DE69703182T2 - Neue Ester-Verbindung und ihre enthaltende hitzehärtbare Harz-Zusammensetzung - Google Patents

Neue Ester-Verbindung und ihre enthaltende hitzehärtbare Harz-Zusammensetzung

Info

Publication number
DE69703182T2
DE69703182T2 DE1997603182 DE69703182T DE69703182T2 DE 69703182 T2 DE69703182 T2 DE 69703182T2 DE 1997603182 DE1997603182 DE 1997603182 DE 69703182 T DE69703182 T DE 69703182T DE 69703182 T2 DE69703182 T2 DE 69703182T2
Authority
DE
Germany
Prior art keywords
resin composition
thermosetting resin
ester compound
containing thermosetting
new ester
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE1997603182
Other languages
English (en)
Other versions
DE69703182D1 (de
Inventor
Yasuhiro Endo
Toshiaki Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Chemical Co Ltd
Original Assignee
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP14444696A external-priority patent/JPH09328480A/ja
Priority claimed from JP23055496A external-priority patent/JPH1071674A/ja
Application filed by Sumitomo Chemical Co Ltd filed Critical Sumitomo Chemical Co Ltd
Publication of DE69703182D1 publication Critical patent/DE69703182D1/de
Application granted granted Critical
Publication of DE69703182T2 publication Critical patent/DE69703182T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/28—Chemically modified polycondensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D311/00—Heterocyclic compounds containing six-membered rings having one oxygen atom as the only hetero atom, condensed with other rings
    • C07D311/02—Heterocyclic compounds containing six-membered rings having one oxygen atom as the only hetero atom, condensed with other rings ortho- or peri-condensed with carbocyclic rings or ring systems
    • C07D311/04—Benzo[b]pyrans, not hydrogenated in the carbocyclic ring
    • C07D311/58—Benzo[b]pyrans, not hydrogenated in the carbocyclic ring other than with oxygen or sulphur atoms in position 2 or 4
    • C07D311/60—Benzo[b]pyrans, not hydrogenated in the carbocyclic ring other than with oxygen or sulphur atoms in position 2 or 4 with aryl radicals attached in position 2
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Epoxy Resins (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
DE1997603182 1996-06-06 1997-06-05 Neue Ester-Verbindung und ihre enthaltende hitzehärtbare Harz-Zusammensetzung Expired - Fee Related DE69703182T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP14444696A JPH09328480A (ja) 1996-06-06 1996-06-06 アリールエステル化合物とその製法、およびそれを用いたエポキシ樹脂組成物
JP23055496A JPH1071674A (ja) 1996-08-30 1996-08-30 銅張り積層板

Publications (2)

Publication Number Publication Date
DE69703182D1 DE69703182D1 (de) 2000-11-02
DE69703182T2 true DE69703182T2 (de) 2001-05-17

Family

ID=26475861

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1997603182 Expired - Fee Related DE69703182T2 (de) 1996-06-06 1997-06-05 Neue Ester-Verbindung und ihre enthaltende hitzehärtbare Harz-Zusammensetzung

Country Status (8)

Country Link
US (1) US6270899B1 (de)
EP (1) EP0811619B1 (de)
KR (1) KR100511482B1 (de)
CN (1) CN1157355C (de)
CA (1) CA2207177A1 (de)
DE (1) DE69703182T2 (de)
MY (1) MY116405A (de)
TW (1) TW475926B (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11140276A (ja) * 1997-11-11 1999-05-25 Sumitomo Chem Co Ltd 多官能シアン酸エステル樹脂組成物および樹脂封止型半導体装置
US6882058B2 (en) 2002-11-05 2005-04-19 Henkel Corporation Organic acid containing compositions and methods for use thereof
US20060100412A1 (en) * 2003-02-28 2006-05-11 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. Phenol urea/melamine formaldehyde copolymers, method for the production thereof and use of the same
DE10315290A1 (de) 2003-04-04 2004-10-14 Bayer Materialscience Ag Hochverzweigte Polycarbonate und Copolycarbonate mit verbesserter Fließfähigkeit, ihre Herstellung und Verwendung
CN1313456C (zh) * 2005-06-22 2007-05-02 河南省科学院化学研究所 一种生产甲基六氢苯酐的新方法
CA2621131C (en) * 2005-09-05 2014-03-11 Denki Kagaku Kogyo Kabushiki Kaisha Resin composition and hybrid integrated circuit board making use of the same

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2418459A (en) * 1943-06-12 1947-04-08 Du Pont Pest control
NL207226A (de) * 1956-05-17
US3650799A (en) * 1969-08-11 1972-03-21 Monsanto Co Substrates protected with prepared polymeric ultraviolet light stabilizers from phenol-formaldehyde condensates
GB2064514B (en) * 1979-10-29 1984-01-18 Maruko Pharmaceutical Co Flavan compounds and acid addition salts thereof and pharmaceutical compositions thereof
US4297457A (en) * 1980-07-11 1981-10-27 General Electric Company Curable epoxy resin composition
US4387207A (en) * 1982-07-14 1983-06-07 Paratech, Inc. Resorcinol composition and method of making same
JPS6253327A (ja) * 1985-08-31 1987-03-09 Res Dev Corp Of Japan 硬化性組成物
JP2629990B2 (ja) * 1989-12-20 1997-07-16 住友化学工業株式会社 ポジ型レジスト用組成物
US5182184A (en) * 1990-02-05 1993-01-26 Morton International, Inc. Novolak resins of lowered hydroxyl content and high contrast high thermal stability positive photoresists prepared therefrom
JP3070116B2 (ja) * 1991-03-25 2000-07-24 住友化学工業株式会社 多価フェノール化合物およびそれを用いてなるポジ型レジスト組成物
JP2976597B2 (ja) * 1991-04-17 1999-11-10 住友化学工業株式会社 キノンジアジドスルホン酸エステルの製造方法
TW206247B (de) * 1991-10-11 1993-05-21 Sumitomo Chemical Co
JP3232673B2 (ja) * 1992-08-07 2001-11-26 住友化学工業株式会社 多価フェノール化合物の製造方法
KR100277365B1 (ko) * 1992-11-11 2001-09-17 고사이 아끼오 포지티브형레제스트조성물
TW357180B (en) * 1994-07-19 1999-05-01 Sumitomo Chemical Co An epoxy resin composition and semiconductor device sealed with the above epoxy resin composition
US5726257A (en) * 1994-08-30 1998-03-10 Sumitomo Chemical Company, Ltd. Esterified resorcinol-carbonyl compound condensates and epoxy resins therewith
JPH08269039A (ja) * 1994-09-27 1996-10-15 Sumitomo Chem Co Ltd 新規なアリールエステル化合物とその製法、およびそれを用いたエポキシ樹脂組成物
JPH0899931A (ja) * 1994-10-03 1996-04-16 Sumitomo Chem Co Ltd アリールエステル化合物およびそれを用いたエポキシ樹脂組成物
JP3340864B2 (ja) * 1994-10-26 2002-11-05 富士写真フイルム株式会社 ポジ型化学増幅レジスト組成物
JPH08169937A (ja) * 1994-12-19 1996-07-02 Sumitomo Chem Co Ltd エポキシ樹脂組成物および銅張り積層板

Also Published As

Publication number Publication date
EP0811619B1 (de) 2000-09-27
KR19980018128A (ko) 1998-06-05
CN1157355C (zh) 2004-07-14
TW475926B (en) 2002-02-11
MY116405A (en) 2004-01-31
KR100511482B1 (ko) 2006-03-09
CN1170710A (zh) 1998-01-21
US6270899B1 (en) 2001-08-07
DE69703182D1 (de) 2000-11-02
EP0811619A1 (de) 1997-12-10
CA2207177A1 (en) 1997-12-06

Similar Documents

Publication Publication Date Title
DE69434993D1 (de) Neue harzzusammensetzung
DE69427589T2 (de) Neue zusammensetzung
DE69728045D1 (de) Polyesterzusammensetzung
DE69503861D1 (de) Laserbeschriftbare Harzzusammensetzung
DE69710910T2 (de) Durch feuchtigkeit härtbare schmelzklebstoff-zusammensetzung
DE69309201D1 (de) Wärmehärtende Beschichtungszusammensetzung
DE69738578D1 (de) Photohärtbare Harzzusammensetzung
DK0819749T3 (da) Klæbemiddelsammensætning
DE19782046T1 (de) Harzzusammensetzung
DE69318329D1 (de) Wärmehärtbare Harzzusammensetzungen
DE69530530D1 (de) Fäulnisverhindernde Anstrichzusammensetzung
DE69501378T2 (de) Harzzusammensetzung
DE69709141D1 (de) Harzzusammensetzung
DE69505915D1 (de) Fäulnisverhindernde Anstrichzusammensetzung
DE69528140D1 (de) Polyesterharzzusammensetzung
DE69806419D1 (de) Harzzusammensetzung und ihre Verwendung
DE59712835D1 (de) Stabilisierte monomerenzusammensetzung
DE69703182T2 (de) Neue Ester-Verbindung und ihre enthaltende hitzehärtbare Harz-Zusammensetzung
DE69821664D1 (de) Wärmehärtbare Harzzusammensetzung
DE69322735D1 (de) Thermotrope Kunstharz-Zusammensetzung
BR9710157A (pt) Composição de resina de poliepóxido
DK0801117T3 (da) Begroningshæmmende harpikssammensætning
DE69731687D1 (de) Harzzusammensetzung
DE69419228T2 (de) Wärme-härtbare Organopolysiloxanzusammensetzung
ATE133444T1 (de) Neue kältemittelzusammensetzungen

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: SUMITOMO CHEMICAL CO. LTD., TOKIO/TOKYO, JP

8339 Ceased/non-payment of the annual fee