DE69803267T2 - Epoxidharzzusammensetzungen für die versiegelung von halbleitern und halbleitervorrichtung - Google Patents

Epoxidharzzusammensetzungen für die versiegelung von halbleitern und halbleitervorrichtung

Info

Publication number
DE69803267T2
DE69803267T2 DE69803267T DE69803267T DE69803267T2 DE 69803267 T2 DE69803267 T2 DE 69803267T2 DE 69803267 T DE69803267 T DE 69803267T DE 69803267 T DE69803267 T DE 69803267T DE 69803267 T2 DE69803267 T2 DE 69803267T2
Authority
DE
Germany
Prior art keywords
semiconductor
epoxy resin
resin compositions
semiconductor device
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69803267T
Other languages
English (en)
Other versions
DE69803267D1 (de
Inventor
Masakatu Maeda
Shinichi Iwasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP17716797A external-priority patent/JP3377933B2/ja
Priority claimed from JP11213498A external-priority patent/JP3389095B2/ja
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Application granted granted Critical
Publication of DE69803267D1 publication Critical patent/DE69803267D1/de
Publication of DE69803267T2 publication Critical patent/DE69803267T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE69803267T 1997-07-02 1998-07-02 Epoxidharzzusammensetzungen für die versiegelung von halbleitern und halbleitervorrichtung Expired - Fee Related DE69803267T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP17716797A JP3377933B2 (ja) 1997-07-02 1997-07-02 エポキシ樹脂組成物及びこれを用いた半導体装置
JP11213498A JP3389095B2 (ja) 1998-04-22 1998-04-22 エポキシ樹脂組成物及び半導体装置
PCT/JP1998/002980 WO1999001507A1 (en) 1997-07-02 1998-07-02 Epoxy resin compositions for encapsulating semiconductors, and semiconductor devices

Publications (2)

Publication Number Publication Date
DE69803267D1 DE69803267D1 (de) 2002-02-21
DE69803267T2 true DE69803267T2 (de) 2002-05-16

Family

ID=26451364

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69803267T Expired - Fee Related DE69803267T2 (de) 1997-07-02 1998-07-02 Epoxidharzzusammensetzungen für die versiegelung von halbleitern und halbleitervorrichtung

Country Status (6)

Country Link
US (1) US6190787B1 (de)
EP (1) EP0926196B1 (de)
KR (1) KR100307197B1 (de)
CN (1) CN1099441C (de)
DE (1) DE69803267T2 (de)
WO (1) WO1999001507A1 (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3479827B2 (ja) 1998-04-27 2003-12-15 信越化学工業株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
JP3707043B2 (ja) * 1999-03-18 2005-10-19 三菱瓦斯化学株式会社 プリント配線板用プリプレグ及び積層板
TW538482B (en) * 1999-04-26 2003-06-21 Shinetsu Chemical Co Semiconductor encapsulating epoxy resin composition and semiconductor device
US6432540B1 (en) * 2000-03-23 2002-08-13 Loctite Corporation Flame retardant molding compositions
US6610406B2 (en) 2000-03-23 2003-08-26 Henkel Locktite Corporation Flame retardant molding compositions
JP3714399B2 (ja) * 2000-06-19 2005-11-09 信越化学工業株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
US6737467B1 (en) * 2000-11-21 2004-05-18 E. I. Du Pont De Nemours And Company Low gloss powder coatings
TW585015B (en) * 2001-06-28 2004-04-21 Sanyo Electric Co Hybrid integrated circuit device and method for manufacturing same
US6822341B1 (en) 2002-12-19 2004-11-23 Henkel Corporation Latent catalysts for molding compounds
KR100887923B1 (ko) * 2002-12-23 2009-03-12 에스케이케미칼주식회사 비할로겐계 난연성 에폭시 수지 조성물, 이를 이용하여제조한 수지코팅동박 및 동박적층판
US20040166241A1 (en) * 2003-02-20 2004-08-26 Henkel Loctite Corporation Molding compositions containing quaternary organophosphonium salts
KR101117063B1 (ko) * 2003-06-19 2012-04-16 가부시끼가이샤 히다치 세이사꾸쇼 에폭시 화합물 및 경화 에폭시 수지 제품
JP2005120228A (ja) * 2003-10-16 2005-05-12 Nitto Denko Corp 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置
JP4483366B2 (ja) * 2004-03-25 2010-06-16 ヤマハ株式会社 半導体パッケージおよびその製造方法
US7723856B2 (en) * 2004-03-30 2010-05-25 Sumitomo Bakelite Co., Ltd. Epoxy resin composition for the encapsulation of semiconductors and semiconductor devices
CN100551659C (zh) * 2004-05-20 2009-10-21 雅宝公司 制成粒状的溴化阴离子苯乙烯系聚合物及其制备和应用
CN1301296C (zh) * 2004-06-14 2007-02-21 江苏中电华威电子股份有限公司 一种环氧树脂组合物
KR101317745B1 (ko) * 2005-01-13 2013-10-15 스미토모 베이클라이트 가부시키가이샤 반도체 밀봉용 에폭시 수지 조성물 및 반도체 장치
US7595560B2 (en) * 2005-02-22 2009-09-29 Nec Electronics Corporation Semiconductor device
CN100398592C (zh) * 2005-05-20 2008-07-02 长兴化学工业股份有限公司 阻燃剂和含所述阻燃剂的阻燃性树脂组成物及其用途
WO2007013284A1 (ja) * 2005-07-29 2007-02-01 Sumitomo Bakelite Co., Ltd. エポキシ樹脂組成物及び半導体装置
JP5853344B2 (ja) * 2009-01-06 2016-02-09 ブルー キューブ アイピー エルエルシー エポキシ樹脂及び分散プロセスのための金属安定剤
WO2011118584A1 (ja) 2010-03-26 2011-09-29 パナソニック電工株式会社 プリプレグ用エポキシ樹脂組成物、プリプレグ、及び多層プリント配線板
CN101967266A (zh) * 2010-09-25 2011-02-09 江苏中鹏新材料股份有限公司 无卤阻燃环氧树脂组合物
CN103443200B (zh) * 2011-01-20 2015-12-23 三菱瓦斯化学株式会社 树脂组合物、预浸料以及层叠板
KR101326960B1 (ko) * 2011-05-20 2013-11-13 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 방열회로기판
KR101326934B1 (ko) * 2011-08-31 2013-11-11 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 방열회로기판
KR101921366B1 (ko) * 2011-09-26 2018-11-22 미츠비시 가스 가가쿠 가부시키가이샤 몰리브덴 화합물 분체, 프리프레그 및 적층판
CN102755955B (zh) * 2012-07-31 2014-11-26 关光基 非晶磁芯表面涂覆工艺
KR20240014063A (ko) 2021-05-25 2024-01-31 제이. 엠. 후버 코포레이션 지지된 아연 디몰리브데이트 하이드록사이드/실리카 복합물 및 폴리머 포뮬레이션에서의 이의 용도

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4101497A (en) * 1976-12-03 1978-07-18 The United States Of America As Represented By The Secretary Of The Navy Sealant-primer coating
US4328152A (en) 1980-12-16 1982-05-04 Amax Inc. Polyvinyl chloride polymer compositions containing trizinc dimolybdate monohydrate and zinc phosphite for smoke suppression
JPS6080259A (ja) * 1983-10-07 1985-05-08 Hitachi Ltd 半導体装置
JPH0613632B2 (ja) * 1984-02-24 1994-02-23 プラス・テク株式会社 難燃性樹脂組成物
JPS62212422A (ja) * 1986-03-14 1987-09-18 Matsushita Electric Works Ltd エポキシ樹脂組成物
JP2819256B2 (ja) * 1995-03-24 1998-10-30 神東塗料株式会社 常温乾燥型防錆塗料組成物
JP3911037B2 (ja) * 1995-07-11 2007-05-09 ダイセル化学工業株式会社 難燃性樹脂組成物

Also Published As

Publication number Publication date
EP0926196A4 (de) 1999-06-30
WO1999001507A1 (en) 1999-01-14
EP0926196B1 (de) 2001-11-21
KR100307197B1 (ko) 2001-09-24
KR20000068403A (ko) 2000-11-25
EP0926196A1 (de) 1999-06-30
CN1099441C (zh) 2003-01-22
US6190787B1 (en) 2001-02-20
CN1236378A (zh) 1999-11-24
DE69803267D1 (de) 2002-02-21

Similar Documents

Publication Publication Date Title
DE69803267T2 (de) Epoxidharzzusammensetzungen für die versiegelung von halbleitern und halbleitervorrichtung
DE69821573D1 (de) Epoxidharzzusammensetzung und damit eingekapselte Halbleiteranordnungen
DE69840353D1 (de) Epoxidharzzusammensetzung geeignet zur Verkapselung von Halbleiteranordnungen und harzverkapselte Halbleiteranordnungen
DE69531191D1 (de) Epoxidharzzusammensetzung für die versiegelung von halbleiteranordnungen
DE69023531T2 (de) Packung für Halbleiteranordnung und Dichtungsverfahren dafür.
DE69727869D1 (de) Anorganischer Füllstoff, Epoxyharzzusammensetzung und Halbleitervorrichtung
DE69922577D1 (de) Epoxydharzzusammensetzungen und damit eingekapselte Halbleiteranordnungen
DE69722106D1 (de) Epoxidharzzusammensetzung und damit eingekapselte Halbleiteranordnungen
DE69603531D1 (de) Epoxyharz, Harzzusammensetzung und Harz-verkapselte Halbleitervorrichtung
DE60044993D1 (de) Epoxydharzzusammensetzung zur Einkapselung von Halbleitern und Halbleiterbauelement
SG70032A1 (en) Polyphenylene sulfide resin composition and resin-encapsulated semiconductor device
DE69922868D1 (de) Epoxidharzzusammensetzungen zur Einkapselung von Halbleitern und damit eingekapselte Halbleiterbauteile
KR960012451A (ko) 반도체 장치 및 리드프레임
DE69428676D1 (de) Harzverkapselungsscheibchen für Halbleiter
DE69032151T2 (de) Epoxydharzzusammensetzungen für die Versiegelung von Halbleitern
DE69839714D1 (de) Kunststoffpackung und Halbleiteranordnung
DE69913298D1 (de) Epoxydharzzusammensetzung für die versieglung von halbleitern und damit ausgerüstete halbleitervorrichtung
DE69528869D1 (de) Flachgehäuse für Halbleiter-IC
DE69817054D1 (de) Epoxidharzzusammensetzung und eine harzverkapselte Halbleiteranordnung
DE60020516D1 (de) Epoxidharzzusammensetzung und halbleitervorrichtung
SG85624A1 (en) Epoxy resin composition and resin-encapsulated semiconductor device
KR960010764A (ko) 에폭시 수지 조성물 및 수지 봉지형 반도체 장치
DE69321965T2 (de) MOS-Leistungs-Chip-Typ und Packungszusammenbau
KR960006348U (ko) 반도체칩 검사장치
KR980005488U (ko) 리드 온 칩 패키지

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee