DE69826370D1 - Silikongel-Zusammensetzung zur Versiegelung und Füllung von elektrischen und elektronischen Bauelementen - Google Patents

Silikongel-Zusammensetzung zur Versiegelung und Füllung von elektrischen und elektronischen Bauelementen

Info

Publication number
DE69826370D1
DE69826370D1 DE69826370T DE69826370T DE69826370D1 DE 69826370 D1 DE69826370 D1 DE 69826370D1 DE 69826370 T DE69826370 T DE 69826370T DE 69826370 T DE69826370 T DE 69826370T DE 69826370 D1 DE69826370 D1 DE 69826370D1
Authority
DE
Germany
Prior art keywords
sealing
electronic components
gel composition
silicone gel
filling electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69826370T
Other languages
English (en)
Other versions
DE69826370T2 (de
Inventor
Hiroji Enami
Yuji Hamada
Akihiro Nakamura
Takeashi Tsaiki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Silicone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Silicone Co Ltd filed Critical Dow Corning Toray Silicone Co Ltd
Publication of DE69826370D1 publication Critical patent/DE69826370D1/de
Application granted granted Critical
Publication of DE69826370T2 publication Critical patent/DE69826370T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Silicon Polymers (AREA)
DE69826370T 1997-07-10 1998-07-08 Silikongel-Zusammensetzung zur Versiegelung und Füllung von elektrischen und elektronischen Bauelementen Expired - Lifetime DE69826370T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP20086197A JP3765444B2 (ja) 1997-07-10 1997-07-10 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル
JP20086197 1997-07-10

Publications (2)

Publication Number Publication Date
DE69826370D1 true DE69826370D1 (de) 2004-10-28
DE69826370T2 DE69826370T2 (de) 2005-09-29

Family

ID=16431450

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69826370T Expired - Lifetime DE69826370T2 (de) 1997-07-10 1998-07-08 Silikongel-Zusammensetzung zur Versiegelung und Füllung von elektrischen und elektronischen Bauelementen

Country Status (4)

Country Link
US (1) US6001918A (de)
EP (1) EP0890617B1 (de)
JP (1) JP3765444B2 (de)
DE (1) DE69826370T2 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3746394B2 (ja) * 1999-04-14 2006-02-15 東レ・ダウコーニング株式会社 シリコーンゲル組成物
US6458461B1 (en) 2000-12-06 2002-10-01 Lexmark International, Inc Release agent composition
JP4530137B2 (ja) 2003-09-17 2010-08-25 信越化学工業株式会社 精密電子部品封止・シール用オルガノポリシロキサン組成物、精密電子部品の腐蝕防止又は遅延方法、並びに銀含有精密電子部品
JP4908736B2 (ja) * 2003-10-01 2012-04-04 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
US7767754B2 (en) * 2005-11-08 2010-08-03 Momentive Performance Materials Inc. Silicone composition and process of making same
WO2008075802A1 (en) * 2006-12-18 2008-06-26 Lg Electronics Inc. Electronic parts
JP2009054983A (ja) * 2007-01-17 2009-03-12 Mitsubishi Pencil Co Ltd 電波吸収材およびその製造方法
WO2009044960A1 (en) * 2007-10-02 2009-04-09 Cheil Industries Inc. Gap-filling composition with excellent shelf life by end-capping
JP2009191119A (ja) * 2008-02-13 2009-08-27 Kaneka Corp シリコーン系重合体粒子を含有するシリコーン系硬化性組成物
WO2012053526A1 (ja) * 2010-10-20 2012-04-26 旭化成イーマテリアルズ株式会社 酸化物ナノ粒子反応生成物及びシリコーン組成物
JPWO2013008842A1 (ja) * 2011-07-14 2015-02-23 積水化学工業株式会社 光半導体装置用封止剤及び光半導体装置
JP6285359B2 (ja) 2011-10-06 2018-02-28 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ 改善された熱安定性を有するゲルを形成する方法
US20140291872A1 (en) 2011-10-06 2014-10-02 Dow Corning Corporation Gel Having Improved Thermal Stability
US9096032B2 (en) * 2012-04-24 2015-08-04 Shin-Etsu Chemical Co., Ltd. Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method
JP5975528B2 (ja) * 2012-10-11 2016-08-23 信越化学工業株式会社 ウエハ加工体、ウエハ加工用部材、ウエハ加工用仮接着材、及び薄型ウエハの製造方法
JP6213257B2 (ja) * 2013-01-25 2017-10-18 セントラル硝子株式会社 シリコーンを含む硬化性組成物およびその硬化物
WO2014160112A1 (en) 2013-03-14 2014-10-02 Dow Corning Corporation Metal thermal stabilization of polydiethylsiloxane and copolymers thereof
CN105612219B (zh) * 2013-09-03 2018-12-14 道康宁东丽株式会社 有机硅凝胶组合物及其用途
US10155852B2 (en) 2014-01-27 2018-12-18 Dow Corning Toray Co., Ltd. Silicone gel composition
JP2015212318A (ja) * 2014-05-01 2015-11-26 信越化学工業株式会社 熱伝導性シリコーン組成物
PL3239004T3 (pl) * 2015-06-23 2019-04-30 Pma/Tools Ag Elastomer silikonowy, mieszanka i optyczny element łączący
WO2023136188A1 (ja) * 2022-01-12 2023-07-20 信越化学工業株式会社 スポットポッティング用チキソ性シリコーンゲル組成物及びその硬化物並びにフォトカプラ

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4340709A (en) * 1980-07-16 1982-07-20 General Electric Company Addition curing silicone compositions
JPS587452A (ja) * 1981-07-06 1983-01-17 ダウ　コ−ニング　コ−ポレ−ション 硬化性シロキサン組成物
JPS59204259A (ja) * 1983-05-06 1984-11-19 Hitachi Ltd 半導体装置の封止方法
JPS6148945A (ja) * 1984-08-16 1986-03-10 Toshiba Corp ハイプリツドｉｃモジユ−ル
US4584361A (en) * 1985-06-03 1986-04-22 Dow Corning Corporation Storage stable, one part polyorganosiloxane compositions
JPS62104145A (ja) * 1985-10-31 1987-05-14 Mitsubishi Electric Corp 半導体装置
US4801642A (en) * 1987-12-28 1989-01-31 Dow Corning Corporation Thermally stable organosiloxane compositions and method for preparing same
JPH0319269A (ja) * 1989-06-15 1991-01-28 Fujitsu Ltd 半導体装置の製造方法
US5334687A (en) * 1989-09-08 1994-08-02 Shin-Etsu Chemical Co., Ltd. Organopolysiloxane composition
US5059649A (en) * 1989-11-08 1991-10-22 Dow Corning Corporation Storage stable one-part fluorosilicone gel compositions exhibiting improved thermal stability
JP2582690B2 (ja) * 1991-09-13 1997-02-19 信越化学工業株式会社 防振特性に優れたシリコーンゲル組成物
JPH05204259A (ja) * 1992-01-28 1993-08-13 Sharp Corp 電子写真装置
US5270422A (en) * 1992-07-02 1993-12-14 Dow Corning Corporation Curing catalyst compositions and method for preparing same
US5371162A (en) * 1992-07-09 1994-12-06 Minnesota Mining And Manufacturing Company Storage-stable silicone composition
JP2864944B2 (ja) * 1993-04-30 1999-03-08 信越化学工業株式会社 難燃性シリコーン組成物

Also Published As

Publication number Publication date
EP0890617A2 (de) 1999-01-13
EP0890617B1 (de) 2004-09-22
JP3765444B2 (ja) 2006-04-12
US6001918A (en) 1999-12-14
JPH1129710A (ja) 1999-02-02
DE69826370T2 (de) 2005-09-29
EP0890617A3 (de) 2000-02-23

Similar Documents

Publication Publication Date Title
DE69826370D1 (de) Silikongel-Zusammensetzung zur Versiegelung und Füllung von elektrischen und elektronischen Bauelementen
DE60001676D1 (de) Silikongelzusammensetzung und daraus hergestelltes Silikongel
DE69629305D1 (de) Hermetisch abgedichtete elektrische durchführung zur verwendung bei implantierbaren elektronischen vorrichtungen
DE69801273T2 (de) Verfahren und gerät zur kühlung von elektrischen bauelementen
HK1032241A1 (en) Silicone oligomers and curable compositions containing same
DE69835148D1 (de) Chirurgische clips und klemmen
DE69824363D1 (de) Härtbare Siliconzusammensetzung und elektronische Bauteile
DE69815874D1 (de) Pulverfüllvorrichtung und -verfahren
DE69701003D1 (de) Durchsichtige Silikongele
DE69937083D1 (de) Wasserdichter Verbinder und Abdichtungsverfahren
DE69820226T2 (de) Elektrooptische vorrichtung und elektronisches gerät
DE69528897D1 (de) Elektrische bauelemente
DE69919770D1 (de) Stromschienen-Anordnung und elektrische Durchführung
ID26510A (id) Komposisi pembentuk gel dielektrik, penggunaannya, kabel dc listrik terisolasi yang mengandung komposisi tersebut dan metode pembuatan kabel tersebut
DE59802426D1 (de) Wärmeableitendes gehäuse zur aufnahme von elektrischen oder elektronischen bauteilen
ATA25096A (de) Kühlkörper für elektrische und elektronische bauelemente
DE69807625D1 (de) Hydrosilylierungskatalysator und dieser enthaltende Silikon-Zusammensetzungen
DE69941759D1 (de) Versorgungszuführvorrichtung von elektrischen Bauelementen
DE69521383T2 (de) Zusammensetzungen enthaltend Polydimethylsiloxan und Polyisobutylen mit endständigen Epoxygruppen
AU4234297A (en) Medical electrical lead and reinforced silicone elastomer compositions used therein
DE69836786D1 (de) Speicherschnittstellenvorrichtung und Vorrichtung zur Speicheradressengeneration
DE69937082D1 (de) Wasserdichter Verbinder und Abdichtungsverfahren
GB9814073D0 (en) Mounting and testing of electrical devices
EP0727462A3 (de) Silicongelzusammensetzung
DE69715504D1 (de) Elektrisch leitfähige Silikonkautschukzusammensetzung und ihre Anwendung zur Herstellung von Halbleiteranordnungen

Legal Events

Date Code Title Description
8364 No opposition during term of opposition