KR880012722A - 금속처리법 - Google Patents

금속처리법 Download PDF

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KR880012722A
KR880012722A KR1019880003692A KR880003692A KR880012722A KR 880012722 A KR880012722 A KR 880012722A KR 1019880003692 A KR1019880003692 A KR 1019880003692A KR 880003692 A KR880003692 A KR 880003692A KR 880012722 A KR880012722 A KR 880012722A
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group
compound
hydrocarbyl
divalent
hydrogen atom
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KR1019880003692A
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KR970004373B1 (ko
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로버트 로우슨 존
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알란 브라이안 벡
임페리알 케미칼 인더스트리스 피엘씨
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    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D277/00—Heterocyclic compounds containing 1,3-thiazole or hydrogenated 1,3-thiazole rings
    • C07D277/60—Heterocyclic compounds containing 1,3-thiazole or hydrogenated 1,3-thiazole rings condensed with carbocyclic rings or ring systems
    • C07D277/62—Benzothiazoles
    • C07D277/68—Benzothiazoles with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached in position 2
    • C07D277/70—Sulfur atoms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D249/00—Heterocyclic compounds containing five-membered rings having three nitrogen atoms as the only ring hetero atoms
    • C07D249/16—Heterocyclic compounds containing five-membered rings having three nitrogen atoms as the only ring hetero atoms condensed with carbocyclic rings or ring systems
    • C07D249/18—Benzotriazoles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C09J2400/166—Metal in the pretreated surface to be joined
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y10T428/31685—Natural source polyamide [e.g., casein, gelatin, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31725—Of polyamide
    • Y10T428/31768—Natural source-type polyamide [e.g., casein, gelatin, etc.]

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Glass Compositions (AREA)
  • Laminated Bodies (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Paints Or Removers (AREA)

Abstract

내용 없음

Description

금속처리법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (12)

  1. 리간드 그룹과 다음 일반식의 그룹을 함유하는 화합물 또는 이 화합물의 염으로 금속 표면을 피복하는 것으로 구성된 방법. -NRCOR1 aXbCR2=CHCOR|3식중, R은 수소원자 또는 1가의 하이드로카빌 또는 치환된 하이드로카빌그룹; R1은 2가의 하이드로카빌 또는 치환된 하이드로 카빌그룹; R2는 수소원자 또는 알킬그룹; R3는 -NR2그룹내의 R그룹들이 동일하거나 상이한 OR또는 -NR2그룹; X는 2가의 -NRO- 또는 -NRCO-그룹; a는 0또는 1: 및 b는 0 또는 1
  2. 제 1항에 있어서, 화합물의 리간도 그룹이 최소한 두개의 혼성원차를 함유하는 화합물인 방법.
  3. 제 1항 또는 제 2항에 있어서, 화합물의 그룹 -NRCOR1aXbCR2=CHCOR이 리간드 그룹의 탄소원자에 연결된 화합물인 방법.
  4. 제 1항부터 제 3항까지중 어느 한 항에 있어서, 화합물의 R2가 수소이고 R3가 그룹 -OH 또는 양이온에 의해 -OH그룹이 수소로 대치되어 유도된 염인 방법.
  5. 제 1항 부터 제 4항까지중 어느 한 항에 있어서, 화합물이 5-(3'-카복시아크릴로일아미노)벤조트리아졸: 5-[6′(3″-카복시아크릴로일아미노)헥사노일아미노]벤조트리아졸: 또는 6-(3'-카복시아크릴로일아미노)-2-더캅토벤조티아졸인 방법.
  6. 제 1항부터 제 5항까지중 어느 한 항에 있어서, 금속표면이 또한 피복 조성물로 피복되는 방법.
  7. 제 6항에 있어서, 피복 조성물이 부분적으로 미리 중합된 점착제 또는 고기능화된 분자량이 작은 점착제인 점착조성물인 방법.
  8. 제 6항 또는 제 7항에 있어서, 리간드 그룹과 다음 일반식의 그룹을 함유하는 화합물 또는 이의 염을 -NRCOR1 aXbCR2=CHCOR3피복조성물내로 함침시켜 이 혼합물을 금속 표면에 도포하는 방법.
  9. 금속의 한 표면의 최소한 일부분에 티간드 그룹과 다음 일반식의 그룹 -NRCOR1 aXbCR2=CHCOR3식중, R은 수소원자 또는 1가의 하이드로카빌 또는 치환된 하이드로카빌그룹; R1은 2가의 하이드로카빌 또는 치환된 하이드로 카빌그룹; R2는 수소원자 또는 알킬그룹; R3는 -NR2그룹내의 R그룹들이 동일하거나 상이한 OR또는 -NR2그룹; X는 2가의 -NRO- 또는 -NRCO-그룹; a는 0또는 1: 및 b는 0 또는 1을 함유하는 화합물 또는 이 화합물의 염을 피복시킨 금속.
  10. 제 9항에서의 피복된 금속이며 점착 조성물인 피복조성물로 피복되었으며 구리가 플라스틱 기판과 결합되는 구리로 구성된 인쇄 회로판.
  11. 다음 일반식의 그룹과 -NRCOR1 aXbCR2=CHCOR3식중, R은 수소원자 또는 1가의 하이드로카빌 또는 치환된 하이드로카빌그룹; R1은 2가의 하이드로카빌 또는 치환된 하이드로 카빌그룹; R2는 수소원자 또는 알킬그룹; R3는 -NR2그룹내의 R그룹들이 동일하거나 상이한 OR또는 -NR2그룹; X는 2가의 -NRO- 또는 -NRCO-그룹; a는 0또는 1: 및 b는 0 또는 1 단, R 및 R2가 수소일때 R3는 -OH그룹, X는 -NHCO-, a와 b는 모두 1이며 R1이 펜타메틸렌 그룹이외의 것이어야 하는 것을 조건할 경우이다. 리간드그룹을 함유하는 화합물 또는 이 화합물의 염.
  12. 제 11항에 있어서, 5-(3'-카복시아크릴로일아미노)벤조트리아졸: 또는 6-(3'-카복시아크릴로일아미노)-2-마캅토벤조티아졸인 화합물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880003692A 1987-04-01 1988-04-01 금속처리법 KR970004373B1 (ko)

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Application Number Priority Date Filing Date Title
GB8707799 1987-04-01
GB8707799A GB8707799D0 (en) 1987-04-01 1987-04-01 Metal treatment

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KR880012722A true KR880012722A (ko) 1988-11-28
KR970004373B1 KR970004373B1 (ko) 1997-03-27

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US (1) US5064723A (ko)
EP (1) EP0285266B1 (ko)
JP (1) JPS63267482A (ko)
KR (1) KR970004373B1 (ko)
AT (1) ATE93531T1 (ko)
AU (1) AU1386488A (ko)
BR (1) BR8801427A (ko)
DE (1) DE3883413T2 (ko)
ES (1) ES2058255T3 (ko)
GB (2) GB8707799D0 (ko)
GR (1) GR3008832T3 (ko)
ZA (1) ZA881914B (ko)

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ES2058255T3 (es) 1994-11-01
EP0285266A2 (en) 1988-10-05
KR970004373B1 (ko) 1997-03-27
DE3883413T2 (de) 1994-01-13
BR8801427A (pt) 1988-11-01
US5064723A (en) 1991-11-12
GB8707799D0 (en) 1987-05-07
GR3008832T3 (ko) 1993-11-30
ZA881914B (en) 1989-02-22
JPS63267482A (ja) 1988-11-04
ATE93531T1 (de) 1993-09-15
EP0285266B1 (en) 1993-08-25
EP0285266A3 (en) 1989-08-30
AU1386488A (en) 1988-10-06
DE3883413D1 (de) 1993-09-30
GB8805205D0 (en) 1988-04-07

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