DE69732823D1 - Vorrichtung zur elektromagnetischen Isolierung eines elektronischen Gerätes - Google Patents

Vorrichtung zur elektromagnetischen Isolierung eines elektronischen Gerätes

Info

Publication number
DE69732823D1
DE69732823D1 DE69732823T DE69732823T DE69732823D1 DE 69732823 D1 DE69732823 D1 DE 69732823D1 DE 69732823 T DE69732823 T DE 69732823T DE 69732823 T DE69732823 T DE 69732823T DE 69732823 D1 DE69732823 D1 DE 69732823D1
Authority
DE
Germany
Prior art keywords
electromagnetic isolation
electronic device
electronic
isolation
electromagnetic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69732823T
Other languages
English (en)
Other versions
DE69732823T2 (de
Inventor
Noriyoshi Sato
Shinichi Terao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69732823D1 publication Critical patent/DE69732823D1/de
Publication of DE69732823T2 publication Critical patent/DE69732823T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
    • H04M1/185—Improving the rigidity of the casing or resistance to shocks
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H05K9/0033—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids disposed on both PCB faces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0037—Housings with compartments containing a PCB, e.g. partitioning walls
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/3827—Portable transceivers
    • H04B1/3833—Hand-held transceivers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B2001/3894—Waterproofing of transmission device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M19/00—Current supply arrangements for telephone systems
    • H04M19/02—Current supply arrangements for telephone systems providing ringing current or supervisory tones, e.g. dialling tone or busy tone
    • H04M19/04—Current supply arrangements for telephone systems providing ringing current or supervisory tones, e.g. dialling tone or busy tone the ringing-current being generated at the substations
    • H04M19/047—Vibrating means for incoming calls
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S174/00—Electricity: conductors and insulators
    • Y10S174/35—Box or housing mounted on substrate or PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S277/00—Seal for a joint or juncture
    • Y10S277/92—Seal including electromagnetic shielding feature

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Telephone Set Structure (AREA)
DE69732823T 1996-09-26 1997-09-25 Vorrichtung zur elektromagnetischen Isolierung eines elektronischen Gerätes Expired - Lifetime DE69732823T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP25473896 1996-09-26
JP25473896 1996-09-26

Publications (2)

Publication Number Publication Date
DE69732823D1 true DE69732823D1 (de) 2005-04-28
DE69732823T2 DE69732823T2 (de) 2006-05-18

Family

ID=17269182

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69732823T Expired - Lifetime DE69732823T2 (de) 1996-09-26 1997-09-25 Vorrichtung zur elektromagnetischen Isolierung eines elektronischen Gerätes

Country Status (5)

Country Link
US (2) US6333459B1 (de)
EP (1) EP0833466B1 (de)
CN (2) CN1104835C (de)
DE (1) DE69732823T2 (de)
IN (1) IN192428B (de)

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IN192428B (de) * 1996-09-26 2004-04-24 Matsushita Electric Ind Co Ltd
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JP3747997B2 (ja) * 1998-11-10 2006-02-22 松下電器産業株式会社 携帯端末装置
JP3490017B2 (ja) * 1999-03-18 2004-01-26 松下電器産業株式会社 無線端末装置
JP2001007550A (ja) * 1999-06-24 2001-01-12 Nec Corp 携帯情報無線端末装置およびその製造方法
JP2001128278A (ja) * 1999-10-26 2001-05-11 Matsushita Electric Ind Co Ltd イヤホンジャック保持装置
JP3960115B2 (ja) * 2001-05-24 2007-08-15 松下電器産業株式会社 携帯用電力増幅器
JP4601879B2 (ja) 2001-09-14 2010-12-22 パナソニック株式会社 携帯電子機器及びｂｇａパッケージ保護装置
CN1312826C (zh) * 2002-06-11 2007-04-25 索尼爱立信移动通讯股份有限公司 具有振动器和可换外壳的电子装置
EP1372243A1 (de) * 2002-06-11 2003-12-17 Sony Ericsson Mobile Communications AB Elektronische Vorrichtung mit Rütteleinrichtung und auswechselbarem Deckel
JP3838204B2 (ja) * 2003-02-19 2006-10-25 株式会社豊田自動織機 電動コンプレッサ及び電動コンプレッサの組立方法
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JP4112484B2 (ja) * 2003-12-17 2008-07-02 株式会社東芝 無線機器及び半導体装置
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KR100631193B1 (ko) * 2004-10-27 2006-10-04 삼성전자주식회사 디스플레이장치 및 그것을 구비하는 휴대폰
JP4511408B2 (ja) * 2005-04-18 2010-07-28 富士通株式会社 表示モジュールおよび携帯端末装置
US20060259918A1 (en) * 2005-05-16 2006-11-16 Dell Products L.P. Method and apparatus for mounting a storage device in an information handling system
US7636245B2 (en) * 2007-06-25 2009-12-22 Novatel Wireless, Inc. Electronic component cover and arrangement
CN101360390B (zh) * 2007-08-03 2011-05-04 深圳富泰宏精密工业有限公司 印刷电路板堆叠结构
US7768465B2 (en) * 2007-09-12 2010-08-03 Laird Technologies, Inc. Vehicle-mount stacked patch antenna assemblies with resiliently compressible bumpers for mechanical compression to aid in electrical grounding of shield and chassis
CN101453850B (zh) * 2007-12-06 2011-06-22 英业达股份有限公司 隔振搭接装置
JP2009239261A (ja) * 2008-03-07 2009-10-15 Panasonic Corp 電子ユニット、電子装置
US20090290319A1 (en) * 2008-05-20 2009-11-26 Apple Inc. Electromagnetic shielding in small-form-factor device
US8059418B2 (en) * 2009-04-03 2011-11-15 Trw Automotive U.S. Llc Assembly with a printed circuit board
US8563874B2 (en) * 2010-04-20 2013-10-22 Amtek Precision Technology Pte Ltd. Electromagnetic interference shielding arrangement
CN102452008A (zh) * 2010-10-21 2012-05-16 张家港市贝尔机械有限公司 一种快速拆卸螺母
CN103227537B (zh) * 2013-04-24 2016-04-20 捷和电机制品(深圳)有限公司 印刷电路板及直流电机
KR20140142600A (ko) * 2013-06-04 2014-12-12 삼성전자주식회사 전자 기기의 보호 장치 및 그를 구비하는 전자 기기
JP6331290B2 (ja) * 2013-08-28 2018-05-30 株式会社ニコン 電子機器
KR102208686B1 (ko) * 2014-08-11 2021-01-28 삼성전자주식회사 전자 장치 및 그 제작 방법
CN205124242U (zh) * 2015-10-16 2016-03-30 中兴通讯股份有限公司 一种电子设备
US10561039B2 (en) * 2016-08-22 2020-02-11 Woodward, Inc. Frame for printed circuit board support in high vibration
CN106824016B (zh) * 2017-02-28 2019-04-09 二重（德阳）重型装备有限公司 沸腾床渣油加氢反应器分配盘立式安装方法
KR101919454B1 (ko) * 2017-07-31 2018-11-16 엘지디스플레이 주식회사 디스플레이 장치 및 이를 이용한 컴퓨팅 장치
JP6547874B2 (ja) * 2018-05-02 2019-07-24 株式会社ニコン 電子機器
CN111083899B (zh) * 2019-12-19 2021-08-06 远峰科技股份有限公司 车载娱乐主机箱及车载娱乐主机
US11695240B2 (en) 2021-10-22 2023-07-04 International Business Machines Corporation Retractable EMC protection
US11871550B2 (en) 2021-10-22 2024-01-09 International Business Machines Corporation Motor controlled retractable EMC protection
US11751362B2 (en) 2021-10-22 2023-09-05 International Business Machines Corporation Thermally activated retractable EMC protection

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DE3515772C2 (de) * 1985-05-02 1995-05-11 Bosch Gmbh Robert Aus zwei Gehäusehalbschalen bestehendes Gehäuse
JPS62160599A (ja) 1986-01-08 1987-07-16 Sanyo Electric Co Ltd Ｉｃカ−ド読み取り書き込み装置
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Also Published As

Publication number Publication date
CN1104835C (zh) 2003-04-02
CN1378419A (zh) 2002-11-06
EP0833466A2 (de) 1998-04-01
EP0833466B1 (de) 2005-03-23
US6501019B2 (en) 2002-12-31
IN192428B (de) 2004-04-24
US6333459B1 (en) 2001-12-25
CN1177904A (zh) 1998-04-01
EP0833466A3 (de) 1998-05-20
CN1177519C (zh) 2004-11-24
DE69732823T2 (de) 2006-05-18
US20020027009A1 (en) 2002-03-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8320 Willingness to grant licences declared (paragraph 23)