DE69524447T2 - Polyamidsäure und verfahren zum umstellen von polyamidsäure zu polyimidbenzoxazolfilmen - Google Patents

Polyamidsäure und verfahren zum umstellen von polyamidsäure zu polyimidbenzoxazolfilmen

Info

Publication number
DE69524447T2
DE69524447T2 DE69524447T DE69524447T DE69524447T2 DE 69524447 T2 DE69524447 T2 DE 69524447T2 DE 69524447 T DE69524447 T DE 69524447T DE 69524447 T DE69524447 T DE 69524447T DE 69524447 T2 DE69524447 T2 DE 69524447T2
Authority
DE
Germany
Prior art keywords
polyamid acid
polyimidbenzoxazole
films
converting
polyamid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69524447T
Other languages
English (en)
Other versions
DE69524447D1 (de
Inventor
Wen-Fang Hwang
J Harris
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MICHIGAN MOLECULAR INSTITUTE MIDLAND
Michigan Molecular Institute
Original Assignee
MICHIGAN MOLECULAR INSTITUTE MIDLAND
Michigan Molecular Institute
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MICHIGAN MOLECULAR INSTITUTE MIDLAND, Michigan Molecular Institute filed Critical MICHIGAN MOLECULAR INSTITUTE MIDLAND
Application granted granted Critical
Publication of DE69524447D1 publication Critical patent/DE69524447D1/de
Publication of DE69524447T2 publication Critical patent/DE69524447T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1085—Polyimides with diamino moieties or tetracarboxylic segments containing heterocyclic moieties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/22—Polybenzoxazoles
DE69524447T 1994-10-31 1995-10-17 Polyamidsäure und verfahren zum umstellen von polyamidsäure zu polyimidbenzoxazolfilmen Expired - Lifetime DE69524447T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/331,775 US5919892A (en) 1994-10-31 1994-10-31 Polyamic acids and methods to convert polyamic acids into polyimidebenzoxazole films
PCT/US1995/013067 WO1996013541A1 (en) 1994-10-31 1995-10-17 Polyamic acids and methods to convert polyamic acids into polyimidebenzoxazole films

Publications (2)

Publication Number Publication Date
DE69524447D1 DE69524447D1 (de) 2002-01-17
DE69524447T2 true DE69524447T2 (de) 2002-05-16

Family

ID=23295320

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69524447T Expired - Lifetime DE69524447T2 (de) 1994-10-31 1995-10-17 Polyamidsäure und verfahren zum umstellen von polyamidsäure zu polyimidbenzoxazolfilmen

Country Status (8)

Country Link
US (1) US5919892A (de)
EP (1) EP0789723B1 (de)
JP (4) JP3650121B2 (de)
KR (1) KR100363508B1 (de)
CA (1) CA2202249C (de)
DE (1) DE69524447T2 (de)
TW (1) TW387916B (de)
WO (1) WO1996013541A1 (de)

Families Citing this family (35)

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US5741585A (en) * 1995-04-24 1998-04-21 The Dow Chemical Company Polyamic acid precursors and methods for preparing higher molecular weight polyamic acids and polyimidebenzoxazole
US6660875B1 (en) 1998-06-09 2003-12-09 Ppt Technologies, Llc Ion exchange purification of dielectric condensate precursor fluids and silicate esters such as tetraethylorthosilicate (TEOS)
WO2001034679A1 (fr) * 1999-11-10 2001-05-17 Pi R & D Co., Ltd. Polycondensat d'imide-benzoxazole et procede de production de celui-ci
TW555787B (en) * 2001-10-25 2003-10-01 Ind Tech Res Inst Synthesis of poly(imide-benzoxazole) copolymer
ATE417073T1 (de) * 2003-12-26 2008-12-15 Toyo Boseki Polyimidfolie
WO2005116770A1 (ja) * 2004-05-31 2005-12-08 Toyo Boseki Kabushiki Kaisha 感光性ポリイミド前駆体組成物
JP4810817B2 (ja) * 2004-10-07 2011-11-09 東洋紡績株式会社 ポリイミドフィルムおよびその製造方法
US7837740B2 (en) * 2007-01-24 2010-11-23 Musculoskeletal Transplant Foundation Two piece cancellous construct for cartilage repair
JP2006160705A (ja) * 2004-12-10 2006-06-22 Toyobo Co Ltd ベンゾオキサゾール基を含有する芳香族ジアミンおよびポリイミドベンゾオキサゾール前駆体の製造方法
JP4720179B2 (ja) * 2004-12-28 2011-07-13 東洋紡績株式会社 ポリイミドベンゾオキサゾール前駆体の製造方法
JP4876396B2 (ja) * 2005-01-05 2012-02-15 東洋紡績株式会社 プリント配線板
JP4806982B2 (ja) * 2005-07-06 2011-11-02 東洋紡績株式会社 ポリイミドフィルムおよびその製造方法
JP5245226B2 (ja) * 2005-08-24 2013-07-24 住友ベークライト株式会社 樹脂組成物及び半導体装置
JP2008002011A (ja) * 2006-06-22 2008-01-10 Toyobo Co Ltd ポリイミド不織布およびその製造方法
JP5299607B2 (ja) * 2006-10-04 2013-09-25 東洋紡株式会社 ポリイミド樹脂、ポリイミドワニス、及びポリイミドフィルム
KR100932765B1 (ko) * 2008-02-28 2009-12-21 한양대학교 산학협력단 폴리이미드-폴리벤조옥사졸 공중합체, 이의 제조방법, 및이를 포함하는 기체 분리막
CA2640517A1 (en) * 2008-05-19 2009-11-19 Industry-University Cooperation Foundation, Hanyang University Polyamic acids dope composition, preparation method of hollow fiber using the same and hollow fiber prepared therefrom
JP5370884B2 (ja) * 2008-08-29 2013-12-18 Ｊｎｃ株式会社 液晶配向剤、液晶配向膜及び液晶表示素子
US8013103B2 (en) * 2008-10-10 2011-09-06 Industry-University Cooperation Foundation, Hanyang University Polymer compounds and a preparation method thereof
US8487064B2 (en) 2008-10-10 2013-07-16 Industry-University Cooperation Foundation, Hanyang University Polymer compounds and a preparation method thereof
JP5384286B2 (ja) * 2009-10-15 2014-01-08 株式会社カネカ ポリイミド及びそれからなるポリイミドフィルム
JP5699607B2 (ja) * 2011-01-06 2015-04-15 東洋紡株式会社 極薄デバイス製造用ポリイミド前駆体溶液
JP5699606B2 (ja) * 2011-01-06 2015-04-15 東洋紡株式会社 フィルムデバイス製造用ポリイミド前駆体溶液
KR101531737B1 (ko) * 2011-06-30 2015-06-25 코오롱인더스트리 주식회사 폴리아믹산，폴리아믹산 용액，폴리이미드 보호층 및 폴리이미드 필름
KR20190029790A (ko) * 2012-09-04 2019-03-20 닛산 가가쿠 가부시키가이샤 폴리이미드 및 내열성 재료
KR101685035B1 (ko) * 2013-10-24 2016-12-12 한국화학연구원 박막 트랜지스터 유기 절연체용 고분자 화합물 및 이를 이용한 박막 트랜지스터
JP6293457B2 (ja) * 2013-11-12 2018-03-14 学校法人東邦大学 ポリイミドおよび耐熱性フィルム
KR102276656B1 (ko) * 2015-02-12 2021-07-13 삼성전자주식회사 폴리(이미드-벤족사졸) 코폴리머 제조용 조성물, 폴리(이미드-벤족사졸) 코폴리머, 폴리(이미드-벤족사졸) 코폴리머를 포함하는 성형품, 상기 성형품을 포함하는 디스플레이 장치
US9477148B1 (en) * 2015-05-26 2016-10-25 Industrial Technology Research Institute Polymer, method for preparing the same, and a photosensitive resin composition thereof
KR101984171B1 (ko) * 2016-06-01 2019-05-30 주식회사 엘지화학 고강도 투명 폴리아미드이미드 및 이의 제조방법
KR102646207B1 (ko) 2016-09-28 2024-03-11 다우 글로벌 테크놀로지스 엘엘씨 폴리(아미드산) 및 폴리이미드 폴리머의 합성용 dmpa-기반 용매계
US10982047B2 (en) * 2016-09-28 2021-04-20 Dow Global Technologies Llc Solvent systems for synthesis of poly(amic acid) and polyimide polymers
CN107474251A (zh) * 2017-08-18 2017-12-15 南京工业大学 一种膜电容器复合介电薄膜的制备方法
JP7302179B2 (ja) 2019-01-23 2023-07-04 東洋紡株式会社 ポリイミドフィルムおよびポリイミドフィルムの製造方法
CN113150276A (zh) * 2021-03-10 2021-07-23 张宝德 一种聚酰亚胺的制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4087409A (en) * 1966-11-07 1978-05-02 Monsanto Company Ordered heterocyclic copolymers
US3410826A (en) * 1967-04-10 1968-11-12 Du Pont Process for preparing shaped articles from polyamide acids before converting to insoluble polyimides
JPS58145419A (ja) * 1982-02-23 1983-08-30 Toray Ind Inc 芳香族ポリイミドフイルムの製造方法
EP0247637A1 (de) * 1986-05-30 1987-12-02 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Copolymerisierte Polyamidkarbonsäuresalze und Verfahren zu deren Herstellung
US4886873A (en) * 1987-04-14 1989-12-12 Director-General Of Agency Of Industrial Science And Technology Aromatic hetero ring-containing polyimide and its composite
US4958002A (en) * 1987-06-25 1990-09-18 Ube Industries, Ltd. High purity crystals of biphenyltetracarboxylic dianhydride and process for their preparation
DE68919453T2 (de) * 1988-08-24 1995-03-30 Asahi Chemical Ind Vorläufer für ein Polymid mit geringer thermischer Spannung und einen Polymidvorläufer enthaltende photopolymensierbare Zusammensetzung.
JPH02289621A (ja) * 1989-02-22 1990-11-29 Mitsubishi Kasei Corp 含芳香族複素環ポリイミド
US4980447A (en) * 1989-03-09 1990-12-25 Hoechst Celanese Corp. Polyamide-polyimide and polybenzoxazole-polyimide polymer
JP2597183B2 (ja) * 1989-04-26 1997-04-02 宇部興産株式会社 末端変性イミドオリゴマー組成物
US5173561A (en) * 1990-07-24 1992-12-22 Daychem Laboratories, Inc. Heat resistant polyimide-benzoxazole polymers and composites thereof
JPH07179605A (ja) * 1993-06-18 1995-07-18 Shin Etsu Chem Co Ltd ポリイミド及びその製造方法

Also Published As

Publication number Publication date
JP2005089765A (ja) 2005-04-07
EP0789723A1 (de) 1997-08-20
JPH10508059A (ja) 1998-08-04
US5919892A (en) 1999-07-06
KR970707211A (ko) 1997-12-01
JP3984991B2 (ja) 2007-10-03
JP2005187815A (ja) 2005-07-14
WO1996013541A1 (en) 1996-05-09
DE69524447D1 (de) 2002-01-17
JP2004292824A (ja) 2004-10-21
JP3650121B2 (ja) 2005-05-18
TW387916B (en) 2000-04-21
CA2202249C (en) 2007-04-17
CA2202249A1 (en) 1996-05-09
EP0789723B1 (de) 2001-12-05
JP3971759B2 (ja) 2007-09-05
KR100363508B1 (ko) 2003-03-03

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