DE69323899D1 - Wärmebeständiger klebefilm für leiterplatten und dessen verwendungsverfahren - Google Patents

Wärmebeständiger klebefilm für leiterplatten und dessen verwendungsverfahren

Info

Publication number
DE69323899D1
DE69323899D1 DE69323899T DE69323899T DE69323899D1 DE 69323899 D1 DE69323899 D1 DE 69323899D1 DE 69323899 T DE69323899 T DE 69323899T DE 69323899 T DE69323899 T DE 69323899T DE 69323899 D1 DE69323899 D1 DE 69323899D1
Authority
DE
Germany
Prior art keywords
heat
circuit boards
adhesive film
use method
resistant adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69323899T
Other languages
English (en)
Other versions
DE69323899T2 (de
Inventor
Fumihiro Ohmori
Yukihiro Wada
Masatoshi Yuasa
Keiichirou Wada
Makoto Shimose
Kenji Nakajima
Misao Ohkubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Nippon Steel Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co Ltd filed Critical Nippon Steel Chemical Co Ltd
Publication of DE69323899D1 publication Critical patent/DE69323899D1/de
Application granted granted Critical
Publication of DE69323899T2 publication Critical patent/DE69323899T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/10—Block or graft copolymers containing polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide
DE69323899T 1992-12-28 1993-12-27 Wärmebeständiger klebefilm für leiterplatten und dessen verwendungsverfahren Expired - Lifetime DE69323899T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP36117692A JP3221756B2 (ja) 1992-12-28 1992-12-28 プリント基板用耐熱性接着剤フィルム及びその使用方法並びにこれを用いたプリント基板の製造方法
PCT/JP1993/001902 WO1994014911A1 (en) 1992-12-28 1993-12-27 Heat-resistant adhesive film for printed board and method of use thereof

Publications (2)

Publication Number Publication Date
DE69323899D1 true DE69323899D1 (de) 1999-04-15
DE69323899T2 DE69323899T2 (de) 1999-10-21

Family

ID=18472506

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69323899T Expired - Lifetime DE69323899T2 (de) 1992-12-28 1993-12-27 Wärmebeständiger klebefilm für leiterplatten und dessen verwendungsverfahren

Country Status (6)

Country Link
US (1) US5677393A (de)
EP (1) EP0676456B1 (de)
JP (1) JP3221756B2 (de)
DE (1) DE69323899T2 (de)
TW (1) TW239916B (de)
WO (1) WO1994014911A1 (de)

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993024583A1 (en) * 1992-06-04 1993-12-09 Sumitomo Bakelite Company Limited Film adhesive and production thereof
JPH0841438A (ja) * 1994-07-27 1996-02-13 Sumitomo Bakelite Co Ltd 低温加工性の優れた耐熱性フィルム接着剤及びその製造方法
TW389780B (en) * 1995-09-13 2000-05-11 Hitachi Chemical Co Ltd Prepreg for printed circuit board
US5869161A (en) * 1996-06-17 1999-02-09 Occidental Chemical Corporation Tape comprising solvent-containing non-tacky, free-standing, fully imidized polyimide film
US6117510A (en) * 1996-07-30 2000-09-12 Ube Industries, Ltd. Adhesive-applied tape
US5935372A (en) * 1997-04-29 1999-08-10 Occidental Chemical Corporation Adhesive sealant for bonding metal parts to ceramics
TW410534B (en) * 1997-07-16 2000-11-01 Matsushita Electric Ind Co Ltd Wiring board and production process for the same
JP3184485B2 (ja) * 1997-11-06 2001-07-09 三井金属鉱業株式会社 銅張積層板用樹脂組成物、樹脂付き銅箔、多層銅張り積層板および多層プリント配線板
JP3270378B2 (ja) * 1997-11-25 2002-04-02 住友ベークライト株式会社 金属・樹脂複合体、その製造方法及びフレキシブル回路配線板用基板
JP3950560B2 (ja) * 1998-08-14 2007-08-01 株式会社巴川製紙所 電子部品用接着剤および電子部品用接着テープ
JP4423694B2 (ja) * 1999-02-08 2010-03-03 宇部興産株式会社 カバ−レイフィルム用接着剤及びカバ−レイフィルム
KR20020021100A (ko) 1999-05-24 2002-03-18 야마사키 노리쓰카 배선판용 수지 필름의 레이저 가공방법 및 배선판의제조방법
KR100335663B1 (ko) * 1999-10-19 2002-05-06 윤종용 테입리스 ｌｏｃ 패키징용 폴리(이미드-실록산) 화합물
KR100780505B1 (ko) 1999-12-28 2007-11-29 가부시키가이샤 가네카 에폭시변성폴리이미드 및, 이것을 사용한 감광성조성물,커버레이필름, 솔더레지스트, 프린트배선판
WO2001057112A1 (fr) 2000-02-01 2001-08-09 Nippon Steel Chemical Co., Ltd. Resine polyimide adhesive et stratifie adhesif
JP2001226656A (ja) * 2000-02-16 2001-08-21 Tomoegawa Paper Co Ltd 半導体製造装置またはエッチング装置用接着剤、該装置用接着シート及びそれらを用いた構造部品
JP2001234020A (ja) * 2000-02-21 2001-08-28 Hitachi Ltd 樹脂組成物、該樹脂組成物を用いた接着フィルム、金属箔付き接着フィルム、配線基板及び実装構造体
JP4238452B2 (ja) * 2000-03-01 2009-03-18 宇部興産株式会社 ポリイミド系絶縁膜用組成物、絶縁膜および絶縁膜の形成法
JP2001311053A (ja) * 2000-04-28 2001-11-09 Kanegafuchi Chem Ind Co Ltd フィルム状接合部材
JP2002003795A (ja) * 2000-06-26 2002-01-09 Kanegafuchi Chem Ind Co Ltd 新規接着剤組成物及びそれを用いた接合部材
JP4753460B2 (ja) * 2000-08-16 2011-08-24 株式会社クリエイティブ テクノロジー 静電チャック及びその製造方法
JP2002094200A (ja) * 2000-09-18 2002-03-29 Matsushita Electric Ind Co Ltd 回路基板用電気絶縁材と回路基板およびその製造方法
JP2002121207A (ja) * 2000-10-16 2002-04-23 Kanegafuchi Chem Ind Co Ltd 組成物とそれを用いた感光性組成物及びカバーレイ
JP4799740B2 (ja) * 2001-01-17 2011-10-26 日東電工株式会社 配線回路基板用樹脂組成物、配線回路基板用基材および配線回路基板
US20030170431A1 (en) * 2001-05-24 2003-09-11 Masahiro Oguni Heat-resistant resin film with metal layer and wiring board, and method for manufacturing them
US6808819B2 (en) * 2002-02-14 2004-10-26 Shin Etsu Chemical Co., Ltd. Heat resistant resin composition and adhesive film
JP3862004B2 (ja) 2002-05-10 2006-12-27 信越化学工業株式会社 耐熱性樹脂組成物及びそれを用いた接着フィルム
JP4120780B2 (ja) 2002-07-19 2008-07-16 信越化学工業株式会社 フェノール性水酸基を有するポリイミド樹脂の製造方法
JP4219660B2 (ja) 2002-11-18 2009-02-04 信越化学工業株式会社 ウエハダイシング・ダイボンドシート
US7001662B2 (en) * 2003-03-28 2006-02-21 Matsushita Electric Industrial Co., Ltd. Transfer sheet and wiring board using the same, and method of manufacturing the same
TW200427809A (en) 2003-05-19 2004-12-16 Hitachi Chemical Co Ltd Insulating material, film, circuit board and method for manufacture thereof
JP4235808B2 (ja) * 2003-09-19 2009-03-11 信越化学工業株式会社 接着剤組成物及び接着フィルム
JP4395350B2 (ja) * 2003-10-09 2010-01-06 信越化学工業株式会社 硬化性樹脂組成物および導電性接着剤
JP4614349B2 (ja) 2004-09-30 2011-01-19 信越化学工業株式会社 アルコール性水酸基を有するポリイミドおよびその製造方法
US7524617B2 (en) * 2004-11-23 2009-04-28 E.I. Du Pont De Nemours And Company Low-temperature curable photosensitive compositions
JP5114854B2 (ja) * 2005-04-05 2013-01-09 東レ株式会社 熱硬化性樹脂組成物、耐熱性樹脂の製造方法およびそれを用いた電子部品
JP5046366B2 (ja) 2005-10-20 2012-10-10 信越化学工業株式会社 接着剤組成物及び該接着剤からなる接着層を備えたシート
US8080319B2 (en) 2005-10-21 2011-12-20 Kippon Kayaku Kabushiki Kaisha Thermosetting resin composition and use thereof
JP4771414B2 (ja) 2006-02-15 2011-09-14 信越化学工業株式会社 ポリイミドシリコーン樹脂及びそれを含む熱硬化性組成物
TWI306882B (en) * 2006-05-25 2009-03-01 Ind Tech Res Inst Thermoplastic polyimide composition and method of making double-sided flexible copper clad laminate using the same
US20100233476A1 (en) * 2006-06-20 2010-09-16 Makoto Uchida Copper foil with primer resin layer and laminated sheet using the same
JP4922717B2 (ja) * 2006-09-29 2012-04-25 新日鐵化学株式会社 フレキシブル基板の製造方法
WO2008111489A1 (ja) * 2007-03-08 2008-09-18 Nippon Steel Chemical Co., Ltd. 難燃性接着剤樹脂組成物及びそれを用いた接着剤フィルム
WO2009025319A1 (ja) * 2007-08-22 2009-02-26 Sony Chemical & Information Device Corporation ポリイミド組成物、フレキシブル配線板、及び、フレキシブル配線板の製造方法
US8410620B2 (en) 2007-09-20 2013-04-02 Nippon Kayaku Kabushiki Kaisha Primer resin for semiconductor device and semiconductor device
KR20100074296A (ko) 2007-12-04 2010-07-01 히다치 가세고교 가부시끼가이샤 감광성 접착제
US8349700B2 (en) * 2007-12-04 2013-01-08 Hitachi Chemical Company, Ltd. Photosensitive adhesive, semiconductor device and method for manufacturing semiconductor device
JP5343494B2 (ja) * 2008-09-30 2013-11-13 デクセリアルズ株式会社 感光性シロキサンポリイミド樹脂組成物
JP5499312B2 (ja) 2009-09-30 2014-05-21 信越化学工業株式会社 アルコール性水酸基を有する新規のポリイミドシリコーンおよびその製造方法
JP2011080014A (ja) * 2009-10-09 2011-04-21 Hitachi Chem Co Ltd ガラス用接着向上剤、樹脂組成物、及びこれらとガラスとの積層体の製造方法
KR101439496B1 (ko) * 2009-12-22 2014-09-12 에스케이이노베이션 주식회사 폴리아믹산 수지 조성물과 이의 제조방법 및 이를 이용한 폴리이미드 금속적층체
KR101520202B1 (ko) * 2010-12-28 2015-05-13 미쓰이 가가쿠 토세로 가부시키가이샤 수지 조성물, 이것을 포함하는 보호막, 드라이 필름, 회로 기판 및 다층 회로 기판
JP2016020437A (ja) * 2014-07-14 2016-02-04 住友電気工業株式会社 プリント配線板用接着剤組成物、プリント配線板用ボンディングフィルム、プリント配線板用カバーレイ、銅張積層板及びプリント配線板
TWI653780B (zh) * 2016-12-22 2019-03-11 日商京瓷股份有限公司 天線基板及其製造方法
JP7114983B2 (ja) * 2017-03-29 2022-08-09 荒川化学工業株式会社 接着剤、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、プリント配線板、並びに多層配線板及びその製造方法
JP2019172892A (ja) * 2018-03-29 2019-10-10 信越化学工業株式会社 シリコーン変性ポリイミド樹脂組成物
TWI661022B (zh) * 2018-05-30 2019-06-01 律勝科技股份有限公司 接著劑組成物及其接著劑與硬化物

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5291082A (en) * 1976-01-27 1977-08-01 Toray Ind Inc Preparation of laminates
US4277583A (en) * 1979-12-03 1981-07-07 Plastics Engineering Company Oxirane polyimide copolymers
US4543295A (en) * 1980-09-22 1985-09-24 The United States Of America As Represented By The Director Of The National Aeronautics And Space Administration High temperature polyimide film laminates and process for preparation thereof
US4511701A (en) * 1984-02-27 1985-04-16 General Electric Company Heat curable epoxy resin compositions and epoxy resin curing agents
US4937133A (en) * 1988-03-28 1990-06-26 Nippon Steel Chemical Co., Ltd. Flexible base materials for printed circuits
JPH02124972A (ja) * 1988-11-02 1990-05-14 Shin Etsu Chem Co Ltd ポリイミド樹脂溶液組成物
JPH02158681A (ja) * 1988-12-12 1990-06-19 Toshiba Chem Corp 耐熱性接着剤組成物
JP2678934B2 (ja) * 1989-01-20 1997-11-19 宇部興産株式会社 熱硬化性樹脂組成物およびその硬化物
US5108825A (en) * 1989-12-21 1992-04-28 General Electric Company Epoxy/polyimide copolymer blend dielectric and layered circuits incorporating it
JPH0423879A (ja) * 1990-05-18 1992-01-28 Ube Ind Ltd 耐熱性イミド接着剤
JP2520497B2 (ja) * 1990-05-24 1996-07-31 信越化学工業株式会社 カバ―レイフィルム
US5252703A (en) * 1990-06-01 1993-10-12 Ube Industries, Ltd. Polyimidosiloxane resin and composition thereof and method of applying same
JP2597215B2 (ja) * 1990-06-01 1997-04-02 宇部興産株式会社 ポリイミドシロキサン組成物および固化膜
JPH0436366A (ja) * 1990-06-01 1992-02-06 Toshiba Chem Corp フレキシブル印刷回路基板用接着剤組成物
JPH0441581A (ja) * 1990-06-08 1992-02-12 Yokohama Rubber Co Ltd:The フレキシブル基板用接着組成物
JPH0496962A (ja) * 1990-08-10 1992-03-30 Sumitomo Chem Co Ltd エポキシ樹脂組成物およびそれからなるプリプレグ
JPH0513902A (ja) * 1990-09-04 1993-01-22 Chisso Corp フレキシブルプリント基板及びその製造法
JP2952868B2 (ja) * 1990-11-30 1999-09-27 宇部興産株式会社 耐熱性の接着剤
JP2998858B2 (ja) * 1990-11-30 2000-01-17 宇部興産株式会社 耐熱性樹脂接着剤
US5300627A (en) * 1991-10-17 1994-04-05 Chisso Corporation Adhesive polyimide film
JP3039818B2 (ja) * 1991-11-19 2000-05-08 宇部興産株式会社 耐熱性の接着剤

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JP3221756B2 (ja) 2001-10-22
EP0676456A4 (de) 1995-11-02
TW239916B (de) 1995-02-01
EP0676456A1 (de) 1995-10-11
US5677393A (en) 1997-10-14
WO1994014911A1 (en) 1994-07-07
JPH06200216A (ja) 1994-07-19
DE69323899T2 (de) 1999-10-21

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