KR940019676A - 시아네이트 수지 조성물 및 이 조성물을 사용한 구리입힌 적층판 - Google Patents

시아네이트 수지 조성물 및 이 조성물을 사용한 구리입힌 적층판 Download PDF

Info

Publication number
KR940019676A
KR940019676A KR1019940003144A KR19940003144A KR940019676A KR 940019676 A KR940019676 A KR 940019676A KR 1019940003144 A KR1019940003144 A KR 1019940003144A KR 19940003144 A KR19940003144 A KR 19940003144A KR 940019676 A KR940019676 A KR 940019676A
Authority
KR
South Korea
Prior art keywords
resin composition
cyanate
compound
cyanate resin
composition according
Prior art date
Application number
KR1019940003144A
Other languages
English (en)
Other versions
KR100305232B1 (ko
Inventor
야스히로 엔도
요이찌 우에다
도시아끼 하야시
미쓰히로 시바따
슈이찌 가나가와
시니찌로 기따야마
히사시 와따부
Original Assignee
고사이 아끼오
스미또모 가가꾸고오교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 고사이 아끼오, 스미또모 가가꾸고오교 가부시끼가이샤 filed Critical 고사이 아끼오
Publication of KR940019676A publication Critical patent/KR940019676A/ko
Application granted granted Critical
Publication of KR100305232B1 publication Critical patent/KR100305232B1/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/0622—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
    • C08G73/0638—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with at least three nitrogen atoms in the ring
    • C08G73/065—Preparatory processes
    • C08G73/0655—Preparatory processes from polycyanurates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C08G73/124—Unsaturated polyimide precursors the unsaturated precursors containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

하기 식(I)로 표시되는 시아네이트 화합물 또는 그의 프리폴리머 및 경화제 단독 또는 경화제와 브롬화한 에폭시 화합물 또는 말레이미드 화합물 또는 그의 플리폴리머를 필수 성분으로 하는 시아네이트 수지 조성물로, 이 시아네이트 수지 조성물은 낮은 유전율의 경화물 및 구리 박과 상기 시아네이트 수지 조성물의 프리플레그로 이루어진 구리 입힌 적층판을 부여한다.
[식중, R1및 R2는 각기 수소원자 또는 탄소수 1~5의 알킬기를 타나내고; A는 탄소수 1~3의 알킬기를 나타내며; i는 0~3의 정수를 나타낸다.]

Description

시아네이트 수지 조성물 및 이 조성물을 사용한 구리입힌 적층판
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (5)

  1. 하기식(I)로 표시되는 시아네이트 화합물 또는 그의 프리폴리머 및 경화제를 필수성분으로서 함유하는 시아네이트 수지 조성물.
    [식중, R1및 R2는 각기 수소원자 또는 탄소수 1~5의 알킬기를 나타내고; A는 탄소수 1~3의 알킬기를 나타내며; i는 0~3의 정수를 나타낸다.]
  2. 제1항에 있어서, 브롬화 에폭시 화합물 및 말레이미드 화합물 또는 그의 프리폴리머로 이루어진 군으로부터 선택된 하나 이상의 구성원을 더 함유하는 수지 조성물.
  3. 제1 또는 제2항에 있어서, 시아네이트 화합물이 하기 구조식(3)으로 표시되는 화합물인 수지 조성물.
  4. 제2항에 있어서, 말레이미드 화합물이 하기 구조식(4)로 표시되는 화합물인 수지 조성물.
    [식중, X는 하기 구조식 (5),(6),(7),(8),(9) 또는 (10)으로 표시되는 기이다.
  5. 유기 용매에 용해된 제1,2,3, 또는 4항에 따른 시아네이트 수지 조성물의 용액으로 기재를 함침시키고 그 후 수득한 집성체를 가열성형하여 수득된 프리플레그(prepreg)에 구리 박을 적층하여 제조되는 구리 입힌 적층판.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940003144A 1993-02-23 1994-02-22 시아네이트수지조성물및이조성물을사용한구리입힌적층판 KR100305232B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP93-033171 1993-02-23
JP3317193 1993-02-23
JP93-081811 1993-04-08
JP8181193 1993-04-08

Publications (2)

Publication Number Publication Date
KR940019676A true KR940019676A (ko) 1994-09-14
KR100305232B1 KR100305232B1 (ko) 2002-01-09

Family

ID=26371813

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940003144A KR100305232B1 (ko) 1993-02-23 1994-02-22 시아네이트수지조성물및이조성물을사용한구리입힌적층판

Country Status (8)

Country Link
US (1) US6037438A (ko)
EP (1) EP0612782B1 (ko)
KR (1) KR100305232B1 (ko)
CA (1) CA2115537A1 (ko)
DE (1) DE69402898T2 (ko)
MY (1) MY110844A (ko)
SG (1) SG43232A1 (ko)
TW (1) TW408158B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996020242A1 (en) * 1994-12-26 1996-07-04 Ciba Specialty Chemicals Inc. Curable resin compositions
KR101602512B1 (ko) 2008-03-12 2016-03-10 블루 큐브 아이피 엘엘씨 지방족 탄소 함량이 높은 방향족 디시아네이트 화합물

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1248667B (ko) * 1963-02-16 1967-08-31 Farbenfabriken Bayer Aktiengesellschaft Leverkusen
US4110364A (en) * 1974-03-19 1978-08-29 Mitsubishi Gas Chemical Company, Inc. Curable resin compositions of cyanate esters
US4024094A (en) * 1974-09-19 1977-05-17 Mitsubishi Gas Chemical Company, Inc. Phenolic resin composition for laminates
DE2533123A1 (de) * 1975-07-24 1977-02-10 Bayer Ag Hydrolysestabile polytriazine und ein verfahren zu ihrer herstellung
JPS60240729A (ja) * 1984-05-14 1985-11-29 Mitsubishi Gas Chem Co Inc 硬化性樹脂組成物
JPS61284205A (ja) * 1985-06-11 1986-12-15 ホセ　エム．スリツト 改良された歯ブラシ
US4831086A (en) * 1987-10-05 1989-05-16 Allied-Signal Inc. Cyanato group containing phenolic resins, phenolic triazines derived therefrom
US4740584A (en) * 1986-09-08 1988-04-26 Interez, Inc. Blend of dicyanate esters of dihydric phenols
US5260121A (en) * 1986-11-06 1993-11-09 Amoco Corporation Fiber-reinforced composite of cyanate ester, epoxy resin and thermoplast
EP0369527A3 (en) * 1988-11-14 1992-04-01 Shell Internationale Researchmaatschappij B.V. Curable resin compositions
JP3008992B2 (ja) * 1991-04-15 2000-02-14 三菱瓦斯化学株式会社 耐熱性レジンダスト
CA2070944A1 (en) * 1991-06-11 1992-12-12 Cynthia A. Arnold Inorganic oxide modified cyanate resin bodies
CA2115409A1 (en) * 1993-02-23 1994-08-24 Yasuhiro Endo Cyanate resin composition and copper-clad laminate

Also Published As

Publication number Publication date
TW408158B (en) 2000-10-11
EP0612782A1 (en) 1994-08-31
DE69402898D1 (de) 1997-06-05
DE69402898T2 (de) 1997-09-25
SG43232A1 (en) 1997-10-17
MY110844A (en) 1999-05-31
CA2115537A1 (en) 1994-08-24
KR100305232B1 (ko) 2002-01-09
US6037438A (en) 2000-03-14
EP0612782B1 (en) 1997-05-02

Similar Documents

Publication Publication Date Title
KR890010095A (ko) 에폭시수지 조성물 및 그 개량방법
AU2003266671A1 (en) Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using same
TW200611927A (en) Prepreg, method for producing the same, laminated sheet and printed circuit board
EP0889096A3 (en) Modified cyanate ester group curable resin composition, and varnish, prepreg, metal clad laminated board, film, printed circuit board, and multilayered circuit board using the same
KR940004013A (ko) 강화된 열 경화성 수지 계
KR900700530A (ko) 열경화성 폴리이미드수지 및 그 예비중합체 제조방법
KR910016818A (ko) 경화성 수지, 그의 제조 방법 및 전자부품용 보호막
KR880012722A (ko) 금속처리법
KR970042721A (ko) 만니히 염기 경화제
KR940019676A (ko) 시아네이트 수지 조성물 및 이 조성물을 사용한 구리입힌 적층판
KR880004031A (ko) 저장 안정성이 양호한 수지 조성물
KR890011949A (ko) 에폭시 수지 조성물 및 이를 사용하는 복합재료용 프리프레그(prepreg)
KR920006392A (ko) 에폭시 수지, 에폭시 수지 조성물 및 그의 경화제품
KR930016471A (ko) 경화성 수지 및 그의 제조 방법, 및 전자 부품용 보호막
KR940019807A (ko) 시아네이트수지조성물 및 구리피복적층판
KR890003854A (ko) 폴리이미드 피막조성물
JPS57147513A (en) Varnish composition
KR940009279A (ko) 전기 적층체용 폴리페닐렌 에테르/폴리에폭사이드 수지 시스템
KR920006801A (ko) 광감성 중합체 조성물
US5346769A (en) Process for preparing a prepeg comprising a resin derived from dialkenylbenzene and polyarylamine reactants
KR930016828A (ko) 감광성 수지 조성물 및 전자 부품용 보호막
KR880007606A (ko) 봉쇄 디아민으로 부터 제조된 이미드기를 함유하는 중합체 및 그의 제조방법
KR890003873A (ko) 경화제 조성물, 이를 함유한 적층 니스 및 이로부터 제조한 적층물
KR940014617A (ko) 저온 및 주위온도 경화가능한 에폭시 수지 조성물
KR930007996A (ko) 다가 페놀, 및 에폭시 수지와 그로부터 유도된 에폭시 수지 조성물

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20060725

Year of fee payment: 6

LAPS Lapse due to unpaid annual fee