JP3765444B2 - 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル - Google Patents

電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル Download PDF

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Publication number
JP3765444B2
JP3765444B2 JP20086197A JP20086197A JP3765444B2 JP 3765444 B2 JP3765444 B2 JP 3765444B2 JP 20086197 A JP20086197 A JP 20086197A JP 20086197 A JP20086197 A JP 20086197A JP 3765444 B2 JP3765444 B2 JP 3765444B2
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Japan
Prior art keywords
silicone gel
component
group
sealing
electronic parts
Prior art date
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Expired - Lifetime
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JP20086197A
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English (en)
Japanese (ja)
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JPH1129710A (ja
JPH1129710A5 (enExample
Inventor
博司 江南
昭宏 中村
裕司 浜田
丈章 ▲斎▼木
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DuPont Toray Specialty Materials KK
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Dow Corning Toray Co Ltd
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Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Priority to JP20086197A priority Critical patent/JP3765444B2/ja
Priority to US09/110,633 priority patent/US6001918A/en
Priority to DE69826370T priority patent/DE69826370T2/de
Priority to EP98112629A priority patent/EP0890617B1/en
Publication of JPH1129710A publication Critical patent/JPH1129710A/ja
Publication of JPH1129710A5 publication Critical patent/JPH1129710A5/ja
Application granted granted Critical
Publication of JP3765444B2 publication Critical patent/JP3765444B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Silicon Polymers (AREA)
JP20086197A 1997-07-10 1997-07-10 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル Expired - Lifetime JP3765444B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP20086197A JP3765444B2 (ja) 1997-07-10 1997-07-10 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル
US09/110,633 US6001918A (en) 1997-07-10 1998-07-06 Silicone gel composition for use as a sealant and a filler for electrical and electronic components and a gel prepared from this composition
DE69826370T DE69826370T2 (de) 1997-07-10 1998-07-08 Silikongel-Zusammensetzung zur Versiegelung und Füllung von elektrischen und elektronischen Bauelementen
EP98112629A EP0890617B1 (en) 1997-07-10 1998-07-08 Silicone gel composition for sealing and filling electrical and electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20086197A JP3765444B2 (ja) 1997-07-10 1997-07-10 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル

Publications (3)

Publication Number Publication Date
JPH1129710A JPH1129710A (ja) 1999-02-02
JPH1129710A5 JPH1129710A5 (enExample) 2005-05-12
JP3765444B2 true JP3765444B2 (ja) 2006-04-12

Family

ID=16431450

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20086197A Expired - Lifetime JP3765444B2 (ja) 1997-07-10 1997-07-10 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル

Country Status (4)

Country Link
US (1) US6001918A (enExample)
EP (1) EP0890617B1 (enExample)
JP (1) JP3765444B2 (enExample)
DE (1) DE69826370T2 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3746394B2 (ja) * 1999-04-14 2006-02-15 東レ・ダウコーニング株式会社 シリコーンゲル組成物
US6458461B1 (en) 2000-12-06 2002-10-01 Lexmark International, Inc Release agent composition
JP4530137B2 (ja) 2003-09-17 2010-08-25 信越化学工業株式会社 精密電子部品封止・シール用オルガノポリシロキサン組成物、精密電子部品の腐蝕防止又は遅延方法、並びに銀含有精密電子部品
JP4908736B2 (ja) * 2003-10-01 2012-04-04 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
US7767754B2 (en) * 2005-11-08 2010-08-03 Momentive Performance Materials Inc. Silicone composition and process of making same
BRPI0621973A2 (pt) * 2006-12-18 2014-04-29 Lg Electronics Inc Componentes eletrônicos
JP2009054983A (ja) * 2007-01-17 2009-03-12 Mitsubishi Pencil Co Ltd 電波吸収材およびその製造方法
WO2009044960A1 (en) * 2007-10-02 2009-04-09 Cheil Industries Inc. Gap-filling composition with excellent shelf life by end-capping
JP2009191119A (ja) * 2008-02-13 2009-08-27 Kaneka Corp シリコーン系重合体粒子を含有するシリコーン系硬化性組成物
WO2012053526A1 (ja) * 2010-10-20 2012-04-26 旭化成イーマテリアルズ株式会社 酸化物ナノ粒子反応生成物及びシリコーン組成物
EP2733178A4 (en) * 2011-07-14 2015-03-04 Sekisui Chemical Co Ltd SEALANT FOR OPTICAL SEMICONDUCTOR COMPONENTS AND OPTICAL SEMICONDUCTOR ELEMENT
WO2013052838A1 (en) 2011-10-06 2013-04-11 Dow Corning Corporation Method of forming a gel having improved thermal stability
CN103946313B (zh) * 2011-10-06 2016-11-09 道康宁公司 具有改善的热稳定性的凝胶
JP5983519B2 (ja) * 2012-04-24 2016-08-31 信越化学工業株式会社 ウエハ加工体、ウエハ加工用部材、ウエハ加工用仮接着材、及び薄型ウエハの製造方法
JP5975528B2 (ja) * 2012-10-11 2016-08-23 信越化学工業株式会社 ウエハ加工体、ウエハ加工用部材、ウエハ加工用仮接着材、及び薄型ウエハの製造方法
JP6213257B2 (ja) * 2013-01-25 2017-10-18 セントラル硝子株式会社 シリコーンを含む硬化性組成物およびその硬化物
WO2014160112A1 (en) 2013-03-14 2014-10-02 Dow Corning Corporation Metal thermal stabilization of polydiethylsiloxane and copolymers thereof
WO2015034029A1 (en) * 2013-09-03 2015-03-12 Dow Corning Toray Co., Ltd. Silicone gel composition and use thereof
CN106103594B (zh) 2014-01-27 2019-06-28 陶氏东丽株式会社 有机硅凝胶组合物
JP2015212318A (ja) * 2014-05-01 2015-11-26 信越化学工業株式会社 熱伝導性シリコーン組成物
PL3239004T3 (pl) * 2015-06-23 2019-04-30 Pma/Tools Ag Elastomer silikonowy, mieszanka i optyczny element łączący
US20250092283A1 (en) * 2022-01-12 2025-03-20 Shin-Etsu Chemical Co., Ltd. Thixotropic silicone gel composition for spot potting, cured product thereof, and photocoupler
JP2024087720A (ja) * 2022-12-19 2024-07-01 信越化学工業株式会社 導電性シリコーン組成物及びその製造方法、並びに、接着剤及び導電性シリコーン硬化物

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4340709A (en) * 1980-07-16 1982-07-20 General Electric Company Addition curing silicone compositions
JPS587452A (ja) * 1981-07-06 1983-01-17 ダウ　コ−ニング　コ−ポレ−ション 硬化性シロキサン組成物
JPS59204259A (ja) * 1983-05-06 1984-11-19 Hitachi Ltd 半導体装置の封止方法
JPS6148945A (ja) * 1984-08-16 1986-03-10 Toshiba Corp ハイプリツドｉｃモジユ−ル
US4584361A (en) * 1985-06-03 1986-04-22 Dow Corning Corporation Storage stable, one part polyorganosiloxane compositions
JPS62104145A (ja) * 1985-10-31 1987-05-14 Mitsubishi Electric Corp 半導体装置
US4801642A (en) * 1987-12-28 1989-01-31 Dow Corning Corporation Thermally stable organosiloxane compositions and method for preparing same
JPH0319269A (ja) * 1989-06-15 1991-01-28 Fujitsu Ltd 半導体装置の製造方法
US5334687A (en) * 1989-09-08 1994-08-02 Shin-Etsu Chemical Co., Ltd. Organopolysiloxane composition
US5059649A (en) * 1989-11-08 1991-10-22 Dow Corning Corporation Storage stable one-part fluorosilicone gel compositions exhibiting improved thermal stability
JP2582690B2 (ja) * 1991-09-13 1997-02-19 信越化学工業株式会社 防振特性に優れたシリコーンゲル組成物
JPH05204259A (ja) * 1992-01-28 1993-08-13 Sharp Corp 電子写真装置
US5270422A (en) * 1992-07-02 1993-12-14 Dow Corning Corporation Curing catalyst compositions and method for preparing same
US5371162A (en) * 1992-07-09 1994-12-06 Minnesota Mining And Manufacturing Company Storage-stable silicone composition
JP2864944B2 (ja) * 1993-04-30 1999-03-08 信越化学工業株式会社 難燃性シリコーン組成物

Also Published As

Publication number Publication date
EP0890617A2 (en) 1999-01-13
JPH1129710A (ja) 1999-02-02
EP0890617B1 (en) 2004-09-22
DE69826370T2 (de) 2005-09-29
US6001918A (en) 1999-12-14
DE69826370D1 (de) 2004-10-28
EP0890617A3 (en) 2000-02-23

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