DE69735971D1 - Ein Verfahren zum Trocknen von Substraten - Google Patents
Ein Verfahren zum Trocknen von SubstratenInfo
- Publication number
- DE69735971D1 DE69735971D1 DE69735971T DE69735971T DE69735971D1 DE 69735971 D1 DE69735971 D1 DE 69735971D1 DE 69735971 T DE69735971 T DE 69735971T DE 69735971 T DE69735971 T DE 69735971T DE 69735971 D1 DE69735971 D1 DE 69735971D1
- Authority
- DE
- Germany
- Prior art keywords
- drying substrates
- substrates
- drying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001035 drying Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Drying Of Solid Materials (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7138396 | 1996-03-01 | ||
| JP7138396A JPH09246230A (ja) | 1996-03-01 | 1996-03-01 | 処理方法 |
| JP19546096 | 1996-07-05 | ||
| JP08195460A JP3127357B2 (ja) | 1996-07-05 | 1996-07-05 | 乾燥処理装置及び乾燥処理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69735971D1 true DE69735971D1 (de) | 2006-07-06 |
| DE69735971T2 DE69735971T2 (de) | 2007-01-04 |
Family
ID=26412488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69735971T Expired - Lifetime DE69735971T2 (de) | 1996-03-01 | 1997-02-27 | Ein Verfahren zum Trocknen von Substraten |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5940985A (de) |
| EP (1) | EP0793259B1 (de) |
| KR (1) | KR980012044A (de) |
| DE (1) | DE69735971T2 (de) |
| TW (1) | TW326548B (de) |
Families Citing this family (81)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6050275A (en) * | 1996-09-27 | 2000-04-18 | Tokyo Electron Limited | Apparatus for and method of cleaning objects to be processed |
| KR200160545Y1 (ko) * | 1997-01-23 | 1999-11-15 | 김재형 | 알콜 증기건조기 |
| US6350322B1 (en) * | 1997-03-21 | 2002-02-26 | Micron Technology, Inc. | Method of reducing water spotting and oxide growth on a semiconductor structure |
| JP3230051B2 (ja) * | 1997-05-16 | 2001-11-19 | 東京エレクトロン株式会社 | 乾燥処理方法及びその装置 |
| JP3151613B2 (ja) * | 1997-06-17 | 2001-04-03 | 東京エレクトロン株式会社 | 洗浄・乾燥処理方法及びその装置 |
| KR19990010200A (ko) * | 1997-07-15 | 1999-02-05 | 윤종용 | 감압식 건조 장치를 이용하는 반도체장치 건조방법 |
| JP3194036B2 (ja) * | 1997-09-17 | 2001-07-30 | 東京エレクトロン株式会社 | 乾燥処理装置及び乾燥処理方法 |
| KR100257901B1 (ko) * | 1997-12-08 | 2000-06-01 | 윤종용 | 반도체장치 제조용 웨이퍼 정렬장치 |
| JP2001526460A (ja) | 1997-12-10 | 2001-12-18 | シーエフエムテイ・インコーポレーテツド | 電子部品製造の湿式加工法 |
| AT407680B (de) * | 1999-06-04 | 2001-05-25 | Sez Semiconduct Equip Zubehoer | Verfahren und vorrichtung zum trocknen von scheibenförmigen gegenständen |
| JP3448613B2 (ja) * | 1999-06-29 | 2003-09-22 | オメガセミコン電子株式会社 | 乾燥装置 |
| DE10036867B4 (de) * | 1999-07-30 | 2006-04-13 | Tokyo Electron Ltd. | Substrat-Bearbeitungsverfahren und -vorrichtung |
| US6192600B1 (en) * | 1999-09-09 | 2001-02-27 | Semitool, Inc. | Thermocapillary dryer |
| US6497055B2 (en) | 2000-01-04 | 2002-12-24 | Texas Instruments Incorporated | System and method for controlling a vapor dryer process |
| US6289605B1 (en) * | 2000-02-18 | 2001-09-18 | Macronix International Co. Ltd. | Method for drying a semiconductor wafer |
| KR100691241B1 (ko) * | 2000-08-24 | 2007-03-12 | 삼성전자주식회사 | 습식 세정 장치의 건조 장치 및 건조 방법 |
| JP2002075950A (ja) * | 2000-08-25 | 2002-03-15 | Nec Corp | 半導体ウエハーの乾燥方法 |
| KR100899609B1 (ko) * | 2000-12-28 | 2009-05-27 | 도쿄엘렉트론가부시키가이샤 | 기판처리장치 및 기판처리방법 |
| US6564469B2 (en) * | 2001-07-09 | 2003-05-20 | Motorola, Inc. | Device for performing surface treatment on semiconductor wafers |
| KR100454241B1 (ko) * | 2001-12-28 | 2004-10-26 | 한국디엔에스 주식회사 | 웨이퍼 건조 장비 |
| US20030136429A1 (en) * | 2002-01-22 | 2003-07-24 | Semitool, Inc. | Vapor cleaning and liquid rinsing process vessel |
| DE10216786C5 (de) * | 2002-04-15 | 2009-10-15 | Ers Electronic Gmbh | Verfahren und Vorrichtung zur Konditionierung von Halbleiterwafern und/oder Hybriden |
| JP4576230B2 (ja) * | 2002-06-25 | 2010-11-04 | 東京エレクトロン株式会社 | 基板処理装置 |
| DE10256696A1 (de) * | 2002-12-04 | 2004-06-24 | Mattson Wet Products Gmbh | Verfahren zum Trocknen von Substraten |
| US20040194806A1 (en) * | 2003-04-02 | 2004-10-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | IPA concentration interlock detector for substrate dryer |
| JP4118194B2 (ja) * | 2003-06-02 | 2008-07-16 | 横河電機株式会社 | 洗浄装置 |
| US7244315B2 (en) * | 2003-06-27 | 2007-07-17 | Fsi International, Inc. | Microelectronic device drying devices and techniques |
| KR100568103B1 (ko) * | 2003-08-19 | 2006-04-05 | 삼성전자주식회사 | 반도체 기판 세정 장치 및 세정 방법 |
| DE10353076A1 (de) * | 2003-11-13 | 2005-06-02 | Infineon Technologies Ag | Überwachungseinrichtung für eine Marangoni-Trockneranlage |
| KR100634376B1 (ko) * | 2004-07-07 | 2006-10-16 | 삼성전자주식회사 | 기판 건조 장치 |
| KR100687503B1 (ko) * | 2005-03-04 | 2007-02-27 | 세메스 주식회사 | 기판 처리 장치 |
| KR100928495B1 (ko) * | 2005-06-20 | 2009-11-26 | 엘지디스플레이 주식회사 | 배향막 인쇄 마스크용 지그 장치와, 이를 적용한 배향막인쇄 마스크용 세정 장비 및 이를 이용한 마스크 세정 방법 |
| US8015984B2 (en) * | 2005-06-22 | 2011-09-13 | Tokyo Electron Limited | Substrate processing apparatus including a drying mechanism using a fluid mixture of purified water and a volatile organic solvent |
| US7637029B2 (en) * | 2005-07-08 | 2009-12-29 | Tokyo Electron Limited | Vapor drying method, apparatus and recording medium for use in the method |
| JP4519037B2 (ja) * | 2005-08-31 | 2010-08-04 | 東京エレクトロン株式会社 | 加熱装置及び塗布、現像装置 |
| JP4758846B2 (ja) * | 2005-11-18 | 2011-08-31 | 東京エレクトロン株式会社 | 乾燥装置、乾燥方法、及び乾燥プログラム、並びに、これらを有する基板処理装置、基板処理方法、及び基板処理プログラム |
| KR100753959B1 (ko) * | 2006-01-12 | 2007-08-31 | 에이펫(주) | 기판 건조장치를 이용한 기판 건조방법 |
| JP4527670B2 (ja) | 2006-01-25 | 2010-08-18 | 東京エレクトロン株式会社 | 加熱処理装置、加熱処理方法、制御プログラムおよびコンピュータ読取可能な記憶媒体 |
| US20070283891A1 (en) * | 2006-03-29 | 2007-12-13 | Nobuyuki Okayama | Table for supporting substrate, and vacuum-processing equipment |
| KR101309055B1 (ko) * | 2006-05-18 | 2013-09-16 | 후지필름 가부시키가이샤 | 피건조물의 건조 방법 및 장치 |
| KR100786700B1 (ko) * | 2006-07-14 | 2007-12-21 | 삼성전자주식회사 | 건조 방법 및 이를 수행하기 위한 장치 |
| US20080053486A1 (en) * | 2006-08-10 | 2008-03-06 | Applied Materials, Inc. | Semiconductor substrate cleaning apparatus |
| JP4762835B2 (ja) | 2006-09-07 | 2011-08-31 | 東京エレクトロン株式会社 | 基板処理方法、基板処理装置、プログラムおよびプログラム記録媒体 |
| JP4891730B2 (ja) * | 2006-10-18 | 2012-03-07 | 東京エレクトロン株式会社 | 液処理装置及び液処理方法並びに液処理プログラム |
| DE102006060302B3 (de) * | 2006-12-14 | 2008-06-19 | Abb Ag | Anordnung sowie ein Verfahren zur Steuerung von Trocknungsprozessen für die Herstellung von Halbleiterbauelementen |
| JP5043185B2 (ja) * | 2007-06-26 | 2012-10-10 | アフコ・コマンディテール・フェンノートシャップ | シリコンベース電子回路を乾燥させるための装置および方法 |
| US8549771B2 (en) | 2009-10-21 | 2013-10-08 | Stmicroelectronics, Inc. | Dryness detection method for clothes dryer based on pulse width |
| CN101718487B (zh) * | 2009-12-04 | 2013-07-31 | 有研半导体材料股份有限公司 | 一种硅片清洗后的快速干燥方法和装置 |
| JP5821311B2 (ja) * | 2011-06-17 | 2015-11-24 | 富士通セミコンダクター株式会社 | 半導体装置の製造方法 |
| KR101475429B1 (ko) * | 2012-05-15 | 2014-12-23 | 주식회사 엘지화학 | 이차전지 제조용 전극 건조 오븐 자동 급기 유량 제어 장치 |
| CN104078388B (zh) * | 2013-03-29 | 2017-04-12 | 细美事有限公司 | 再循环单元以及衬底处理设备 |
| KR20170133694A (ko) * | 2016-05-26 | 2017-12-06 | 세메스 주식회사 | 유체 공급 유닛, 이를 가지는 기판 처리 장치 및 방법 |
| US10224224B2 (en) | 2017-03-10 | 2019-03-05 | Micromaterials, LLC | High pressure wafer processing systems and related methods |
| US10622214B2 (en) | 2017-05-25 | 2020-04-14 | Applied Materials, Inc. | Tungsten defluorination by high pressure treatment |
| JP7190450B2 (ja) | 2017-06-02 | 2022-12-15 | アプライド マテリアルズ インコーポレイテッド | 炭化ホウ素ハードマスクのドライストリッピング |
| US10269571B2 (en) | 2017-07-12 | 2019-04-23 | Applied Materials, Inc. | Methods for fabricating nanowire for semiconductor applications |
| US10179941B1 (en) | 2017-07-14 | 2019-01-15 | Applied Materials, Inc. | Gas delivery system for high pressure processing chamber |
| CN110892518B (zh) * | 2017-07-14 | 2023-12-05 | 雷纳技术有限责任公司 | 干燥基片的干燥装置和方法 |
| US10276411B2 (en) | 2017-08-18 | 2019-04-30 | Applied Materials, Inc. | High pressure and high temperature anneal chamber |
| CN111095513B (zh) | 2017-08-18 | 2023-10-31 | 应用材料公司 | 高压高温退火腔室 |
| JP2019047042A (ja) * | 2017-09-05 | 2019-03-22 | 東芝メモリ株式会社 | 半導体製造装置 |
| CN111095524B (zh) | 2017-09-12 | 2023-10-03 | 应用材料公司 | 用于使用保护阻挡物层制造半导体结构的设备和方法 |
| US10643867B2 (en) | 2017-11-03 | 2020-05-05 | Applied Materials, Inc. | Annealing system and method |
| CN117936417A (zh) | 2017-11-11 | 2024-04-26 | 微材料有限责任公司 | 用于高压处理腔室的气体输送系统 |
| SG11202003438QA (en) | 2017-11-16 | 2020-05-28 | Applied Materials Inc | High pressure steam anneal processing apparatus |
| WO2019099255A2 (en) | 2017-11-17 | 2019-05-23 | Applied Materials, Inc. | Condenser system for high pressure processing system |
| CN111699549A (zh) | 2018-01-24 | 2020-09-22 | 应用材料公司 | 使用高压退火的接缝弥合 |
| WO2019173006A1 (en) | 2018-03-09 | 2019-09-12 | Applied Materials, Inc. | High pressure annealing process for metal containing materials |
| US10714331B2 (en) | 2018-04-04 | 2020-07-14 | Applied Materials, Inc. | Method to fabricate thermally stable low K-FinFET spacer |
| US10890377B2 (en) * | 2018-05-01 | 2021-01-12 | Rochester Institute Of Technology | Volcano-shaped enhancement features for enhanced pool boiling |
| US10950429B2 (en) | 2018-05-08 | 2021-03-16 | Applied Materials, Inc. | Methods of forming amorphous carbon hard mask layers and hard mask layers formed therefrom |
| US10566188B2 (en) | 2018-05-17 | 2020-02-18 | Applied Materials, Inc. | Method to improve film stability |
| US10704141B2 (en) | 2018-06-01 | 2020-07-07 | Applied Materials, Inc. | In-situ CVD and ALD coating of chamber to control metal contamination |
| US10748783B2 (en) | 2018-07-25 | 2020-08-18 | Applied Materials, Inc. | Gas delivery module |
| US10675581B2 (en) | 2018-08-06 | 2020-06-09 | Applied Materials, Inc. | Gas abatement apparatus |
| JP7179172B6 (ja) | 2018-10-30 | 2022-12-16 | アプライド マテリアルズ インコーポレイテッド | 半導体用途の構造体をエッチングするための方法 |
| KR20210077779A (ko) | 2018-11-16 | 2021-06-25 | 어플라이드 머티어리얼스, 인코포레이티드 | 강화된 확산 프로세스를 사용한 막 증착 |
| WO2020117462A1 (en) | 2018-12-07 | 2020-06-11 | Applied Materials, Inc. | Semiconductor processing system |
| JP7241568B2 (ja) * | 2019-03-04 | 2023-03-17 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法および記憶媒体 |
| JP7281925B2 (ja) * | 2019-03-07 | 2023-05-26 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法および記憶媒体 |
| US11901222B2 (en) | 2020-02-17 | 2024-02-13 | Applied Materials, Inc. | Multi-step process for flowable gap-fill film |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4977688A (en) * | 1989-10-27 | 1990-12-18 | Semifab Incorporated | Vapor device and method for drying articles such as semiconductor wafers with substances such as isopropyl alcohol |
| US5371950A (en) * | 1990-02-23 | 1994-12-13 | S & K Products International, Inc. | Isopropyl alcohol vapor dryer system |
| JP2902222B2 (ja) * | 1992-08-24 | 1999-06-07 | 東京エレクトロン株式会社 | 乾燥処理装置 |
| JP3003016B2 (ja) * | 1992-12-25 | 2000-01-24 | 東京エレクトロン株式会社 | 処理装置及び処理方法 |
| JP3347814B2 (ja) * | 1993-05-17 | 2002-11-20 | 大日本スクリーン製造株式会社 | 基板の洗浄・乾燥処理方法並びにその処理装置 |
| US5715612A (en) * | 1995-08-17 | 1998-02-10 | Schwenkler; Robert S. | Method for precision drying surfaces |
-
1996
- 1996-03-14 KR KR1019960006786A patent/KR980012044A/ko not_active Application Discontinuation
-
1997
- 1997-02-27 DE DE69735971T patent/DE69735971T2/de not_active Expired - Lifetime
- 1997-02-27 EP EP97103165A patent/EP0793259B1/de not_active Expired - Lifetime
- 1997-02-27 TW TW086102435A patent/TW326548B/zh not_active IP Right Cessation
- 1997-02-28 US US08/808,858 patent/US5940985A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE69735971T2 (de) | 2007-01-04 |
| EP0793259B1 (de) | 2006-05-31 |
| EP0793259A2 (de) | 1997-09-03 |
| US5940985A (en) | 1999-08-24 |
| KR980012044A (ko) | 1998-04-30 |
| TW326548B (en) | 1998-02-11 |
| EP0793259A3 (de) | 1999-12-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition |