DE69616684D1 - Form zur Harzverkapselung - Google Patents
Form zur HarzverkapselungInfo
- Publication number
- DE69616684D1 DE69616684D1 DE69616684T DE69616684T DE69616684D1 DE 69616684 D1 DE69616684 D1 DE 69616684D1 DE 69616684 T DE69616684 T DE 69616684T DE 69616684 T DE69616684 T DE 69616684T DE 69616684 D1 DE69616684 D1 DE 69616684D1
- Authority
- DE
- Germany
- Prior art keywords
- resin encapsulation
- encapsulation mold
- mold
- resin
- encapsulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
- B29C45/372—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings provided with means for marking or patterning, e.g. numbering articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19977195 | 1995-08-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69616684D1 true DE69616684D1 (de) | 2001-12-13 |
DE69616684T2 DE69616684T2 (de) | 2002-05-08 |
Family
ID=16413347
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69616684T Expired - Fee Related DE69616684T2 (de) | 1995-08-04 | 1996-08-02 | Form zur Harzverkapselung |
Country Status (7)
Country | Link |
---|---|
US (1) | US5817208A (de) |
EP (1) | EP0756925B1 (de) |
KR (1) | KR970013247A (de) |
CN (1) | CN1159754C (de) |
DE (1) | DE69616684T2 (de) |
SG (1) | SG43395A1 (de) |
TW (1) | TW367608B (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1079400A (ja) * | 1996-09-05 | 1998-03-24 | Oki Electric Ind Co Ltd | 半導体装置の実装方法及び半導体装置の構造 |
US6294411B1 (en) * | 1996-10-25 | 2001-09-25 | Nippon Steel Semiconductor Corporation | Method for molding a semiconductor device utilizing a satin finish |
JP3742211B2 (ja) * | 1998-02-09 | 2006-02-01 | シャープ株式会社 | 半導体装置のモールド金型およびマーキング方法 |
JP3607655B2 (ja) * | 2001-09-26 | 2005-01-05 | 株式会社東芝 | マウント材、半導体装置及び半導体装置の製造方法 |
US20050054126A1 (en) * | 2003-08-29 | 2005-03-10 | Texas Instruments Incorporated | System and method for marking the surface of a semiconductor package |
US20060166381A1 (en) * | 2005-01-26 | 2006-07-27 | Lange Bernhard P | Mold cavity identification markings for IC packages |
US20070011883A1 (en) * | 2005-07-06 | 2007-01-18 | Chang Ming Y | Mark having identifying device |
JP2007080923A (ja) * | 2005-09-12 | 2007-03-29 | Oki Electric Ind Co Ltd | 半導体パッケージの形成方法及び半導体パッケージを形成するための金型 |
ATE551668T1 (de) * | 2006-11-17 | 2012-04-15 | Oberthur Technologies | Verfahren zur herstellung einer entität und entsprechende vorrichtung |
WO2009008259A1 (ja) * | 2007-07-09 | 2009-01-15 | Konica Minolta Opto, Inc. | 撮像装置の製造方法、撮像装置及び携帯端末 |
JP5076198B2 (ja) * | 2008-02-15 | 2012-11-21 | 三菱電機株式会社 | 樹脂成形部品とその製造方法 |
JP5180722B2 (ja) * | 2008-07-30 | 2013-04-10 | オンセミコンダクター・トレーディング・リミテッド | 半導体装置の製造方法 |
SG173986A1 (en) * | 2010-03-01 | 2011-09-29 | Asm Tech Singapore Pte Ltd | Apparatus for molding electronic components |
JP5655406B2 (ja) * | 2010-07-20 | 2015-01-21 | セントラル硝子株式会社 | モール成形用金型および該金型を用いた装飾モール付きガラスの製造方法 |
DE102016107142A1 (de) * | 2016-04-18 | 2017-10-19 | Gerresheimer Regensburg Gmbh | Vorrichtung zum Kennzeichnen von Spritzgussteilen, Verfahren hierfür und Spritzgusswerkzeug |
CN105835312A (zh) * | 2016-04-28 | 2016-08-10 | 芜湖市万华塑料制品有限公司 | 绝缘骨架螺旋印码注塑模具 |
CN106782038B (zh) * | 2016-12-20 | 2022-12-13 | 深圳市华星祥科技有限公司 | 金属树脂立体商标及金属树脂立体商标的成型方法 |
JP7255415B2 (ja) * | 2019-08-02 | 2023-04-11 | コニカミノルタ株式会社 | 射出成形用金型および製造方法 |
CN110867535B (zh) * | 2019-11-14 | 2022-10-21 | 宇龙计算机通信科技(深圳)有限公司 | 压合夹具及壳体的制作方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4384702A (en) * | 1982-03-09 | 1983-05-24 | Boris Boskovic | Mold insert |
JPS5928350A (ja) * | 1982-08-09 | 1984-02-15 | Nec Corp | 樹脂封止型半導体装置用金型 |
JPS60193347A (ja) * | 1984-03-15 | 1985-10-01 | Toshiba Corp | 半導体製造装置 |
JPS617635A (ja) * | 1984-06-22 | 1986-01-14 | Toshiba Corp | 電子部品の樹脂封止用金型 |
NL8501556A (nl) * | 1985-05-30 | 1986-12-16 | Stork Pmt | Ontkroppingsmachine. |
JPS61284932A (ja) * | 1985-06-11 | 1986-12-15 | Nec Yamagata Ltd | 半導体製造用樹脂封入金型 |
JPS62221138A (ja) * | 1986-03-24 | 1987-09-29 | Akita Denshi Kk | 半導体装置およびその製造に用いるモ−ルド金型 |
WO1989002831A1 (en) * | 1987-10-01 | 1989-04-06 | Friedrich Medloby | Indicator device |
FR2644610A1 (fr) * | 1989-03-14 | 1990-09-21 | Renault | Dispositif automatique de numerotation de pieces obtenues par moulage |
CH679917A5 (en) * | 1989-11-15 | 1992-05-15 | Raichle Sportschuh Ag | Data markings on e.g. injection mouldings - are produced by setting into mould tool e.g. flat plate with markings, each with sec. marking adjusted by screwdriver slot |
JPH0422142A (ja) * | 1990-05-16 | 1992-01-27 | Sharp Corp | モールド金型およびこれを利用した光結合装置の製造方法 |
JPH06120281A (ja) * | 1992-10-08 | 1994-04-28 | Hitachi Ltd | モールド金型及びこれを用いたモールド装置 |
JP3339602B2 (ja) * | 1994-06-03 | 2002-10-28 | ローム株式会社 | パワー用半導体装置の製造方法 |
-
1996
- 1996-08-01 US US08/691,845 patent/US5817208A/en not_active Expired - Fee Related
- 1996-08-02 SG SG1996010416A patent/SG43395A1/en unknown
- 1996-08-02 DE DE69616684T patent/DE69616684T2/de not_active Expired - Fee Related
- 1996-08-02 EP EP96112534A patent/EP0756925B1/de not_active Expired - Lifetime
- 1996-08-03 KR KR19960032505A patent/KR970013247A/ko not_active Application Discontinuation
- 1996-08-05 CN CNB961116471A patent/CN1159754C/zh not_active Expired - Fee Related
- 1996-08-05 TW TW085109559A patent/TW367608B/zh active
Also Published As
Publication number | Publication date |
---|---|
EP0756925B1 (de) | 2001-11-07 |
EP0756925A1 (de) | 1997-02-05 |
US5817208A (en) | 1998-10-06 |
KR970013247A (de) | 1997-03-29 |
CN1159754C (zh) | 2004-07-28 |
DE69616684T2 (de) | 2002-05-08 |
SG43395A1 (en) | 1997-10-17 |
TW367608B (en) | 1999-08-21 |
CN1156330A (zh) | 1997-08-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |