DE69716270D1 - Klebefilm zum verbinden einer schaltung und einer leiterplatte - Google Patents
Klebefilm zum verbinden einer schaltung und einer leiterplatteInfo
- Publication number
- DE69716270D1 DE69716270D1 DE69716270T DE69716270T DE69716270D1 DE 69716270 D1 DE69716270 D1 DE 69716270D1 DE 69716270 T DE69716270 T DE 69716270T DE 69716270 T DE69716270 T DE 69716270T DE 69716270 D1 DE69716270 D1 DE 69716270D1
- Authority
- DE
- Germany
- Prior art keywords
- pcb
- circuit
- adhesive film
- adhesive
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- H01L2924/0665—Epoxy resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18464796 | 1996-07-15 | ||
JP18920596 | 1996-07-18 | ||
JP6689997 | 1997-03-19 | ||
PCT/JP1997/002455 WO1998003047A1 (en) | 1996-07-15 | 1997-07-15 | Film-like adhesive for connecting circuit and circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69716270D1 true DE69716270D1 (de) | 2002-11-14 |
DE69716270T2 DE69716270T2 (de) | 2003-07-10 |
Family
ID=27299299
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69716270T Expired - Lifetime DE69716270T2 (de) | 1996-07-15 | 1997-07-15 | Klebefilm zum verbinden einer schaltung und einer leiterplatte |
Country Status (7)
Country | Link |
---|---|
US (1) | US6328844B1 (de) |
EP (1) | EP0914027B1 (de) |
JP (1) | JP3342703B2 (de) |
AU (1) | AU3460997A (de) |
DE (1) | DE69716270T2 (de) |
TW (2) | TW505686B (de) |
WO (1) | WO1998003047A1 (de) |
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AU572615B2 (en) * | 1983-12-27 | 1988-05-12 | Sony Corporation | Electrically conductive adhesive sheet circuit board and electrical connection structure |
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US4999136A (en) | 1988-08-23 | 1991-03-12 | Westinghouse Electric Corp. | Ultraviolet curable conductive resin |
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JPH06203627A (ja) | 1992-12-28 | 1994-07-22 | Dai Ichi Kogyo Seiyaku Co Ltd | 導電性組成物 |
JP2830681B2 (ja) * | 1993-03-08 | 1998-12-02 | ソニーケミカル株式会社 | Icチップ実装方法 |
-
1997
- 1997-07-15 TW TW086109989A patent/TW505686B/zh not_active IP Right Cessation
- 1997-07-15 DE DE69716270T patent/DE69716270T2/de not_active Expired - Lifetime
- 1997-07-15 EP EP97930803A patent/EP0914027B1/de not_active Expired - Lifetime
- 1997-07-15 TW TW091100114A patent/TWI235759B/zh not_active IP Right Cessation
- 1997-07-15 WO PCT/JP1997/002455 patent/WO1998003047A1/ja active IP Right Grant
- 1997-07-15 US US09/230,017 patent/US6328844B1/en not_active Expired - Lifetime
- 1997-07-15 AU AU34609/97A patent/AU3460997A/en not_active Abandoned
- 1997-07-15 JP JP50585598A patent/JP3342703B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
AU3460997A (en) | 1998-02-09 |
EP0914027A4 (de) | 1999-10-06 |
EP0914027B1 (de) | 2002-10-09 |
WO1998003047A1 (en) | 1998-01-22 |
DE69716270T2 (de) | 2003-07-10 |
TW505686B (en) | 2002-10-11 |
TWI235759B (en) | 2005-07-11 |
US6328844B1 (en) | 2001-12-11 |
JP3342703B2 (ja) | 2002-11-11 |
EP0914027A1 (de) | 1999-05-06 |
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