DE69402898T2 - Cyanat-Harzzusammensetzung und kupferbeschichteter Schichtstoff unter Benutzung dieser Zusammensetzung - Google Patents
Cyanat-Harzzusammensetzung und kupferbeschichteter Schichtstoff unter Benutzung dieser ZusammensetzungInfo
- Publication number
- DE69402898T2 DE69402898T2 DE69402898T DE69402898T DE69402898T2 DE 69402898 T2 DE69402898 T2 DE 69402898T2 DE 69402898 T DE69402898 T DE 69402898T DE 69402898 T DE69402898 T DE 69402898T DE 69402898 T2 DE69402898 T2 DE 69402898T2
- Authority
- DE
- Germany
- Prior art keywords
- composition
- copper
- cyanate resin
- coated laminate
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
- 239000010949 copper Substances 0.000 title 1
- 229910052802 copper Inorganic materials 0.000 title 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 title 1
- 239000000203 mixture Substances 0.000 title 1
- 239000011342 resin composition Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/0622—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
- C08G73/0638—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with at least three nitrogen atoms in the ring
- C08G73/065—Preparatory processes
- C08G73/0655—Preparatory processes from polycyanurates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
- C08G73/124—Unsaturated polyimide precursors the unsaturated precursors containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3317193 | 1993-02-23 | ||
JP8181193 | 1993-04-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69402898D1 DE69402898D1 (de) | 1997-06-05 |
DE69402898T2 true DE69402898T2 (de) | 1997-09-25 |
Family
ID=26371813
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69402898T Expired - Fee Related DE69402898T2 (de) | 1993-02-23 | 1994-02-21 | Cyanat-Harzzusammensetzung und kupferbeschichteter Schichtstoff unter Benutzung dieser Zusammensetzung |
Country Status (8)
Country | Link |
---|---|
US (1) | US6037438A (de) |
EP (1) | EP0612782B1 (de) |
KR (1) | KR100305232B1 (de) |
CA (1) | CA2115537A1 (de) |
DE (1) | DE69402898T2 (de) |
MY (1) | MY110844A (de) |
SG (1) | SG43232A1 (de) |
TW (1) | TW408158B (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996020242A1 (en) * | 1994-12-26 | 1996-07-04 | Ciba Specialty Chemicals Inc. | Curable resin compositions |
KR101602512B1 (ko) * | 2008-03-12 | 2016-03-10 | 블루 큐브 아이피 엘엘씨 | 지방족 탄소 함량이 높은 방향족 디시아네이트 화합물 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1248667B (de) * | 1963-02-16 | 1967-08-31 | Farbenfabriken Bayer Aktiengesellschaft Leverkusen | |
SE421006B (sv) * | 1974-03-19 | 1981-11-16 | Mitsubishi Gas Chemical Co | Herdbar hartskomposition av en cyanatesterkomponent och en bismaleinsyraimidkomponent |
GB1477152A (en) * | 1974-09-19 | 1977-06-22 | Mitsubishi Gas Chemical Co | Phenolic resin composition for laminates |
DE2533123A1 (de) * | 1975-07-24 | 1977-02-10 | Bayer Ag | Hydrolysestabile polytriazine und ein verfahren zu ihrer herstellung |
JPS60240729A (ja) * | 1984-05-14 | 1985-11-29 | Mitsubishi Gas Chem Co Inc | 硬化性樹脂組成物 |
JPS61284205A (ja) * | 1985-06-11 | 1986-12-15 | ホセ エム.スリツト | 改良された歯ブラシ |
US4831086A (en) * | 1987-10-05 | 1989-05-16 | Allied-Signal Inc. | Cyanato group containing phenolic resins, phenolic triazines derived therefrom |
US4740584A (en) * | 1986-09-08 | 1988-04-26 | Interez, Inc. | Blend of dicyanate esters of dihydric phenols |
US5260121A (en) * | 1986-11-06 | 1993-11-09 | Amoco Corporation | Fiber-reinforced composite of cyanate ester, epoxy resin and thermoplast |
EP0369527A3 (de) * | 1988-11-14 | 1992-04-01 | Shell Internationale Researchmaatschappij B.V. | Härtbare Harzzusammensetzungen |
JP3008992B2 (ja) * | 1991-04-15 | 2000-02-14 | 三菱瓦斯化学株式会社 | 耐熱性レジンダスト |
CA2070944A1 (en) * | 1991-06-11 | 1992-12-12 | Cynthia A. Arnold | Inorganic oxide modified cyanate resin bodies |
CA2115409A1 (en) * | 1993-02-23 | 1994-08-24 | Yasuhiro Endo | Cyanate resin composition and copper-clad laminate |
-
1994
- 1994-02-11 CA CA002115537A patent/CA2115537A1/en not_active Abandoned
- 1994-02-19 MY MYPI94000394A patent/MY110844A/en unknown
- 1994-02-19 TW TW083101426A patent/TW408158B/zh not_active IP Right Cessation
- 1994-02-21 SG SG1996005929A patent/SG43232A1/en unknown
- 1994-02-21 DE DE69402898T patent/DE69402898T2/de not_active Expired - Fee Related
- 1994-02-21 EP EP94102588A patent/EP0612782B1/de not_active Expired - Lifetime
- 1994-02-22 KR KR1019940003144A patent/KR100305232B1/ko not_active IP Right Cessation
-
1995
- 1995-12-19 US US08/575,011 patent/US6037438A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CA2115537A1 (en) | 1994-08-24 |
SG43232A1 (en) | 1997-10-17 |
US6037438A (en) | 2000-03-14 |
EP0612782B1 (de) | 1997-05-02 |
TW408158B (en) | 2000-10-11 |
KR100305232B1 (ko) | 2002-01-09 |
MY110844A (en) | 1999-05-31 |
EP0612782A1 (de) | 1994-08-31 |
KR940019676A (ko) | 1994-09-14 |
DE69402898D1 (de) | 1997-06-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69420914T2 (de) | Kraftwandler mit piezoelektrischen Elementen | |
DE69433083D1 (de) | Hochfester Verbundwerkstoff | |
AU2771789A (en) | Resin compositions and multilayered structures utilizing the same | |
DE69317474T3 (de) | Abbaubarer Verbundstoff | |
FI944624A (fi) | 4-aryyliaminobentsopyraani- ja niiden kaltaisia yhdisteitä | |
DE69322427T2 (de) | Prepreg und Verbundwerkstoffe | |
DE69414288D1 (de) | Harzzusammensetzung | |
DE69407524D1 (de) | Polyisocyanat-Härtungsmittel und dieses enthaltende Farb- und Klebstoffzusammensetzungen | |
DE68920160T2 (de) | Klebstoffmischungen und Laminate. | |
DE69410375D1 (de) | Hochfester Verbundwerkstoff | |
DE69306682D1 (de) | Polyamidharzzusammensetzung | |
DE69426177T2 (de) | Harzzusammensetzung | |
DE69020707D1 (de) | Thermoplastische Harzzusammensetzungen und ihre Verwendung. | |
DE69609773D1 (de) | Epoxidharzmischung und darauf basierender Klebstoff | |
DE68910674D1 (de) | Behandelbares polyimid-klebemittel und matrizen-kompositharz. | |
DE69400625T2 (de) | Marx-Generator | |
DE69010768T2 (de) | Lichtempfindliche Harzzusammensetzung und Laminat unter Verwendung dieser Zusammensetzung. | |
DE69230752D1 (de) | Harzzusammensetzung und mehrschichtlaminat | |
DE69410777T2 (de) | Polyamidharzzusammensetzung | |
DE69402898T2 (de) | Cyanat-Harzzusammensetzung und kupferbeschichteter Schichtstoff unter Benutzung dieser Zusammensetzung | |
DE59403085D1 (de) | Steuerbares Supraleiter-Bauelement | |
DE69406606D1 (de) | Polyimidharzzusammensetzung | |
SG45135A1 (en) | Cyanate resin composition and copper-clad laminate | |
ATA242394A (de) | Aufschlämmbares material und mit dem material erhaltenes bauelement | |
KR950002615U (ko) | 투척식주낙 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: SUMITOMO CHEMICAL CO. LTD., TOKIO/TOKYO, JP |
|
8339 | Ceased/non-payment of the annual fee |