-
1997
- 1997-07-10 JP JP20086197A patent/JP3765444B2/ja not_active Expired - Lifetime
-
1998
- 1998-07-06 US US09/110,633 patent/US6001918A/en not_active Expired - Lifetime
- 1998-07-08 DE DE69826370T patent/DE69826370T2/de not_active Expired - Lifetime
- 1998-07-08 EP EP98112629A patent/EP0890617B1/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP0890617A2 (en) | 1999-01-13 |
| JPH1129710A (ja) | 1999-02-02 |
| EP0890617B1 (en) | 2004-09-22 |
| US6001918A (en) | 1999-12-14 |
| DE69826370D1 (de) | 2004-10-28 |
| JP3765444B2 (ja) | 2006-04-12 |
| EP0890617A3 (en) | 2000-02-23 |
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