DE69435110D1 - Poliergerät - Google Patents

Poliergerät

Info

Publication number
DE69435110D1
DE69435110D1 DE69435110T DE69435110T DE69435110D1 DE 69435110 D1 DE69435110 D1 DE 69435110D1 DE 69435110 T DE69435110 T DE 69435110T DE 69435110 T DE69435110 T DE 69435110T DE 69435110 D1 DE69435110 D1 DE 69435110D1
Authority
DE
Germany
Prior art keywords
polisher
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69435110T
Other languages
English (en)
Inventor
Katsuya Okumura
Riichirou Aoki
Hiromi Yajima
Masako Kodera
Shirou Mishima
Atsushi Shigeta
Masayoshi Hirose
Norio Kimura
Seiji Ishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Application granted granted Critical
Publication of DE69435110D1 publication Critical patent/DE69435110D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/36—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis orthogonal to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
DE69435110T 1993-09-21 1994-09-20 Poliergerät Expired - Lifetime DE69435110D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25939693 1993-09-21

Publications (1)

Publication Number Publication Date
DE69435110D1 true DE69435110D1 (de) 2008-08-14

Family

ID=17333556

Family Applications (4)

Application Number Title Priority Date Filing Date
DE69424016T Expired - Lifetime DE69424016T2 (de) 1993-09-21 1994-09-20 Poliergerät
DE69435110T Expired - Lifetime DE69435110D1 (de) 1993-09-21 1994-09-20 Poliergerät
DE69433067T Expired - Lifetime DE69433067T2 (de) 1993-09-21 1994-09-20 Poliergerät
DE69434678T Expired - Lifetime DE69434678T2 (de) 1993-09-21 1994-09-20 Poliergerät

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69424016T Expired - Lifetime DE69424016T2 (de) 1993-09-21 1994-09-20 Poliergerät

Family Applications After (2)

Application Number Title Priority Date Filing Date
DE69433067T Expired - Lifetime DE69433067T2 (de) 1993-09-21 1994-09-20 Poliergerät
DE69434678T Expired - Lifetime DE69434678T2 (de) 1993-09-21 1994-09-20 Poliergerät

Country Status (4)

Country Link
US (1) US5616063A (de)
EP (4) EP1338384B1 (de)
KR (3) KR100390293B1 (de)
DE (4) DE69424016T2 (de)

Families Citing this family (80)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5885138A (en) 1993-09-21 1999-03-23 Ebara Corporation Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
US5679060A (en) * 1994-07-14 1997-10-21 Silicon Technology Corporation Wafer grinding machine
IL113829A (en) * 1995-05-23 2000-12-06 Nova Measuring Instr Ltd Apparatus for optical inspection of wafers during polishing
US20070123151A1 (en) * 1995-05-23 2007-05-31 Nova Measuring Instruments Ltd Apparatus for optical inspection of wafers during polishing
KR100487590B1 (ko) * 1995-08-21 2005-08-04 가부시키가이샤 에바라 세이사꾸쇼 폴리싱장치
US7097544B1 (en) 1995-10-27 2006-08-29 Applied Materials Inc. Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
US5738574A (en) * 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US5839947A (en) * 1996-02-05 1998-11-24 Ebara Corporation Polishing apparatus
JP3580936B2 (ja) * 1996-02-26 2004-10-27 株式会社荏原製作所 ポリッシング装置のプッシャー及びポリッシング装置
US6050884A (en) * 1996-02-28 2000-04-18 Ebara Corporation Polishing apparatus
DE69732157T2 (de) * 1996-02-28 2005-12-29 Ebara Corp. Transportroboter mit Tropfwasserschutz
JP3696690B2 (ja) * 1996-04-23 2005-09-21 不二越機械工業株式会社 ウェーハの研磨装置システム
EP0803326B1 (de) 1996-04-26 2002-10-02 Ebara Corporation Poliervorrichtung
US5904611A (en) * 1996-05-10 1999-05-18 Canon Kabushiki Kaisha Precision polishing apparatus
US6413156B1 (en) * 1996-05-16 2002-07-02 Ebara Corporation Method and apparatus for polishing workpiece
JP3679871B2 (ja) * 1996-09-04 2005-08-03 株式会社荏原製作所 ポリッシング装置及び搬送ロボット
JP3788533B2 (ja) * 1996-09-30 2006-06-21 東京エレクトロン株式会社 研磨装置および研磨方法
US5702292A (en) * 1996-10-31 1997-12-30 Micron Technology, Inc. Apparatus and method for loading and unloading substrates to a chemical-mechanical planarization machine
JPH10163138A (ja) * 1996-11-29 1998-06-19 Fujitsu Ltd 半導体装置の製造方法および研磨装置
DE19719503C2 (de) * 1997-05-07 2002-05-02 Wolters Peter Werkzeugmasch Vorrichtung zum chemisch-mechanischen Polieren von Oberflächen von Halbleiterwafern und Verfahren zum Betrieb der Vorrichtung
US6033521A (en) * 1997-06-04 2000-03-07 Speedfam-Ipec Corporation Tilt mechanism for wafer cassette
US6139406A (en) * 1997-06-24 2000-10-31 Applied Materials, Inc. Combined slurry dispenser and rinse arm and method of operation
US6213853B1 (en) 1997-09-10 2001-04-10 Speedfam-Ipec Corporation Integral machine for polishing, cleaning, rinsing and drying workpieces
TW405158B (en) 1997-09-17 2000-09-11 Ebara Corp Plating apparatus for semiconductor wafer processing
WO1999026763A2 (en) * 1997-11-21 1999-06-03 Ebara Corporation Polishing apparatus
JPH11204468A (ja) * 1998-01-09 1999-07-30 Speedfam Co Ltd 半導体ウエハの表面平坦化装置
JPH11207606A (ja) 1998-01-21 1999-08-03 Ebara Corp 研磨装置
KR100552009B1 (ko) * 1998-03-09 2006-02-20 가부시키가이샤 에바라 세이사꾸쇼 폴리싱 장치
US6132289A (en) * 1998-03-31 2000-10-17 Lam Research Corporation Apparatus and method for film thickness measurement integrated into a wafer load/unload unit
FR2776552B1 (fr) * 1998-03-31 2000-06-16 Procedes & Equipement Pour Les Machine modulaire de polissage et de planarisation de substrats
US6271140B1 (en) 1998-10-01 2001-08-07 Vanguard International Semiconductor Corporation Coaxial dressing for chemical mechanical polishing
US6220941B1 (en) 1998-10-01 2001-04-24 Applied Materials, Inc. Method of post CMP defect stability improvement
JP2000187832A (ja) * 1998-10-05 2000-07-04 Exclusive Design Co Inc 磁気ディスク及び他の基板を自動研磨する方法及び装置
JP3045233B2 (ja) * 1998-10-16 2000-05-29 株式会社東京精密 ウェーハ研磨装置
JP3979750B2 (ja) * 1998-11-06 2007-09-19 株式会社荏原製作所 基板の研磨装置
US6319098B1 (en) 1998-11-13 2001-11-20 Applied Materials, Inc. Method of post CMP defect stability improvement
US7177019B2 (en) * 1999-02-01 2007-02-13 Tokyo Electron Limited Apparatus for imaging metrology
US7042580B1 (en) * 1999-02-01 2006-05-09 Tokyo Electron Limited Apparatus for imaging metrology
US6690473B1 (en) * 1999-02-01 2004-02-10 Sensys Instruments Corporation Integrated surface metrology
US6309279B1 (en) * 1999-02-19 2001-10-30 Speedfam-Ipec Corporation Arrangements for wafer polishing
US6354922B1 (en) 1999-08-20 2002-03-12 Ebara Corporation Polishing apparatus
US6358128B1 (en) * 1999-03-05 2002-03-19 Ebara Corporation Polishing apparatus
US6328814B1 (en) 1999-03-26 2001-12-11 Applied Materials, Inc. Apparatus for cleaning and drying substrates
US6217426B1 (en) 1999-04-06 2001-04-17 Applied Materials, Inc. CMP polishing pad
US6220942B1 (en) * 1999-04-02 2001-04-24 Applied Materials, Inc. CMP platen with patterned surface
US6855030B2 (en) * 1999-10-27 2005-02-15 Strasbaugh Modular method for chemical mechanical planarization
JP3510177B2 (ja) * 2000-03-23 2004-03-22 株式会社東京精密 ウェハ研磨装置
JP3556148B2 (ja) * 2000-03-23 2004-08-18 株式会社東京精密 ウェハ研磨装置
JP2001274122A (ja) * 2000-03-23 2001-10-05 Tokyo Seimitsu Co Ltd ウェハ研磨装置
JP2001326201A (ja) * 2000-05-16 2001-11-22 Ebara Corp ポリッシング装置
US20020019707A1 (en) * 2000-06-26 2002-02-14 Cohen Alan M. Glucose metering system
AU2001279242A1 (en) * 2000-08-11 2002-02-25 Sensys Instruments Corporation Bathless wafer measurement apparatus and method
KR100877044B1 (ko) * 2000-10-02 2008-12-31 도쿄엘렉트론가부시키가이샤 세정처리장치
US6999164B2 (en) * 2001-04-26 2006-02-14 Tokyo Electron Limited Measurement system cluster
US7089075B2 (en) * 2001-05-04 2006-08-08 Tokyo Electron Limited Systems and methods for metrology recipe and model generation
EP1263022B1 (de) * 2001-05-31 2007-04-25 S.E.S. Company Limited Substratreinigungssystem
CN101086955B (zh) * 2001-11-02 2013-03-27 应用材料公司 单个晶片的干燥装置和干燥方法
US7513062B2 (en) * 2001-11-02 2009-04-07 Applied Materials, Inc. Single wafer dryer and drying methods
JP3920720B2 (ja) * 2002-03-29 2007-05-30 株式会社荏原製作所 基板受渡し方法、基板受渡し機構及び基板研磨装置
US6875076B2 (en) 2002-06-17 2005-04-05 Accretech Usa, Inc. Polishing machine and method
DE10250856A1 (de) 2002-10-25 2004-05-13 Carl Zeiss Verfahren und Vorrichtung zum Herstellen von optischen Gläsern
WO2005044473A1 (de) * 2003-11-10 2005-05-19 Marlena Busarac Vorrichtung zum reinigen von stapelbaren erzeugnissen
CN101023429B (zh) * 2004-07-02 2010-09-01 斯特拉斯鲍公司 用于处理晶片的方法和系统
KR101165379B1 (ko) * 2004-07-15 2012-07-17 삼성전자주식회사 수신 성능이 향상된 지상파 디지털 방송 송수신 시스템 및그의 신호처리방법
JP2007111283A (ja) * 2005-10-21 2007-05-10 Timothy Tamio Nemoto 歯冠研磨装置
US20070181442A1 (en) * 2006-02-03 2007-08-09 Applied Materials, Inc. Method and apparatus for foam removal in an electrochemical mechanical substrate polishing process
JP2011526843A (ja) * 2008-07-01 2011-10-20 アプライド マテリアルズ インコーポレイテッド モジュール式ベースプレート半導体研磨機アーキテクチャ
TWI550686B (zh) * 2011-11-04 2016-09-21 東京威力科創股份有限公司 基板處理系統、基板運送方法及電腦記憶媒體
US9570311B2 (en) * 2012-02-10 2017-02-14 Taiwan Semiconductor Manufacturing Company, Ltd. Modular grinding apparatuses and methods for wafer thinning
CN103286676A (zh) * 2013-05-31 2013-09-11 上海华力微电子有限公司 研磨液整理器
KR102202331B1 (ko) * 2014-10-03 2021-01-13 가부시키가이샤 에바라 세이사꾸쇼 기판 처리 장치 및 처리 방법
CN106541329B (zh) * 2015-09-16 2019-01-01 泰科电子(上海)有限公司 集成设备
KR101786485B1 (ko) * 2016-03-08 2017-10-18 주식회사 케이씨텍 화학 기계적 연마시스템
JP6727044B2 (ja) * 2016-06-30 2020-07-22 株式会社荏原製作所 基板処理装置
CN107009216A (zh) * 2017-05-08 2017-08-04 重庆都英科技有限公司 一种毛刺打磨设备
CN107053001A (zh) * 2017-05-11 2017-08-18 芜湖市华峰砂轮有限公司 一种半自动砂轮磨床
CN107662156B (zh) * 2017-09-11 2019-02-26 山东时风（集团）有限责任公司 铸件后精整流水线及其精整方法
CN107598763A (zh) * 2017-10-24 2018-01-19 江门市奥伦德光电有限公司 一种多尺寸兼容的晶圆研磨设备及其研磨方法
KR102612416B1 (ko) 2018-12-24 2023-12-08 삼성전자주식회사 세정 장치 및 세정 장치의 구동 방법
CN109822419B (zh) * 2019-03-04 2024-08-23 天通日进精密技术有限公司 晶圆转移装置及晶圆转移方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4141180A (en) * 1977-09-21 1979-02-27 Kayex Corporation Polishing apparatus
US4193226A (en) * 1977-09-21 1980-03-18 Kayex Corporation Polishing apparatus
US4313266A (en) * 1980-05-01 1982-02-02 The Silicon Valley Group, Inc. Method and apparatus for drying wafers
JPS58223561A (ja) * 1982-06-16 1983-12-26 Disco Abrasive Sys Ltd ポリツシングマシン
US4680893A (en) * 1985-09-23 1987-07-21 Motorola, Inc. Apparatus for polishing semiconductor wafers
US4653231A (en) * 1985-11-01 1987-03-31 Motorola, Inc. Polishing system with underwater Bernoulli pickup
JPS63207559A (ja) * 1987-02-19 1988-08-26 Disco Abrasive Syst Ltd ウエ−ハ自動研削装置
US4956944A (en) * 1987-03-19 1990-09-18 Canon Kabushiki Kaisha Polishing apparatus
US4851101A (en) * 1987-09-18 1989-07-25 Varian Associates, Inc. Sputter module for modular wafer processing machine
US4984392A (en) * 1988-09-29 1991-01-15 Shin-Etsu Handotai Company Limited Chamfering the notch of a semiconductor wafer
US4905425A (en) * 1988-09-30 1990-03-06 Shin-Etsu Handotai Company Limited Method for chamfering the notch of a notch-cut semiconductor wafer
JPH0615565A (ja) * 1991-12-18 1994-01-25 Shin Etsu Handotai Co Ltd ウエーハ自動ラッピング装置
US5329732A (en) * 1992-06-15 1994-07-19 Speedfam Corporation Wafer polishing method and apparatus
JPH0663862A (ja) * 1992-08-22 1994-03-08 Fujikoshi Mach Corp 研磨装置
JP2622069B2 (ja) * 1993-06-30 1997-06-18 三菱マテリアル株式会社 研磨布のドレッシング装置

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DE69424016D1 (de) 2000-05-25
EP0648575A1 (de) 1995-04-19
KR100390299B1 (ko) 2003-07-04
EP1642679B1 (de) 2008-07-02
KR100390300B1 (ko) 2003-07-04
EP1338384A3 (de) 2003-09-10
EP0648575B1 (de) 2000-04-19
EP1338384B1 (de) 2006-03-29
KR100390293B1 (ko) 2003-09-02
DE69433067T2 (de) 2004-06-03
EP0982098B1 (de) 2003-08-20
EP1338384A2 (de) 2003-08-27
EP0982098A2 (de) 2000-03-01
DE69424016T2 (de) 2000-12-14
KR950009954A (ko) 1995-04-26
EP0982098A3 (de) 2000-03-08
DE69433067D1 (de) 2003-09-25
DE69434678T2 (de) 2007-04-12
EP0648575B9 (de) 2001-12-05
EP1642679A1 (de) 2006-04-05
US5616063A (en) 1997-04-01
DE69434678D1 (de) 2006-05-18

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