DE69717238D1 - Wafer-Haltevorrichtung - Google Patents

Wafer-Haltevorrichtung

Info

Publication number
DE69717238D1
DE69717238D1 DE69717238T DE69717238T DE69717238D1 DE 69717238 D1 DE69717238 D1 DE 69717238D1 DE 69717238 T DE69717238 T DE 69717238T DE 69717238 T DE69717238 T DE 69717238T DE 69717238 D1 DE69717238 D1 DE 69717238D1
Authority
DE
Germany
Prior art keywords
wafer stage
wafer
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69717238T
Other languages
English (en)
Other versions
DE69717238T2 (de
Inventor
Tokio Takei
Susumu Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of DE69717238D1 publication Critical patent/DE69717238D1/de
Application granted granted Critical
Publication of DE69717238T2 publication Critical patent/DE69717238T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Jigs For Machine Tools (AREA)
DE69717238T 1996-12-27 1997-12-19 Wafer-Haltevorrichtung Expired - Fee Related DE69717238T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP35798196A JPH10193260A (ja) 1996-12-27 1996-12-27 ウエーハ保持治具

Publications (2)

Publication Number Publication Date
DE69717238D1 true DE69717238D1 (de) 2003-01-02
DE69717238T2 DE69717238T2 (de) 2003-08-28

Family

ID=18456943

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69717238T Expired - Fee Related DE69717238T2 (de) 1996-12-27 1997-12-19 Wafer-Haltevorrichtung

Country Status (5)

Country Link
US (1) US5938512A (de)
EP (1) EP0850723B1 (de)
JP (1) JPH10193260A (de)
DE (1) DE69717238T2 (de)
TW (1) TW387110B (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4236292B2 (ja) * 1997-03-06 2009-03-11 日本碍子株式会社 ウエハー吸着装置およびその製造方法
JPH11138429A (ja) * 1997-11-11 1999-05-25 Sony Corp 研磨装置
JP3618220B2 (ja) * 1998-03-30 2005-02-09 信越半導体株式会社 薄板の研磨方法および薄板保持プレート
JPH11300608A (ja) * 1998-04-20 1999-11-02 Nec Corp 化学機械研磨装置
EP0953409B1 (de) * 1998-04-27 2005-11-16 Tokyo Seimitsu Co.,Ltd. Oberflächenbearbeitungsverfahren und Oberflächenbearbeitungsvorrichtung für Halbleiterscheiben
JP2907209B1 (ja) * 1998-05-29 1999-06-21 日本電気株式会社 ウェハ研磨装置用裏面パッド
JP3502550B2 (ja) * 1998-10-07 2004-03-02 株式会社東芝 研磨装置
US6187681B1 (en) * 1998-10-14 2001-02-13 Micron Technology, Inc. Method and apparatus for planarization of a substrate
US6344414B1 (en) * 1999-04-30 2002-02-05 International Business Machines Corporation Chemical-mechanical polishing system having a bi-material wafer backing film assembly
KR100331165B1 (ko) * 1999-08-05 2002-04-01 김도열 소자 일괄 제조용 지그 및 이를 이용한 소자 일괄 제조방법
WO2001096066A1 (en) * 2000-06-15 2001-12-20 Infineon Technologies North America Corp. Wafer polishing method
JP3433930B2 (ja) * 2001-02-16 2003-08-04 株式会社東京精密 ウェーハの平面加工装置及びその平面加工方法
JP2003103455A (ja) * 2001-09-28 2003-04-08 Shin Etsu Handotai Co Ltd ワーク保持盤並びにワークの研磨装置及び研磨方法
JP3892703B2 (ja) * 2001-10-19 2007-03-14 富士通株式会社 半導体基板用治具及びこれを用いた半導体装置の製造方法
US7018268B2 (en) * 2002-04-09 2006-03-28 Strasbaugh Protection of work piece during surface processing
JP2004022899A (ja) * 2002-06-18 2004-01-22 Shinko Electric Ind Co Ltd 薄シリコンウエーハの加工方法
JP2005268566A (ja) * 2004-03-19 2005-09-29 Ebara Corp 化学機械研磨装置の基板把持機構のヘッド構造
US20060211349A1 (en) * 2005-03-18 2006-09-21 Seh America, Inc. Wafer polishing template for polishing semiconductor wafers in a wax free polishing process
JP5205737B2 (ja) * 2006-10-13 2013-06-05 株式会社Ｓｕｍｃｏ シリコンウェーハの保持方法および保持治具
US20090036030A1 (en) * 2007-08-03 2009-02-05 Winbond Electronics Corp. Polishing head and chemical mechanical polishing process using the same
KR101036605B1 (ko) * 2008-06-30 2011-05-24 세메스 주식회사 기판 지지 유닛 및 이를 이용한 매엽식 기판 연마 장치
JP2011044472A (ja) * 2009-08-19 2011-03-03 Disco Abrasive Syst Ltd ウエーハの研削装置
JP2011044473A (ja) * 2009-08-19 2011-03-03 Disco Abrasive Syst Ltd ウエーハの研削装置
JP5943742B2 (ja) * 2012-07-04 2016-07-05 三菱電機株式会社 半導体試験治具およびそれを用いた半導体試験方法
JP2016051749A (ja) * 2014-08-29 2016-04-11 京セラ株式会社 吸着用部材
JP2016072350A (ja) * 2014-09-29 2016-05-09 京セラ株式会社 吸着用部材
CN108231648A (zh) * 2016-12-21 2018-06-29 山东浪潮华光光电子股份有限公司 一种GaAs基LED芯片减薄工艺中的贴片工装及贴片方法
US20180281151A1 (en) * 2017-03-30 2018-10-04 Applied Materials, Inc. Adhesive-less carriers for chemical mechanical polishing
JP2019111594A (ja) * 2017-12-21 2019-07-11 株式会社ディスコ チャックテーブル
CN108838870B (zh) * 2018-06-05 2020-02-14 南通瑞森光学股份有限公司 一种半导体晶圆研磨设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3731435A (en) * 1971-02-09 1973-05-08 Speedfam Corp Polishing machine load plate
US4521995A (en) * 1980-05-23 1985-06-11 Disco Co., Ltd. Wafer attracting and fixing device
JPS60103651U (ja) * 1983-12-19 1985-07-15 シチズン時計株式会社 真空吸着台
JPS62297063A (ja) * 1986-02-21 1987-12-24 Hitachi Ltd 薄片状部材研磨用真空チヤツク装置
JP2538511B2 (ja) * 1993-09-21 1996-09-25 住友シチックス株式会社 半導体基板の研磨用保持板
JPH08180026A (ja) * 1994-12-26 1996-07-12 Fuji Facom Corp 論理通信路管理方法
JP3072962B2 (ja) * 1995-11-30 2000-08-07 ロデール・ニッタ株式会社 研磨のための被加工物の保持具及びその製法

Also Published As

Publication number Publication date
JPH10193260A (ja) 1998-07-28
US5938512A (en) 1999-08-17
TW387110B (en) 2000-04-11
EP0850723B1 (de) 2002-11-20
EP0850723A1 (de) 1998-07-01
DE69717238T2 (de) 2003-08-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee