DE69433535D1 - Hitzebeständiger Klebstoff - Google Patents
Hitzebeständiger KlebstoffInfo
- Publication number
- DE69433535D1 DE69433535D1 DE69433535T DE69433535T DE69433535D1 DE 69433535 D1 DE69433535 D1 DE 69433535D1 DE 69433535 T DE69433535 T DE 69433535T DE 69433535 T DE69433535 T DE 69433535T DE 69433535 D1 DE69433535 D1 DE 69433535D1
- Authority
- DE
- Germany
- Prior art keywords
- heat resistant
- resistant adhesive
- adhesive
- heat
- resistant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
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- H—ELECTRICITY
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
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- C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9187093 | 1993-03-29 | ||
JP9187093 | 1993-03-29 | ||
JP9189993 | 1993-03-29 | ||
JP9189993 | 1993-03-29 | ||
JP2593994 | 1994-01-31 | ||
JP2593994 | 1994-01-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69433535D1 true DE69433535D1 (de) | 2004-03-11 |
DE69433535T2 DE69433535T2 (de) | 2004-12-23 |
Family
ID=27285212
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1994615707 Expired - Lifetime DE69415707T2 (de) | 1993-03-29 | 1994-03-29 | Wärmebestandiger Klebstoff zum Herstellen einer Halbleiterpackung |
DE1994633535 Expired - Lifetime DE69433535T2 (de) | 1993-03-29 | 1994-03-29 | Hitzebeständiger Klebstoff |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1994615707 Expired - Lifetime DE69415707T2 (de) | 1993-03-29 | 1994-03-29 | Wärmebestandiger Klebstoff zum Herstellen einer Halbleiterpackung |
Country Status (5)
Country | Link |
---|---|
EP (2) | EP0618614B1 (de) |
KR (1) | KR100243731B1 (de) |
CN (1) | CN1041034C (de) |
DE (2) | DE69415707T2 (de) |
SG (2) | SG83154A1 (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100399332B1 (ko) | 1994-12-26 | 2003-09-26 | 히다치 가세고교 가부시끼가이샤 | 필름 형상의 유기 다이본딩재의 라미네이트 방법,다이본딩 방법, 라미네이트 장치, 다이본딩 장치, 반도체장치 및 반도체장치의 제조방법 |
TW310481B (de) | 1995-07-06 | 1997-07-11 | Hitachi Chemical Co Ltd | |
US6717242B2 (en) | 1995-07-06 | 2004-04-06 | Hitachi Chemical Company, Ltd. | Semiconductor device and process for fabrication thereof |
TW326566B (en) * | 1996-04-19 | 1998-02-11 | Hitachi Chemical Co Ltd | Composite film and lead frame with composite film attached |
CN1079195C (zh) * | 1996-07-05 | 2002-02-20 | 蓝进 | 扇贝裙边的综合利用工艺 |
US5922167A (en) * | 1997-01-16 | 1999-07-13 | Occidential Chemical Corporation | Bending integrated circuit chips |
JPH10330616A (ja) * | 1997-05-30 | 1998-12-15 | Hitachi Chem Co Ltd | 耐熱樹脂ペースト |
MY124687A (en) * | 1998-05-20 | 2006-06-30 | Hitachi Chemical Co Ltd | Insulating adhesive for electronic parts, and lead frame and semiconductor device using the same |
DE60016217T2 (de) * | 1999-04-09 | 2005-04-07 | Kaneka Corp. | Polyimidharzzusammensetzung mit verbesserter feuchtigkeitsbeständigkeit, leimlösung, mehrlagiger klebefilm und verfahren zu deren herstellung |
US9679831B2 (en) * | 2015-08-13 | 2017-06-13 | Cypress Semiconductor Corporation | Tape chip on lead using paste die attach material |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2535523B2 (ja) * | 1987-01-28 | 1996-09-18 | 三井東圧化学株式会社 | ポリイミドおよびポリイミドよりなる耐熱性接着剤 |
JPH0236543A (ja) * | 1988-07-26 | 1990-02-06 | Nec Corp | チップキャリア端子コーティング方法 |
JP2547823B2 (ja) * | 1988-07-26 | 1996-10-23 | 株式会社日立製作所 | 半導体装置及びその製造方法 |
KR0158868B1 (ko) * | 1988-09-20 | 1998-12-01 | 미다 가쓰시게 | 반도체장치 |
JPH04342786A (ja) * | 1991-05-17 | 1992-11-30 | Kanebo Nsc Ltd | 耐熱性接着材料 |
JP3003289B2 (ja) * | 1991-07-16 | 2000-01-24 | 日立化成工業株式会社 | ペースト状被覆組成物及びこれを用いた半導体装置 |
JPH05112761A (ja) * | 1991-10-16 | 1993-05-07 | Sumitomo Bakelite Co Ltd | 接着テープ |
-
1994
- 1994-03-29 EP EP19940104935 patent/EP0618614B1/de not_active Expired - Lifetime
- 1994-03-29 CN CN94105296A patent/CN1041034C/zh not_active Expired - Lifetime
- 1994-03-29 KR KR1019940006354A patent/KR100243731B1/ko not_active IP Right Cessation
- 1994-03-29 SG SG9904637A patent/SG83154A1/en unknown
- 1994-03-29 SG SG1996006540A patent/SG44732A1/en unknown
- 1994-03-29 DE DE1994615707 patent/DE69415707T2/de not_active Expired - Lifetime
- 1994-03-29 DE DE1994633535 patent/DE69433535T2/de not_active Expired - Lifetime
- 1994-03-29 EP EP19980105357 patent/EP0862205B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0862205B1 (de) | 2004-02-04 |
CN1099518A (zh) | 1995-03-01 |
EP0618614B1 (de) | 1999-01-07 |
EP0618614A3 (de) | 1995-11-22 |
DE69415707D1 (de) | 1999-02-18 |
KR940021690A (ko) | 1994-10-19 |
DE69433535T2 (de) | 2004-12-23 |
EP0862205A1 (de) | 1998-09-02 |
SG44732A1 (en) | 1997-12-19 |
CN1041034C (zh) | 1998-12-02 |
SG83154A1 (en) | 2001-09-18 |
KR100243731B1 (ko) | 2000-02-01 |
EP0618614A2 (de) | 1994-10-05 |
DE69415707T2 (de) | 1999-09-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |