DE69618252T2 - Magnetischer Kompositartikel zur Unterdrückung von elektromagnetischen Interferenzen - Google Patents
Magnetischer Kompositartikel zur Unterdrückung von elektromagnetischen InterferenzenInfo
- Publication number
- DE69618252T2 DE69618252T2 DE69618252T DE69618252T DE69618252T2 DE 69618252 T2 DE69618252 T2 DE 69618252T2 DE 69618252 T DE69618252 T DE 69618252T DE 69618252 T DE69618252 T DE 69618252T DE 69618252 T2 DE69618252 T2 DE 69618252T2
- Authority
- DE
- Germany
- Prior art keywords
- magnetic
- powder
- soft magnetic
- article according
- composite article
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002131 composite material Substances 0.000 title claims description 26
- 239000006247 magnetic powder Substances 0.000 claims description 31
- 239000000843 powder Substances 0.000 claims description 25
- 239000000203 mixture Substances 0.000 claims description 21
- 239000002245 particle Substances 0.000 claims description 21
- 238000010438 heat treatment Methods 0.000 claims description 15
- 239000006249 magnetic particle Substances 0.000 claims description 8
- 239000007789 gas Substances 0.000 claims description 6
- 230000003647 oxidation Effects 0.000 claims description 6
- 238000007254 oxidation reaction Methods 0.000 claims description 6
- 239000011230 binding agent Substances 0.000 claims description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 230000002500 effect on skin Effects 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims 1
- 230000035699 permeability Effects 0.000 description 26
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 18
- 239000010408 film Substances 0.000 description 15
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 12
- 229910021364 Al-Si alloy Inorganic materials 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 239000000696 magnetic material Substances 0.000 description 8
- 229920005749 polyurethane resin Polymers 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- 239000007858 starting material Substances 0.000 description 7
- -1 Isocyanate compound Chemical class 0.000 description 6
- 239000012948 isocyanate Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 230000001629 suppression Effects 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 230000005347 demagnetization Effects 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 230000004044 response Effects 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 238000007731 hot pressing Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- DOTMOQHOJINYBL-UHFFFAOYSA-N molecular nitrogen;molecular oxygen Chemical compound N#N.O=O DOTMOQHOJINYBL-UHFFFAOYSA-N 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000010301 surface-oxidation reaction Methods 0.000 description 3
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910002065 alloy metal Inorganic materials 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000010295 mobile communication Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 229910017107 AlOx Inorganic materials 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 229910000808 amorphous metal alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910000889 permalloy Inorganic materials 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910000702 sendust Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000005211 surface analysis Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000009692 water atomization Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
- H01F1/28—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder dispersed or suspended in a bonding agent
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Soft Magnetic Materials (AREA)
- Hard Magnetic Materials (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
- Aerials With Secondary Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7244096A JPH0993034A (ja) | 1995-09-22 | 1995-09-22 | 複合磁性体及びその製造方法ならびに電磁干渉抑制体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69618252D1 DE69618252D1 (de) | 2002-01-31 |
| DE69618252T2 true DE69618252T2 (de) | 2002-08-22 |
Family
ID=17113698
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69618252T Expired - Lifetime DE69618252T2 (de) | 1995-09-22 | 1996-09-17 | Magnetischer Kompositartikel zur Unterdrückung von elektromagnetischen Interferenzen |
| DE69608933T Expired - Lifetime DE69608933T2 (de) | 1995-09-22 | 1996-09-17 | Magnetisches Kompositartikel zur Unterdrückung von elektromagnetischen Interferenzen |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69608933T Expired - Lifetime DE69608933T2 (de) | 1995-09-22 | 1996-09-17 | Magnetisches Kompositartikel zur Unterdrückung von elektromagnetischen Interferenzen |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US5827445A (enExample) |
| EP (2) | EP0764954B1 (enExample) |
| JP (1) | JPH0993034A (enExample) |
| KR (1) | KR100247444B1 (enExample) |
| CN (1) | CN1097270C (enExample) |
| DE (2) | DE69618252T2 (enExample) |
| MY (1) | MY115205A (enExample) |
| SG (1) | SG48471A1 (enExample) |
| TW (1) | TW304269B (enExample) |
Families Citing this family (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0935927A (ja) * | 1995-07-20 | 1997-02-07 | Tokin Corp | 複合磁性体及びそれを用いた電磁干渉抑制体 |
| US6972097B2 (en) * | 1995-07-20 | 2005-12-06 | Nec Tokin Corporation | Composite magnetic material and electromagnetic interference suppressor member using the same |
| JP3608063B2 (ja) | 1996-08-23 | 2005-01-05 | Ｎｅｃトーキン株式会社 | Ｅｍｉ対策部品及びそれを備えた能動素子 |
| JP3404618B2 (ja) * | 1996-09-02 | 2003-05-12 | エヌイーシートーキン株式会社 | 電磁干渉抑制体 |
| DE69731727T2 (de) * | 1996-09-03 | 2005-11-10 | Nec Tokin Corp., Sendai | Verfahren zum herstellen von magnetischer verbundfolie |
| US6521140B2 (en) * | 1996-09-06 | 2003-02-18 | Nec Tokin Corp. | Composite magnetic body and electromagnetic interference suppressing body using the same |
| JP3475386B2 (ja) * | 1997-09-01 | 2003-12-08 | Ｎｅｃトーキン株式会社 | 電磁干渉抑制体 |
| JPH11112229A (ja) * | 1997-10-07 | 1999-04-23 | Tokin Corp | 複合磁性体，その製造方法，及びそれを用いた電磁干渉抑制体 |
| JPH11214912A (ja) * | 1998-01-27 | 1999-08-06 | Tokin Corp | 指向性アンテナ |
| WO2001024205A1 (en) * | 1999-09-28 | 2001-04-05 | Tokin Corporation | Composite magnetic sheet and method of producing the same |
| JP2001126910A (ja) * | 1999-10-25 | 2001-05-11 | Tokin Corp | 複合磁性体、複合磁性体シートおよびそれらの製造方法 |
| US6586046B1 (en) | 2000-01-26 | 2003-07-01 | General Electric Company | Fluidized bed apparatus and method for treatment of nonspherical, nonequiaxed particles |
| JP2001210510A (ja) * | 2000-01-28 | 2001-08-03 | Tokin Corp | 軟磁性粉末及びそれを用いた複合磁性体 |
| JP2001297905A (ja) * | 2000-04-17 | 2001-10-26 | Tokin Corp | 高周波電流抑制体 |
| KR20020040678A (ko) * | 2000-04-17 | 2002-05-30 | 하네타 유이치 | 케이블 등에 쉽게 부착될 수 있는 고주파 전류 억제체 및이를 사용하는 이어폰 시스템 |
| GB0211443D0 (en) * | 2002-05-18 | 2002-06-26 | Qinetiq Ltd | Microwave absorbent material |
| US20040041121A1 (en) * | 2002-08-30 | 2004-03-04 | Shigeyoshi Yoshida | Magnetic loss material and method of producing the same |
| US6914183B2 (en) * | 2002-09-25 | 2005-07-05 | Sumitomo Electric Industries, Ltd. | Board for printed wiring |
| US7868723B2 (en) * | 2003-02-26 | 2011-01-11 | Analogic Corporation | Power coupling device |
| US9490063B2 (en) | 2003-02-26 | 2016-11-08 | Analogic Corporation | Shielded power coupling device |
| US8350655B2 (en) * | 2003-02-26 | 2013-01-08 | Analogic Corporation | Shielded power coupling device |
| US9368272B2 (en) | 2003-02-26 | 2016-06-14 | Analogic Corporation | Shielded power coupling device |
| US7625633B2 (en) | 2003-03-25 | 2009-12-01 | Shin-Etsu Polymer., Ltd. | Electromagnetic noise suppressor, article with electromagnetic noise suppressing function, and their manufacturing methods |
| JP4010296B2 (ja) * | 2003-11-20 | 2007-11-21 | 株式会社デンソー | 軟磁性粉末材料の製造方法 |
| JP4417377B2 (ja) | 2004-02-24 | 2010-02-17 | 信越ポリマー株式会社 | 電磁波ノイズ抑制体、電磁波ノイズ抑制機能付構造体、およびそれらの製造方法 |
| US8134084B2 (en) | 2006-06-30 | 2012-03-13 | Shin-Etsu Polymer Co., Ltd. | Noise-suppressing wiring-member and printed wiring board |
| JP4692768B2 (ja) * | 2006-12-08 | 2011-06-01 | 住友電気工業株式会社 | 軟磁性複合材料 |
| CN101231707A (zh) * | 2007-01-25 | 2008-07-30 | 3M创新有限公司 | 电磁屏蔽装置 |
| US9972913B2 (en) | 2009-12-15 | 2018-05-15 | Asahi Kasei Fibers Corporation | Noise absorbing fabric |
| JP2011129798A (ja) * | 2009-12-21 | 2011-06-30 | Mitsumi Electric Co Ltd | 高周波用磁性材料、高周波デバイス及び磁性粒子 |
| JP4692859B2 (ja) * | 2010-08-19 | 2011-06-01 | 住友電気工業株式会社 | リアクトル |
| DE102014215318A1 (de) * | 2014-08-04 | 2016-02-04 | Siemens Aktiengesellschaft | Anisotrop weichmagnetisches Komposit-Material mit hoher Anisotropie der Permeabilität zur Unterdrückung von Querfluss und dessen Herstellung |
| US11229147B2 (en) | 2015-02-06 | 2022-01-18 | Laird Technologies, Inc. | Thermally-conductive electromagnetic interference (EMI) absorbers with silicon carbide |
| US10287413B2 (en) | 2016-12-19 | 2019-05-14 | 3M Innovative Properties Company | Thermoplastic polymer composite containing soft, ferromagnetic particulate material and methods of making thereof |
| CN111357061B (zh) | 2017-11-16 | 2022-04-12 | 3M创新有限公司 | 包含介电粒子的聚合物基质复合材料及其制备方法 |
| US10927228B2 (en) | 2017-11-16 | 2021-02-23 | 3M Innovative Properties Company | Polymer matrix composites comprising intumescent particles and methods of making the same |
| CN111491991A (zh) | 2017-11-16 | 2020-08-04 | 3M创新有限公司 | 制备聚合物基质复合材料的方法 |
| US10836873B2 (en) | 2017-11-16 | 2020-11-17 | 3M Innovative Properties Company | Polymer matrix composites comprising thermally insulating particles and methods of making the same |
| JP7308828B2 (ja) | 2017-11-16 | 2023-07-14 | スリーエム イノベイティブ プロパティズ カンパニー | 機能性粒子を含むポリマーマトリックス複合体及びその製造方法 |
| US10913834B2 (en) | 2017-11-16 | 2021-02-09 | 3M Innovative Properties Company | Polymer matrix composites comprising indicator particles and methods of making the same |
| WO2019099011A1 (en) * | 2017-11-16 | 2019-05-23 | Georgia Tech Research Corporation | Substrate-compatible inductors with magnetic layers |
| CN113840868A (zh) | 2019-05-15 | 2021-12-24 | 3M创新有限公司 | 包含导热颗粒和磁性颗粒的(共)聚合物基质复合材料及其制备方法 |
| KR102771530B1 (ko) * | 2019-07-19 | 2025-02-20 | 현대자동차주식회사 | 자기유변 탄성체 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1024647B (de) * | 1954-11-24 | 1958-02-20 | Deutsche Edelstahlwerke Ag | Ferromagnetische Bestandteile enthaltender, magnetisch haftender, biegsamer Formkoerper |
| FR1152152A (fr) * | 1956-03-20 | 1958-02-12 | Thomson Houston Comp Francaise | Matière anti-réflectrice absorbant les ondes hertziennes |
| US2873225A (en) * | 1957-05-20 | 1959-02-10 | Adams Edmond | Magnetic flake core |
| JPS62221199A (ja) * | 1986-03-24 | 1987-09-29 | 株式会社 リケン | 磁気シ−ルド材 |
| GB2232165A (en) * | 1989-03-22 | 1990-12-05 | Cookson Group Plc | Magnetic compositions |
| US5352268A (en) * | 1989-12-12 | 1994-10-04 | Hitachi Metals, Ltd. | Fe-Ni alloy fine powder of flat shape |
| US5207841A (en) * | 1990-04-12 | 1993-05-04 | Tdk Corporation | Soft magnetic powder and magnetic shield composition |
| JPH04276002A (ja) * | 1991-02-28 | 1992-10-01 | Hitachi Metals Ltd | 扁平状軟磁性Ｆｅ−Ｃｏ合金微粉末 |
| DE4124458A1 (de) * | 1991-07-24 | 1993-01-28 | Degussa | Emi-abschirmpigmente, verfahren zu deren herstellung und deren verwendung |
| JP3401650B2 (ja) * | 1994-01-20 | 2003-04-28 | エヌイーシートーキン株式会社 | 電磁波干渉抑制体 |
| FI117224B (fi) * | 1994-01-20 | 2006-07-31 | Nec Tokin Corp | Sähkömagneettinen häiriönpoistokappale, ja sitä soveltavat elektroninen laite ja hybridimikropiirielementti |
-
1995
- 1995-09-22 JP JP7244096A patent/JPH0993034A/ja active Pending
-
1996
- 1996-09-17 EP EP96114895A patent/EP0764954B1/en not_active Expired - Lifetime
- 1996-09-17 DE DE69618252T patent/DE69618252T2/de not_active Expired - Lifetime
- 1996-09-17 DE DE69608933T patent/DE69608933T2/de not_active Expired - Lifetime
- 1996-09-17 EP EP99114943A patent/EP0951023B1/en not_active Expired - Lifetime
- 1996-09-17 US US08/714,805 patent/US5827445A/en not_active Expired - Lifetime
- 1996-09-18 MY MYPI96003855A patent/MY115205A/en unknown
- 1996-09-20 KR KR1019960041006A patent/KR100247444B1/ko not_active Expired - Lifetime
- 1996-09-20 CN CN96112346A patent/CN1097270C/zh not_active Expired - Lifetime
- 1996-09-20 SG SG1996010660A patent/SG48471A1/en unknown
- 1996-09-20 TW TW085111510A patent/TW304269B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| SG48471A1 (en) | 1998-04-17 |
| EP0951023A2 (en) | 1999-10-20 |
| CN1149747A (zh) | 1997-05-14 |
| EP0951023A3 (en) | 1999-11-03 |
| CN1097270C (zh) | 2002-12-25 |
| EP0951023B1 (en) | 2001-12-19 |
| EP0764954B1 (en) | 2000-06-21 |
| EP0764954A1 (en) | 1997-03-26 |
| US5827445A (en) | 1998-10-27 |
| DE69608933D1 (de) | 2000-07-27 |
| KR100247444B1 (ko) | 2000-03-15 |
| JPH0993034A (ja) | 1997-04-04 |
| DE69608933T2 (de) | 2000-11-16 |
| DE69618252D1 (de) | 2002-01-31 |
| MY115205A (en) | 2003-04-30 |
| TW304269B (enExample) | 1997-05-01 |
| KR970017717A (ko) | 1997-04-30 |
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