DE69415707T2 - Wärmebestandiger Klebstoff zum Herstellen einer Halbleiterpackung - Google Patents

Wärmebestandiger Klebstoff zum Herstellen einer Halbleiterpackung

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Publication number
DE69415707T2
DE69415707T2 DE1994615707 DE69415707T DE69415707T2 DE 69415707 T2 DE69415707 T2 DE 69415707T2 DE 1994615707 DE1994615707 DE 1994615707 DE 69415707 T DE69415707 T DE 69415707T DE 69415707 T2 DE69415707 T2 DE 69415707T2
Authority
DE
Germany
Prior art keywords
manufacturing
heat
semiconductor package
resistant adhesive
resistant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE1994615707
Other languages
English (en)
Other versions
DE69415707D1 (de
Inventor
Hidekazu Matsuura
Yoshihide Iwazaki
Naoto Ohta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of DE69415707D1 publication Critical patent/DE69415707D1/de
Application granted granted Critical
Publication of DE69415707T2 publication Critical patent/DE69415707T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
DE1994615707 1993-03-29 1994-03-29 Wärmebestandiger Klebstoff zum Herstellen einer Halbleiterpackung Expired - Lifetime DE69415707T2 (de)

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KR100426298B1 (ko) 1994-12-26 2004-04-08 히다치 가세고교 가부시끼가이샤 필름 형상의 유기 다이본딩재의 라미네이트 방법,다이본딩 방법, 라미네이트 장치, 다이본딩 장치, 반도체장치 및 반도체 장치의 제조 방법
TW310481B (de) * 1995-07-06 1997-07-11 Hitachi Chemical Co Ltd
US6717242B2 (en) 1995-07-06 2004-04-06 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
TW326566B (en) * 1996-04-19 1998-02-11 Hitachi Chemical Co Ltd Composite film and lead frame with composite film attached
CN1079195C (zh) * 1996-07-05 2002-02-20 蓝进 扇贝裙边的综合利用工艺
US5922167A (en) * 1997-01-16 1999-07-13 Occidential Chemical Corporation Bending integrated circuit chips
JPH10330616A (ja) * 1997-05-30 1998-12-15 Hitachi Chem Co Ltd 耐熱樹脂ペースト
MY124687A (en) * 1998-05-20 2006-06-30 Hitachi Chemical Co Ltd Insulating adhesive for electronic parts, and lead frame and semiconductor device using the same
DE60016217T2 (de) * 1999-04-09 2005-04-07 Kaneka Corp. Polyimidharzzusammensetzung mit verbesserter feuchtigkeitsbeständigkeit, leimlösung, mehrlagiger klebefilm und verfahren zu deren herstellung
US9679831B2 (en) * 2015-08-13 2017-06-13 Cypress Semiconductor Corporation Tape chip on lead using paste die attach material

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JP2535523B2 (ja) * 1987-01-28 1996-09-18 三井東圧化学株式会社 ポリイミドおよびポリイミドよりなる耐熱性接着剤
US5068712A (en) * 1988-09-20 1991-11-26 Hitachi, Ltd. Semiconductor device
JP2547823B2 (ja) * 1988-07-26 1996-10-23 株式会社日立製作所 半導体装置及びその製造方法
JPH0236543A (ja) * 1988-07-26 1990-02-06 Nec Corp チップキャリア端子コーティング方法
JPH04342786A (ja) * 1991-05-17 1992-11-30 Kanebo Nsc Ltd 耐熱性接着材料
JP3003289B2 (ja) * 1991-07-16 2000-01-24 日立化成工業株式会社 ペースト状被覆組成物及びこれを用いた半導体装置
JPH05112761A (ja) * 1991-10-16 1993-05-07 Sumitomo Bakelite Co Ltd 接着テープ

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CN1041034C (zh) 1998-12-02
EP0862205B1 (de) 2004-02-04
DE69433535T2 (de) 2004-12-23
EP0862205A1 (de) 1998-09-02
EP0618614A3 (de) 1995-11-22
EP0618614B1 (de) 1999-01-07
SG83154A1 (en) 2001-09-18
KR100243731B1 (ko) 2000-02-01
DE69415707D1 (de) 1999-02-18
CN1099518A (zh) 1995-03-01
EP0618614A2 (de) 1994-10-05
KR940021690A (ko) 1994-10-19
DE69433535D1 (de) 2004-03-11
SG44732A1 (en) 1997-12-19

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