WO2009008259A1 - 撮像装置の製造方法、撮像装置及び携帯端末 - Google Patents

撮像装置の製造方法、撮像装置及び携帯端末 Download PDF

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Publication number
WO2009008259A1
WO2009008259A1 PCT/JP2008/061450 JP2008061450W WO2009008259A1 WO 2009008259 A1 WO2009008259 A1 WO 2009008259A1 JP 2008061450 W JP2008061450 W JP 2008061450W WO 2009008259 A1 WO2009008259 A1 WO 2009008259A1
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WO
WIPO (PCT)
Prior art keywords
imaging
imaging device
imaging elements
substrate
elements
Prior art date
Application number
PCT/JP2008/061450
Other languages
English (en)
French (fr)
Inventor
Masanao Majima
Original Assignee
Konica Minolta Opto, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Opto, Inc. filed Critical Konica Minolta Opto, Inc.
Priority to US12/664,880 priority Critical patent/US20100182483A1/en
Priority to JP2009522572A priority patent/JPWO2009008259A1/ja
Publication of WO2009008259A1 publication Critical patent/WO2009008259A1/ja

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0056—Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/022—Mountings, adjusting means, or light-tight connections, for optical elements for lenses lens and mount having complementary engagement means, e.g. screw/thread
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14687—Wafer level processing
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

　複数の撮像装置を一体的に形成した後、切断分離して、個々の撮像装置とするに際し、分離後であってもイメージセンサの方向等を容易に識別でき、更に、一体的に形成した際の、どの位置で形成された撮像装置であるかを識別可能とするために、シリコンウェハの一方の面に複数の撮像素子を形成する工程と、撮像素子毎に、撮像光学系で受光画素部を封止する工程と、シリコンウェハを撮像素子毎に切断する工程と、切断された複数の撮像素子を基板上に載置する工程と、基板と複数の撮像素子を電気的に接続する工程と、複数の撮像素子毎に識別マークが形成された金型により、基板と撮像光学系と撮像素子とを一体的にモールディングする工程と、モールディングされた基板を撮像素子毎に切断分離する工程と、を有する撮像装置の製造方法とする。
PCT/JP2008/061450 2007-07-09 2008-06-24 撮像装置の製造方法、撮像装置及び携帯端末 WO2009008259A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/664,880 US20100182483A1 (en) 2007-07-09 2008-06-24 Manufacturing Method Of Imaging Device, Imaging Device, and Mobile Terminal
JP2009522572A JPWO2009008259A1 (ja) 2007-07-09 2008-06-24 撮像装置の製造方法、撮像装置及び携帯端末

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007179529 2007-07-09
JP2007-179529 2007-07-09

Publications (1)

Publication Number Publication Date
WO2009008259A1 true WO2009008259A1 (ja) 2009-01-15

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ID=40228438

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/061450 WO2009008259A1 (ja) 2007-07-09 2008-06-24 撮像装置の製造方法、撮像装置及び携帯端末

Country Status (3)

Country Link
US (1) US20100182483A1 (ja)
JP (1) JPWO2009008259A1 (ja)
WO (1) WO2009008259A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011165774A (ja) * 2010-02-05 2011-08-25 Canon Inc 固体撮像装置の製造方法
EP2388821A1 (en) * 2010-05-17 2011-11-23 Kingpak Technology Inc. Manufacturing method and structure for wafer level image sensor module with fixed focal length
EP2341540A3 (en) * 2009-12-31 2012-01-25 Kingpak Technology Inc. Image sensor packaging structure with low transmittance encapsulant

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI414060B (zh) * 2010-09-17 2013-11-01 Kingpak Tech Inc 模造成型之免調焦距影像感測器構裝結構及其製造方法
TWI521252B (zh) * 2011-03-28 2016-02-11 柯尼卡美能達精密光學股份有限公司 攝影鏡頭單元及其製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06120281A (ja) * 1992-10-08 1994-04-28 Hitachi Ltd モールド金型及びこれを用いたモールド装置
JPH11233539A (ja) * 1998-02-09 1999-08-27 Sharp Corp 半導体装置のモールド金型およびマーキング方法
JP2001267545A (ja) * 2000-03-22 2001-09-28 Sharp Corp 固体撮像装置およびその製造方法
JP2006303482A (ja) * 2005-03-25 2006-11-02 Fuji Photo Film Co Ltd 固体撮像装置の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5817208A (en) * 1995-08-04 1998-10-06 Matsushita Electronics Corporation Resin sealing die, resin-sealed-type semiconductor device and method of manufacturing the device
WO2006101274A1 (en) * 2005-03-25 2006-09-28 Fujifilm Corporation Method of manufacturing solid state imaging device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06120281A (ja) * 1992-10-08 1994-04-28 Hitachi Ltd モールド金型及びこれを用いたモールド装置
JPH11233539A (ja) * 1998-02-09 1999-08-27 Sharp Corp 半導体装置のモールド金型およびマーキング方法
JP2001267545A (ja) * 2000-03-22 2001-09-28 Sharp Corp 固体撮像装置およびその製造方法
JP2006303482A (ja) * 2005-03-25 2006-11-02 Fuji Photo Film Co Ltd 固体撮像装置の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2341540A3 (en) * 2009-12-31 2012-01-25 Kingpak Technology Inc. Image sensor packaging structure with low transmittance encapsulant
JP2011165774A (ja) * 2010-02-05 2011-08-25 Canon Inc 固体撮像装置の製造方法
EP2388821A1 (en) * 2010-05-17 2011-11-23 Kingpak Technology Inc. Manufacturing method and structure for wafer level image sensor module with fixed focal length

Also Published As

Publication number Publication date
JPWO2009008259A1 (ja) 2010-09-09
US20100182483A1 (en) 2010-07-22

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