WO2009008259A1 - 撮像装置の製造方法、撮像装置及び携帯端末 - Google Patents
撮像装置の製造方法、撮像装置及び携帯端末 Download PDFInfo
- Publication number
- WO2009008259A1 WO2009008259A1 PCT/JP2008/061450 JP2008061450W WO2009008259A1 WO 2009008259 A1 WO2009008259 A1 WO 2009008259A1 JP 2008061450 W JP2008061450 W JP 2008061450W WO 2009008259 A1 WO2009008259 A1 WO 2009008259A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- imaging
- imaging device
- imaging elements
- substrate
- elements
- Prior art date
Links
- 238000003384 imaging method Methods 0.000 title abstract 16
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 2
- 230000003287 optical effect Effects 0.000 abstract 2
- 229910052710 silicon Inorganic materials 0.000 abstract 2
- 239000010703 silicon Substances 0.000 abstract 2
- 238000000465 moulding Methods 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/0056—Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/022—Mountings, adjusting means, or light-tight connections, for optical elements for lenses lens and mount having complementary engagement means, e.g. screw/thread
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14687—Wafer level processing
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/162—Disposition
- H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optics & Photonics (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Studio Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/664,880 US20100182483A1 (en) | 2007-07-09 | 2008-06-24 | Manufacturing Method Of Imaging Device, Imaging Device, and Mobile Terminal |
JP2009522572A JPWO2009008259A1 (ja) | 2007-07-09 | 2008-06-24 | 撮像装置の製造方法、撮像装置及び携帯端末 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007179529 | 2007-07-09 | ||
JP2007-179529 | 2007-07-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009008259A1 true WO2009008259A1 (ja) | 2009-01-15 |
Family
ID=40228438
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/061450 WO2009008259A1 (ja) | 2007-07-09 | 2008-06-24 | 撮像装置の製造方法、撮像装置及び携帯端末 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20100182483A1 (ja) |
JP (1) | JPWO2009008259A1 (ja) |
WO (1) | WO2009008259A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011165774A (ja) * | 2010-02-05 | 2011-08-25 | Canon Inc | 固体撮像装置の製造方法 |
EP2388821A1 (en) * | 2010-05-17 | 2011-11-23 | Kingpak Technology Inc. | Manufacturing method and structure for wafer level image sensor module with fixed focal length |
EP2341540A3 (en) * | 2009-12-31 | 2012-01-25 | Kingpak Technology Inc. | Image sensor packaging structure with low transmittance encapsulant |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI414060B (zh) * | 2010-09-17 | 2013-11-01 | Kingpak Tech Inc | 模造成型之免調焦距影像感測器構裝結構及其製造方法 |
TWI521252B (zh) * | 2011-03-28 | 2016-02-11 | 柯尼卡美能達精密光學股份有限公司 | 攝影鏡頭單元及其製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06120281A (ja) * | 1992-10-08 | 1994-04-28 | Hitachi Ltd | モールド金型及びこれを用いたモールド装置 |
JPH11233539A (ja) * | 1998-02-09 | 1999-08-27 | Sharp Corp | 半導体装置のモールド金型およびマーキング方法 |
JP2001267545A (ja) * | 2000-03-22 | 2001-09-28 | Sharp Corp | 固体撮像装置およびその製造方法 |
JP2006303482A (ja) * | 2005-03-25 | 2006-11-02 | Fuji Photo Film Co Ltd | 固体撮像装置の製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5817208A (en) * | 1995-08-04 | 1998-10-06 | Matsushita Electronics Corporation | Resin sealing die, resin-sealed-type semiconductor device and method of manufacturing the device |
WO2006101274A1 (en) * | 2005-03-25 | 2006-09-28 | Fujifilm Corporation | Method of manufacturing solid state imaging device |
-
2008
- 2008-06-24 US US12/664,880 patent/US20100182483A1/en not_active Abandoned
- 2008-06-24 JP JP2009522572A patent/JPWO2009008259A1/ja active Pending
- 2008-06-24 WO PCT/JP2008/061450 patent/WO2009008259A1/ja active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06120281A (ja) * | 1992-10-08 | 1994-04-28 | Hitachi Ltd | モールド金型及びこれを用いたモールド装置 |
JPH11233539A (ja) * | 1998-02-09 | 1999-08-27 | Sharp Corp | 半導体装置のモールド金型およびマーキング方法 |
JP2001267545A (ja) * | 2000-03-22 | 2001-09-28 | Sharp Corp | 固体撮像装置およびその製造方法 |
JP2006303482A (ja) * | 2005-03-25 | 2006-11-02 | Fuji Photo Film Co Ltd | 固体撮像装置の製造方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2341540A3 (en) * | 2009-12-31 | 2012-01-25 | Kingpak Technology Inc. | Image sensor packaging structure with low transmittance encapsulant |
JP2011165774A (ja) * | 2010-02-05 | 2011-08-25 | Canon Inc | 固体撮像装置の製造方法 |
EP2388821A1 (en) * | 2010-05-17 | 2011-11-23 | Kingpak Technology Inc. | Manufacturing method and structure for wafer level image sensor module with fixed focal length |
Also Published As
Publication number | Publication date |
---|---|
JPWO2009008259A1 (ja) | 2010-09-09 |
US20100182483A1 (en) | 2010-07-22 |
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