DE69717331D1 - Kontaktierungsstruktur für Treiberschaltung und Anzeigevorrichtung mit dieser Kontaktierungsstruktur - Google Patents

Kontaktierungsstruktur für Treiberschaltung und Anzeigevorrichtung mit dieser Kontaktierungsstruktur

Info

Publication number
DE69717331D1
DE69717331D1 DE69717331T DE69717331T DE69717331D1 DE 69717331 D1 DE69717331 D1 DE 69717331D1 DE 69717331 T DE69717331 T DE 69717331T DE 69717331 T DE69717331 T DE 69717331T DE 69717331 D1 DE69717331 D1 DE 69717331D1
Authority
DE
Germany
Prior art keywords
contacting structure
display device
driver circuit
contacting
driver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69717331T
Other languages
English (en)
Other versions
DE69717331T2 (de
Inventor
Masanori Takahashi
Riichi Saito
Toshimichi Ouchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE69717331D1 publication Critical patent/DE69717331D1/de
Publication of DE69717331T2 publication Critical patent/DE69717331T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/13138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/13144—Gold [Au] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
DE69717331T 1996-03-15 1997-03-14 Kontaktierungsstruktur für Treiberschaltung und Anzeigevorrichtung mit dieser Kontaktierungsstruktur Expired - Lifetime DE69717331T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5966596 1996-03-15

Publications (2)

Publication Number Publication Date
DE69717331D1 true DE69717331D1 (de) 2003-01-09
DE69717331T2 DE69717331T2 (de) 2003-09-18

Family

ID=13119729

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69717331T Expired - Lifetime DE69717331T2 (de) 1996-03-15 1997-03-14 Kontaktierungsstruktur für Treiberschaltung und Anzeigevorrichtung mit dieser Kontaktierungsstruktur

Country Status (4)

Country Link
US (1) US6738123B1 (de)
EP (1) EP0795772B1 (de)
KR (1) KR100257028B1 (de)
DE (1) DE69717331T2 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990073703A (ko) * 1998-03-02 1999-10-05 윤종용 액정표시장치 모듈
US20120162161A1 (en) * 1998-03-25 2012-06-28 Sony Corporation Liquid crystal display
JP3654116B2 (ja) * 2000-03-10 2005-06-02 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器
JP3756418B2 (ja) 2001-02-28 2006-03-15 株式会社日立製作所 液晶表示装置及びその製造方法
JP4485708B2 (ja) * 2001-05-21 2010-06-23 シャープ株式会社 液晶表示装置用周辺回路基板及びそれを備えた液晶表示装置
US7019809B2 (en) * 2001-06-29 2006-03-28 Citizen Watch Co., Ltd Liquid crystal display panel having an insulating member to protect lead electrodes
KR100404200B1 (ko) * 2001-07-12 2003-11-03 엘지전자 주식회사 유기 ｅｌ 디스플레이 패널
JP3603890B2 (ja) * 2002-03-06 2004-12-22 セイコーエプソン株式会社 電子デバイス及びその製造方法並びに電子機器
JP3875130B2 (ja) * 2002-03-26 2007-01-31 株式会社東芝 表示装置及びその製造方法
JP3690378B2 (ja) * 2002-07-26 2005-08-31 株式会社 日立ディスプレイズ 表示装置
KR100641793B1 (ko) * 2002-12-26 2006-11-02 샤프 가부시키가이샤 표시패널 및 그 제조방법
KR20040075377A (ko) * 2003-02-20 2004-08-30 삼성전자주식회사 구동 아이씨 및 이를 갖는 디스플레이 장치
JP2004271611A (ja) * 2003-03-05 2004-09-30 Pioneer Electronic Corp フラットパネル型表示装置
JP3693056B2 (ja) * 2003-04-21 2005-09-07 セイコーエプソン株式会社 半導体装置及びその製造方法、電子装置及びその製造方法並びに電子機器
US7139060B2 (en) * 2004-01-27 2006-11-21 Au Optronics Corporation Method for mounting a driver IC chip and a FPC board/TCP/COF device using a single anisotropic conductive film
US7742142B2 (en) 2005-08-09 2010-06-22 Chunghwa Picture Tubes, Ltd. Display and tape carrier package structure
KR100814819B1 (ko) * 2006-10-31 2008-03-20 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
JP2008130803A (ja) * 2006-11-21 2008-06-05 Toshiba Matsushita Display Technology Co Ltd 基板装置および基板
US8017873B2 (en) * 2008-03-03 2011-09-13 Himax Technologies Limited Built-in method of thermal dissipation layer for driver IC substrate and structure thereof
CN102084410B (zh) * 2008-07-28 2013-06-26 夏普株式会社 显示面板以及具备该显示面板的显示装置
KR101989824B1 (ko) * 2012-12-07 2019-06-17 삼성전자주식회사 디스플레이 모듈
KR102383737B1 (ko) * 2015-04-01 2022-04-06 삼성디스플레이 주식회사 표시 장치
KR102339282B1 (ko) * 2015-11-02 2021-12-15 삼성디스플레이 주식회사 디스플레이 장치

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6246482U (de) * 1985-09-06 1987-03-20
KR940006185Y1 (ko) * 1990-06-07 1994-09-10 가시오 게이상기 가부시끼가이샤 Ic 모듈
JPH0540274A (ja) 1990-09-13 1993-02-19 Canon Inc 液晶装置
JPH04216589A (ja) * 1990-12-18 1992-08-06 Mitsubishi Electric Corp 電子回路の接続構造
JPH04269722A (ja) 1991-02-26 1992-09-25 Rohm Co Ltd 表示装置
JPH04301817A (ja) * 1991-03-29 1992-10-26 Rohm Co Ltd 液晶表示装置とその製造方法
JP2801487B2 (ja) * 1992-04-30 1998-09-21 シャープ株式会社 パネルの実装構造および実装方法並びに樹脂供給硬化方法
DE69323597T2 (de) 1992-11-12 1999-08-19 Canon Kk Flüssigkristall-Anzeigevorrichtung
EP0604893B1 (de) 1992-12-26 2002-05-02 Canon Kabushiki Kaisha Flüssigkristallapparat
JPH06230405A (ja) 1993-02-04 1994-08-19 Nec Corp 液晶表示装置
US5467210A (en) * 1993-02-16 1995-11-14 Casio Computer Co., Ltd. Arrangement of bonding IC chip to liquid crystal display device
JP3096192B2 (ja) 1993-04-28 2000-10-10 京セラ株式会社 Ｉｃの実装構造および液晶ディスプレイ駆動用ｉｃの実装方法
JPH07321152A (ja) 1994-03-29 1995-12-08 Citizen Watch Co Ltd 半導体装置およびその製造方法
JP2798027B2 (ja) * 1995-11-29 1998-09-17 日本電気株式会社 液晶表示装置およびその製造方法
JP3459928B2 (ja) * 1996-07-04 2003-10-27 パイオニア株式会社 反射型液晶表示装置
KR100269947B1 (ko) * 1997-09-13 2000-10-16 윤종용 인쇄회로기판및이를이용한엘씨디모듈

Also Published As

Publication number Publication date
EP0795772A1 (de) 1997-09-17
DE69717331T2 (de) 2003-09-18
US6738123B1 (en) 2004-05-18
KR100257028B1 (ko) 2000-05-15
EP0795772B1 (de) 2002-11-27
KR970066684A (ko) 1997-10-13

Similar Documents

Publication Publication Date Title
DE69717331D1 (de) Kontaktierungsstruktur für Treiberschaltung und Anzeigevorrichtung mit dieser Kontaktierungsstruktur
DE69628634D1 (de) Beleuchtungsvorrichtung, flüssigkristallanzeige mit dieser beleuchtungsvorrichtung und elektronisches gerät
BR9706664A (pt) Pequeno aparelho eletrônico tendo mostrador funcional
DE69317133T2 (de) Flache Beleuchtungseinheit und eine LCD-Anzeigevorrichtung mit dieser Einheit
DE69500936T2 (de) Fahrzeug-Anzeigegerät
DE69736047D1 (de) Anzeigevorrichtung mit flacher Anzeigetafel
DE69814716D1 (de) Beleuchtungsvorrichtung, Flüssigkristallanzeigeeinheit und elektronisches Gerät
DE69512511T2 (de) Kartenanzeigegerät für fahrzeuge
DE69724340D1 (de) Flaches Anzeigegerät
DE69816240D1 (de) Rückbeleuchtungseinrichtung für eine LCD Anzeige
DE69329770T2 (de) Gerät mit Anzeige für Rundfunkbetriebsart
DE69421331D1 (de) Spannungskompensationsschaltung und Anzeigevorrichtung
DE69632764D1 (de) Stromversorgungsschaltung, stromversorgung für flüssigkristallanzeigevorrichtung und flüssigkristallanzeigevorrichtung
DE69711819T2 (de) Fahrzeug- Anzeigegerät
DE69728919D1 (de) Schaltungsplatine und Halbleiterbauteil mit dieser
DE69826386D1 (de) Anzeigevorrichtung und zeitmessgerät mit derselben
DE69817737D1 (de) Anzeigegerät für Fahrzeug
DE69606744T2 (de) Anzeigegerät am Armaturenbrett
DE69401258T2 (de) Halterung für flache Schaltungseinheiten und dafür verwendete flache Schaltungseinheiten
DE69424384D1 (de) Elektronisches Gerät mit Anzeigevorrichtung
DE69718919D1 (de) Anzeigevorrichtung mit mehreren zeichenorientierungen und messgerät mit dieser anzeigevorrichtung
DE69721217D1 (de) Gerät mit schaltungselement und übertragungsleitung
DE69906390T2 (de) Anzeige und hintergrundbeleuchtungsvorrichtung
DE69412714D1 (de) Ausgangstreiberschaltung für Niederspannungsgerät
DE69831213D1 (de) Einrichtung zur unwahrscheinlichkeitserfassung und mit dieser einrichtung ausgestattetes wiedergabegereät

Legal Events

Date Code Title Description
8364 No opposition during term of opposition