DE69408374D1 - Lichtemittierende Halbleitervorrichtung - Google Patents

Lichtemittierende Halbleitervorrichtung

Info

Publication number
DE69408374D1
DE69408374D1 DE69408374T DE69408374T DE69408374D1 DE 69408374 D1 DE69408374 D1 DE 69408374D1 DE 69408374 T DE69408374 T DE 69408374T DE 69408374 T DE69408374 T DE 69408374T DE 69408374 D1 DE69408374 D1 DE 69408374D1
Authority
DE
Germany
Prior art keywords
light emitting
emitting device
semiconductor light
semiconductor
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Revoked
Application number
DE69408374T
Other languages
English (en)
Other versions
DE69408374T2 (de
Inventor
Masanori Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27315813&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69408374(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from JP18103993A external-priority patent/JPH0738151A/ja
Priority claimed from JP12876794A external-priority patent/JPH07335973A/ja
Priority claimed from JP14648794A external-priority patent/JP3400110B2/ja
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of DE69408374D1 publication Critical patent/DE69408374D1/de
Application granted granted Critical
Publication of DE69408374T2 publication Critical patent/DE69408374T2/de
Anticipated expiration legal-status Critical
Revoked legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/10—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a light reflecting structure, e.g. semiconductor Bragg reflector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/40—Materials therefor
    • H01L33/405—Reflective materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/10—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a light reflecting structure, e.g. semiconductor Bragg reflector
    • H01L33/105—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a light reflecting structure, e.g. semiconductor Bragg reflector with a resonant cavity structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/1078—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region with means to control the spontaneous emission, e.g. reducing or reinjection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/2004—Confining in the direction perpendicular to the layer structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/2004—Confining in the direction perpendicular to the layer structure
    • H01S5/2009—Confining in the direction perpendicular to the layer structure by using electron barrier layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/2004—Confining in the direction perpendicular to the layer structure
    • H01S5/2009—Confining in the direction perpendicular to the layer structure by using electron barrier layers
    • H01S5/2013—MQW barrier reflection layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/2004—Confining in the direction perpendicular to the layer structure
    • H01S5/2018—Optical confinement, e.g. absorbing-, reflecting- or waveguide-layers
    • H01S5/2022—Absorbing region or layer parallel to the active layer, e.g. to influence transverse modes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/2004—Confining in the direction perpendicular to the layer structure
    • H01S5/2018—Optical confinement, e.g. absorbing-, reflecting- or waveguide-layers
    • H01S5/2027—Reflecting region or layer, parallel to the active layer, e.g. to modify propagation of the mode in the laser or to influence transverse modes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/223—Buried stripe structure
    • H01S5/2231—Buried stripe structure with inner confining structure only between the active layer and the upper electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/30—Structure or shape of the active region; Materials used for the active region
    • H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
    • H01S5/3403—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers having a strained layer structure in which the strain performs a special function, e.g. general strain effects, strain versus polarisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/30—Structure or shape of the active region; Materials used for the active region
    • H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
    • H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
    • H01S5/34326—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer based on InGa(Al)P, e.g. red laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/30—Structure or shape of the active region; Materials used for the active region
    • H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
    • H01S5/347—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIBVI compounds, e.g. ZnCdSe- laser

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biophysics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Geometry (AREA)
  • Led Devices (AREA)
DE69408374T 1993-07-22 1994-07-22 Lichtemittierende Halbleitervorrichtung Revoked DE69408374T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP18103993A JPH0738151A (ja) 1993-07-22 1993-07-22 光半導体装置
JP12876794A JPH07335973A (ja) 1994-06-10 1994-06-10 半導体レーザ
JP14648794A JP3400110B2 (ja) 1994-06-28 1994-06-28 発光ダイオード

Publications (2)

Publication Number Publication Date
DE69408374D1 true DE69408374D1 (de) 1998-03-12
DE69408374T2 DE69408374T2 (de) 1998-08-06

Family

ID=27315813

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69408374T Revoked DE69408374T2 (de) 1993-07-22 1994-07-22 Lichtemittierende Halbleitervorrichtung

Country Status (3)

Country Link
US (1) US5537433A (de)
EP (1) EP0635893B1 (de)
DE (1) DE69408374T2 (de)

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5787104A (en) * 1995-01-19 1998-07-28 Matsushita Electric Industrial Co., Ltd. Semiconductor light emitting element and method for fabricating the same
JPH08288544A (ja) 1995-04-14 1996-11-01 Toshiba Corp 半導体発光素子
JP3195194B2 (ja) * 1995-05-26 2001-08-06 シャープ株式会社 半導体発光素子およびその製造方法
JP3635757B2 (ja) * 1995-12-28 2005-04-06 昭和電工株式会社 ＡｌＧａＩｎＰ発光ダイオード
JP2817703B2 (ja) * 1996-04-25 1998-10-30 日本電気株式会社 光半導体装置
US6181721B1 (en) * 1996-05-20 2001-01-30 Sdl, Inc. Visible wavelength, semiconductor optoelectronic device with a high power broad, significantly laterally uniform, diffraction limited output beam
JP3548654B2 (ja) * 1996-09-08 2004-07-28 豊田合成株式会社 半導体発光素子
DE19652528A1 (de) * 1996-12-17 1998-06-18 Siemens Ag LED mit allseitiger Lichtauskopplung
JP3807638B2 (ja) * 1997-01-29 2006-08-09 シャープ株式会社 半導体発光素子及びその製造方法
RU2133534C1 (ru) * 1997-08-08 1999-07-20 Государственное предприятие Научно-исследовательский институт "Полюс" Инжекционный лазер
EP1928034A3 (de) 1997-12-15 2008-06-18 Philips Lumileds Lighting Company LLC Lichtemittierende Vorrichtung
RU2134007C1 (ru) * 1998-03-12 1999-07-27 Государственное предприятие Научно-исследовательский институт "Полюс" Полупроводниковый оптический усилитель
US6181943B1 (en) 1998-03-30 2001-01-30 Lucent Technologies Inc. Method and apparatus for inter-frequency hand-off in wireless communication systems
US6330263B1 (en) * 1998-05-06 2001-12-11 Sarnoff Corporation Laser diode having separated, highly-strained quantum wells
RU2142665C1 (ru) * 1998-08-10 1999-12-10 Швейкин Василий Иванович Инжекционный лазер
AU762566B2 (en) * 1998-08-10 2003-06-26 D-Led Corporation Injection laser
US6204523B1 (en) * 1998-11-06 2001-03-20 Lumileds Lighting, U.S., Llc High stability optical encapsulation and packaging for light-emitting diodes in the green, blue, and near UV range
RU2142661C1 (ru) 1998-12-29 1999-12-10 Швейкин Василий Иванович Инжекционный некогерентный излучатель
DE19911717A1 (de) * 1999-03-16 2000-09-28 Osram Opto Semiconductors Gmbh Monolithisches elektrolumineszierendes Bauelement und Verfahren zu dessen Herstellung
AU4355200A (en) * 1999-04-28 2000-11-10 Nova Crystals, Inc. Led having embedded light reflectors to enhance led output efficiency
US6222207B1 (en) * 1999-05-24 2001-04-24 Lumileds Lighting, U.S. Llc Diffusion barrier for increased mirror reflectivity in reflective solderable contacts on high power LED chip
US6133589A (en) * 1999-06-08 2000-10-17 Lumileds Lighting, U.S., Llc AlGaInN-based LED having thick epitaxial layer for improved light extraction
US6946685B1 (en) 2000-08-31 2005-09-20 Lumileds Lighting U.S., Llc Light emitting semiconductor method and device
JP2002141551A (ja) * 2000-10-31 2002-05-17 Fuji Photo Film Co Ltd 発光ダイオード
KR100413435B1 (ko) * 2001-04-02 2003-12-31 엘지전자 주식회사 발광다이오드 및 그 제조방법
US7135711B2 (en) * 2001-08-30 2006-11-14 Osram Opto Semiconductors Gmbh Electroluminescent body
US6903379B2 (en) * 2001-11-16 2005-06-07 Gelcore Llc GaN based LED lighting extraction efficiency using digital diffractive phase grating
FR2833418B1 (fr) * 2001-12-06 2004-04-09 Cit Alcatel Composant optique de type laser a semiconducteur
US20030129597A1 (en) * 2001-12-19 2003-07-10 The Regents Of The University Of California Identification of a novel endothelial-derived gene EG-1
US7112916B2 (en) * 2002-10-09 2006-09-26 Kee Siang Goh Light emitting diode based light source emitting collimated light
US6900474B2 (en) 2002-12-20 2005-05-31 Lumileds Lighting U.S., Llc Light emitting devices with compact active regions
US20060171440A1 (en) * 2003-03-14 2006-08-03 Pbc Lasers Ltd. Apparatus for generating improved laser beam
KR101034055B1 (ko) 2003-07-18 2011-05-12 엘지이노텍 주식회사 발광 다이오드 및 그 제조방법
US7858994B2 (en) * 2006-06-16 2010-12-28 Articulated Technologies, Llc Solid state light sheet and bare die semiconductor circuits with series connected bare die circuit elements
US7217956B2 (en) * 2004-03-29 2007-05-15 Articulated Technologies, Llc. Light active sheet material
US7052924B2 (en) * 2004-03-29 2006-05-30 Articulated Technologies, Llc Light active sheet and methods for making the same
US7476557B2 (en) * 2004-03-29 2009-01-13 Articulated Technologies, Llc Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
US7294961B2 (en) * 2004-03-29 2007-11-13 Articulated Technologies, Llc Photo-radiation source provided with emissive particles dispersed in a charge-transport matrix
US7427782B2 (en) 2004-03-29 2008-09-23 Articulated Technologies, Llc Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
US20070090387A1 (en) * 2004-03-29 2007-04-26 Articulated Technologies, Llc Solid state light sheet and encapsulated bare die semiconductor circuits
US7259030B2 (en) * 2004-03-29 2007-08-21 Articulated Technologies, Llc Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
TW200603401A (en) 2004-04-07 2006-01-16 Nl Nanosemiconductor Gmbh Optoelectronic device based on an antiwaveguiding cavity
US7369583B2 (en) 2004-06-07 2008-05-06 Innolume Gmbh Electrooptically wavelength-tunable resonant cavity optoelectronic device for high-speed data transfer
JP4276684B2 (ja) * 2007-03-27 2009-06-10 株式会社東芝 半導体発光装置及びその製造方法
CN101897041B (zh) * 2007-12-11 2014-07-09 皇家飞利浦电子股份有限公司 具有混合型顶部反射体的侧面发射器件
RU2481672C2 (ru) * 2007-12-11 2013-05-10 Конинклейке Филипс Электроникс Н.В. Устройство для бокового излучения с гибридным верхним отражателем
KR20100137524A (ko) * 2008-04-23 2010-12-30 에이전시 포 사이언스, 테크놀로지 앤드 리서치 발광 다이오드 구조, 램프 장치 및 발광 다이오드 구조를 형성하는 방법
TWI416755B (zh) * 2008-05-30 2013-11-21 Epistar Corp 光源模組、其對應之光棒及其對應之液晶顯示裝置
JP2010232424A (ja) * 2009-03-27 2010-10-14 Fujitsu Ltd 半導体光増幅装置及び光モジュール
JP5519355B2 (ja) * 2010-03-19 2014-06-11 スタンレー電気株式会社 半導体発光素子及びその製造方法
CN104300055B (zh) * 2013-07-17 2019-05-10 晶元光电股份有限公司 发光元件
US11398579B2 (en) * 2013-09-30 2022-07-26 Commissariat à l'énergie atomique et aux énergies alternatives Method for producing optoelectronic devices comprising light-emitting diodes
TWI613838B (zh) * 2014-03-06 2018-02-01 晶元光電股份有限公司 發光元件
CN110854249A (zh) * 2014-03-14 2020-02-28 晶元光电股份有限公司 发光元件
US11282985B2 (en) * 2018-07-17 2022-03-22 Foshan Nationstar Semiconductor Co., Ltd Flip-chip LED chip used in backlight and production method thereof

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5749284A (en) * 1980-09-09 1982-03-23 Matsushita Electric Ind Co Ltd Manufacture of light-emitting display device
JPS5947790A (ja) * 1982-09-13 1984-03-17 Hitachi Ltd 半導体レ−ザ装置
US4590501A (en) * 1983-09-15 1986-05-20 Codenoll Technology Corporation Edge-emitting light emitting diode
JPH0669106B2 (ja) * 1983-10-04 1994-08-31 ロ−ム株式会社 Ｌｅｄ素子
CA1267716A (en) * 1984-02-23 1990-04-10 Frederick W. Scholl Edge-emitting light emitting diode
FR2575870B1 (fr) * 1985-01-10 1987-01-30 Sermage Bernard Laser a semi-conducteur muni de moyens de reinjection de l'emission spontanee dans la couche active
US4779280A (en) * 1986-05-23 1988-10-18 Bernard Sermage Semiconductor laser equipped with means for reinjecting the spontaneous emission into the active layer
JP2658291B2 (ja) * 1988-11-04 1997-09-30 日本電気株式会社 発光素子
JPH02170486A (ja) * 1988-12-23 1990-07-02 Hitachi Ltd 半導体発光装置
JP3141888B2 (ja) * 1989-09-28 2001-03-07 株式会社東芝 半導体発光素子
JP2720554B2 (ja) * 1989-11-22 1998-03-04 大同特殊鋼株式会社 光反射層を備えた発光ダイオード
US4990970A (en) * 1990-01-16 1991-02-05 General Motors Corporation Light emitting semiconductor having a rear reflecting surface
JPH04290275A (ja) * 1991-03-19 1992-10-14 Hitachi Ltd 発光ダイオード
US5319219A (en) * 1992-05-22 1994-06-07 Minnesota Mining And Manufacturing Company Single quantum well II-VI laser diode without cladding
US5363395A (en) * 1992-12-28 1994-11-08 North American Philips Corporation Blue-green injection laser structure utilizing II-VI compounds

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EP0635893A1 (de) 1995-01-25
DE69408374T2 (de) 1998-08-06
US5537433A (en) 1996-07-16
EP0635893B1 (de) 1998-02-04

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