DE69618252D1 - Magnetischer Kompositartikel zur Unterdrückung von elektromagnetischen Interferenzen - Google Patents
Magnetischer Kompositartikel zur Unterdrückung von elektromagnetischen InterferenzenInfo
- Publication number
- DE69618252D1 DE69618252D1 DE69618252T DE69618252T DE69618252D1 DE 69618252 D1 DE69618252 D1 DE 69618252D1 DE 69618252 T DE69618252 T DE 69618252T DE 69618252 T DE69618252 T DE 69618252T DE 69618252 D1 DE69618252 D1 DE 69618252D1
- Authority
- DE
- Germany
- Prior art keywords
- electromagnetic interference
- composite magnetic
- suppressing electromagnetic
- magnetic article
- article
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
- H01F1/28—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder dispersed or suspended in a bonding agent
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Soft Magnetic Materials (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Hard Magnetic Materials (AREA)
- Laminated Bodies (AREA)
- Aerials With Secondary Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7244096A JPH0993034A (ja) | 1995-09-22 | 1995-09-22 | 複合磁性体及びその製造方法ならびに電磁干渉抑制体 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69618252D1 true DE69618252D1 (de) | 2002-01-31 |
DE69618252T2 DE69618252T2 (de) | 2002-08-22 |
Family
ID=17113698
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69608933T Expired - Lifetime DE69608933T2 (de) | 1995-09-22 | 1996-09-17 | Magnetisches Kompositartikel zur Unterdrückung von elektromagnetischen Interferenzen |
DE69618252T Expired - Lifetime DE69618252T2 (de) | 1995-09-22 | 1996-09-17 | Magnetischer Kompositartikel zur Unterdrückung von elektromagnetischen Interferenzen |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69608933T Expired - Lifetime DE69608933T2 (de) | 1995-09-22 | 1996-09-17 | Magnetisches Kompositartikel zur Unterdrückung von elektromagnetischen Interferenzen |
Country Status (9)
Country | Link |
---|---|
US (1) | US5827445A (de) |
EP (2) | EP0951023B1 (de) |
JP (1) | JPH0993034A (de) |
KR (1) | KR100247444B1 (de) |
CN (1) | CN1097270C (de) |
DE (2) | DE69608933T2 (de) |
MY (1) | MY115205A (de) |
SG (1) | SG48471A1 (de) |
TW (1) | TW304269B (de) |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6972097B2 (en) * | 1995-07-20 | 2005-12-06 | Nec Tokin Corporation | Composite magnetic material and electromagnetic interference suppressor member using the same |
JPH0935927A (ja) * | 1995-07-20 | 1997-02-07 | Tokin Corp | 複合磁性体及びそれを用いた電磁干渉抑制体 |
JP3608063B2 (ja) | 1996-08-23 | 2005-01-05 | Necトーキン株式会社 | Emi対策部品及びそれを備えた能動素子 |
JP3404618B2 (ja) * | 1996-09-02 | 2003-05-12 | エヌイーシートーキン株式会社 | 電磁干渉抑制体 |
KR100475768B1 (ko) * | 1996-09-03 | 2005-05-16 | 엔이씨 도낀 가부시끼가이샤 | 복합자성시트의제조방법 |
US6521140B2 (en) * | 1996-09-06 | 2003-02-18 | Nec Tokin Corp. | Composite magnetic body and electromagnetic interference suppressing body using the same |
JP3475386B2 (ja) * | 1997-09-01 | 2003-12-08 | Necトーキン株式会社 | 電磁干渉抑制体 |
JPH11112229A (ja) * | 1997-10-07 | 1999-04-23 | Tokin Corp | 複合磁性体,その製造方法,及びそれを用いた電磁干渉抑制体 |
JPH11214912A (ja) * | 1998-01-27 | 1999-08-06 | Tokin Corp | 指向性アンテナ |
CN1246868C (zh) * | 1999-09-28 | 2006-03-22 | Nec东金株式会社 | 一种制造复合磁体的方法 |
JP2001126910A (ja) * | 1999-10-25 | 2001-05-11 | Tokin Corp | 複合磁性体、複合磁性体シートおよびそれらの製造方法 |
US6586046B1 (en) | 2000-01-26 | 2003-07-01 | General Electric Company | Fluidized bed apparatus and method for treatment of nonspherical, nonequiaxed particles |
JP2001210510A (ja) * | 2000-01-28 | 2001-08-03 | Tokin Corp | 軟磁性粉末及びそれを用いた複合磁性体 |
JP2001297905A (ja) * | 2000-04-17 | 2001-10-26 | Tokin Corp | 高周波電流抑制体 |
DE60101767T2 (de) * | 2000-04-17 | 2004-12-02 | Nec Tokin Corp., Sendai | An einem kabel oder dergleichen zu befestigende hochfrequenz-entstörvorrichtung sowie diese verwendende hörkapsel |
GB0211443D0 (en) * | 2002-05-18 | 2002-06-26 | Qinetiq Ltd | Microwave absorbent material |
US20040041121A1 (en) * | 2002-08-30 | 2004-03-04 | Shigeyoshi Yoshida | Magnetic loss material and method of producing the same |
US6914183B2 (en) * | 2002-09-25 | 2005-07-05 | Sumitomo Electric Industries, Ltd. | Board for printed wiring |
US8350655B2 (en) * | 2003-02-26 | 2013-01-08 | Analogic Corporation | Shielded power coupling device |
US9490063B2 (en) | 2003-02-26 | 2016-11-08 | Analogic Corporation | Shielded power coupling device |
US9368272B2 (en) | 2003-02-26 | 2016-06-14 | Analogic Corporation | Shielded power coupling device |
US7868723B2 (en) * | 2003-02-26 | 2011-01-11 | Analogic Corporation | Power coupling device |
WO2004086837A1 (ja) | 2003-03-25 | 2004-10-07 | Shin-Etsu Polymer Co., Ltd. | 電磁波ノイズ抑制体、電磁波ノイズ抑制機能付物品、およびそれらの製造方法 |
JP4010296B2 (ja) * | 2003-11-20 | 2007-11-21 | 株式会社デンソー | 軟磁性粉末材料の製造方法 |
WO2005081609A1 (ja) | 2004-02-24 | 2005-09-01 | Shin-Etsu Polymer Co., Ltd. | 電磁波ノイズ抑制体、電磁波ノイズ抑制機能付構造体、およびそれらの製造方法 |
US8134084B2 (en) | 2006-06-30 | 2012-03-13 | Shin-Etsu Polymer Co., Ltd. | Noise-suppressing wiring-member and printed wiring board |
JP4692768B2 (ja) * | 2006-12-08 | 2011-06-01 | 住友電気工業株式会社 | 軟磁性複合材料 |
CN101231707A (zh) * | 2007-01-25 | 2008-07-30 | 3M创新有限公司 | 电磁屏蔽装置 |
JP5722608B2 (ja) | 2009-12-15 | 2015-05-20 | 旭化成せんい株式会社 | ノイズ吸収布帛 |
JP2011129798A (ja) * | 2009-12-21 | 2011-06-30 | Mitsumi Electric Co Ltd | 高周波用磁性材料、高周波デバイス及び磁性粒子 |
JP4692859B2 (ja) * | 2010-08-19 | 2011-06-01 | 住友電気工業株式会社 | リアクトル |
DE102014215318A1 (de) * | 2014-08-04 | 2016-02-04 | Siemens Aktiengesellschaft | Anisotrop weichmagnetisches Komposit-Material mit hoher Anisotropie der Permeabilität zur Unterdrückung von Querfluss und dessen Herstellung |
US11229147B2 (en) | 2015-02-06 | 2022-01-18 | Laird Technologies, Inc. | Thermally-conductive electromagnetic interference (EMI) absorbers with silicon carbide |
US10287413B2 (en) | 2016-12-19 | 2019-05-14 | 3M Innovative Properties Company | Thermoplastic polymer composite containing soft, ferromagnetic particulate material and methods of making thereof |
EP3710156A1 (de) | 2017-11-16 | 2020-09-23 | 3M Innovative Properties Company | Polymermatrixverbundstoffe mit funktionellen teilchen und verfahren zu ihrer herstellung |
JP2021503718A (ja) * | 2017-11-16 | 2021-02-12 | ジョージア テック リサーチ コーポレイション | 磁性層を有する基板対応インダクタ |
CN111491991A (zh) | 2017-11-16 | 2020-08-04 | 3M创新有限公司 | 制备聚合物基质复合材料的方法 |
CN111357061B (zh) | 2017-11-16 | 2022-04-12 | 3M创新有限公司 | 包含介电粒子的聚合物基质复合材料及其制备方法 |
US10927228B2 (en) | 2017-11-16 | 2021-02-23 | 3M Innovative Properties Company | Polymer matrix composites comprising intumescent particles and methods of making the same |
US10913834B2 (en) | 2017-11-16 | 2021-02-09 | 3M Innovative Properties Company | Polymer matrix composites comprising indicator particles and methods of making the same |
US10836873B2 (en) | 2017-11-16 | 2020-11-17 | 3M Innovative Properties Company | Polymer matrix composites comprising thermally insulating particles and methods of making the same |
US20220259398A1 (en) | 2019-05-15 | 2022-08-18 | 3M Innovative Properties Company | (co)polymer matrix composites comprising thermally-conductive particles and magnetic particles and methods of making the same |
KR20210010175A (ko) * | 2019-07-19 | 2021-01-27 | 현대자동차주식회사 | 자기유변 탄성체 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1024647B (de) * | 1954-11-24 | 1958-02-20 | Deutsche Edelstahlwerke Ag | Ferromagnetische Bestandteile enthaltender, magnetisch haftender, biegsamer Formkoerper |
FR1152152A (fr) * | 1956-03-20 | 1958-02-12 | Thomson Houston Comp Francaise | Matière anti-réflectrice absorbant les ondes hertziennes |
US2873225A (en) * | 1957-05-20 | 1959-02-10 | Adams Edmond | Magnetic flake core |
JPS62221199A (ja) * | 1986-03-24 | 1987-09-29 | 株式会社 リケン | 磁気シ−ルド材 |
GB2232165A (en) * | 1989-03-22 | 1990-12-05 | Cookson Group Plc | Magnetic compositions |
US5352268A (en) * | 1989-12-12 | 1994-10-04 | Hitachi Metals, Ltd. | Fe-Ni alloy fine powder of flat shape |
US5207841A (en) * | 1990-04-12 | 1993-05-04 | Tdk Corporation | Soft magnetic powder and magnetic shield composition |
JPH04276002A (ja) * | 1991-02-28 | 1992-10-01 | Hitachi Metals Ltd | 扁平状軟磁性Fe−Co合金微粉末 |
DE4124458A1 (de) * | 1991-07-24 | 1993-01-28 | Degussa | Emi-abschirmpigmente, verfahren zu deren herstellung und deren verwendung |
JP3401650B2 (ja) * | 1994-01-20 | 2003-04-28 | エヌイーシートーキン株式会社 | 電磁波干渉抑制体 |
FI117224B (fi) * | 1994-01-20 | 2006-07-31 | Nec Tokin Corp | Sähkömagneettinen häiriönpoistokappale, ja sitä soveltavat elektroninen laite ja hybridimikropiirielementti |
-
1995
- 1995-09-22 JP JP7244096A patent/JPH0993034A/ja active Pending
-
1996
- 1996-09-17 DE DE69608933T patent/DE69608933T2/de not_active Expired - Lifetime
- 1996-09-17 EP EP99114943A patent/EP0951023B1/de not_active Expired - Lifetime
- 1996-09-17 EP EP96114895A patent/EP0764954B1/de not_active Expired - Lifetime
- 1996-09-17 DE DE69618252T patent/DE69618252T2/de not_active Expired - Lifetime
- 1996-09-17 US US08/714,805 patent/US5827445A/en not_active Expired - Lifetime
- 1996-09-18 MY MYPI96003855A patent/MY115205A/en unknown
- 1996-09-20 CN CN96112346A patent/CN1097270C/zh not_active Expired - Lifetime
- 1996-09-20 KR KR1019960041006A patent/KR100247444B1/ko not_active IP Right Cessation
- 1996-09-20 TW TW085111510A patent/TW304269B/zh not_active IP Right Cessation
- 1996-09-20 SG SG1996010660A patent/SG48471A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
TW304269B (de) | 1997-05-01 |
DE69608933D1 (de) | 2000-07-27 |
KR100247444B1 (ko) | 2000-03-15 |
EP0951023A3 (de) | 1999-11-03 |
CN1097270C (zh) | 2002-12-25 |
KR970017717A (ko) | 1997-04-30 |
EP0764954B1 (de) | 2000-06-21 |
US5827445A (en) | 1998-10-27 |
SG48471A1 (en) | 1998-04-17 |
EP0951023B1 (de) | 2001-12-19 |
CN1149747A (zh) | 1997-05-14 |
MY115205A (en) | 2003-04-30 |
DE69608933T2 (de) | 2000-11-16 |
EP0764954A1 (de) | 1997-03-26 |
EP0951023A2 (de) | 1999-10-20 |
JPH0993034A (ja) | 1997-04-04 |
DE69618252T2 (de) | 2002-08-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8363 | Opposition against the patent | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: NEC TOKIN CORP., SENDAI, MIYAGI, JP |
|
8365 | Fully valid after opposition proceedings |