DE69718252D1 - Erdung einer Leiterplatte - Google Patents

Erdung einer Leiterplatte

Info

Publication number
DE69718252D1
DE69718252D1 DE69718252T DE69718252T DE69718252D1 DE 69718252 D1 DE69718252 D1 DE 69718252D1 DE 69718252 T DE69718252 T DE 69718252T DE 69718252 T DE69718252 T DE 69718252T DE 69718252 D1 DE69718252 D1 DE 69718252D1
Authority
DE
Germany
Prior art keywords
earthing
circuit board
board
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69718252T
Other languages
English (en)
Other versions
DE69718252T2 (de
Inventor
Geun-Soo Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Application granted granted Critical
Publication of DE69718252D1 publication Critical patent/DE69718252D1/de
Publication of DE69718252T2 publication Critical patent/DE69718252T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/66—Circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/6435—Aspects relating to the user interface of the microwave heating apparatus

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Ovens (AREA)
  • Constitution Of High-Frequency Heating (AREA)
DE69718252T 1996-07-29 1997-07-29 Erdung einer Leiterplatte Expired - Fee Related DE69718252T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR19960022582 1996-07-29

Publications (2)

Publication Number Publication Date
DE69718252D1 true DE69718252D1 (de) 2003-02-13
DE69718252T2 DE69718252T2 (de) 2003-10-30

Family

ID=19462661

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69718252T Expired - Fee Related DE69718252T2 (de) 1996-07-29 1997-07-29 Erdung einer Leiterplatte

Country Status (7)

Country Link
US (1) US5856656A (de)
EP (1) EP0822734B1 (de)
JP (1) JP2818160B2 (de)
KR (1) KR100239514B1 (de)
CN (1) CN1093621C (de)
DE (1) DE69718252T2 (de)
MY (1) MY117375A (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6740824B2 (en) * 2002-06-25 2004-05-25 Motorola, Inc. Ground connector assembly with substrate strain relief and method of making same
CN100414178C (zh) * 2003-02-21 2008-08-27 乐金电子(天津)电器有限公司 微波炉的接地结构
CN100455893C (zh) * 2003-07-29 2009-01-28 乐金电子(天津)电器有限公司 微波炉的控制面板的接地结构
CN100465519C (zh) * 2003-12-12 2009-03-04 乐金电子(天津)电器有限公司 微波炉的控制组件
KR100556609B1 (ko) 2004-02-20 2006-03-06 삼성전자주식회사 전자렌지
US8908382B2 (en) * 2010-01-21 2014-12-09 Lg Electronics Inc. Control panel for microwave oven
KR101867846B1 (ko) * 2011-11-01 2018-06-19 삼성전자주식회사 텔레비전 튜너 모듈 및 이를 구비한 방송수신장치
CN206713185U (zh) * 2017-03-21 2017-12-05 赤多尼科两合股份有限公司 电路板组件
CN209893774U (zh) * 2019-01-04 2020-01-03 青岛海尔股份有限公司 冷藏冷冻装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57144826A (en) * 1981-03-02 1982-09-07 Matsushita Electric Ind Co Ltd Heating cooker
DE8213627U1 (de) * 1982-05-11 1982-08-19 Siemens AG, 1000 Berlin und 8000 München Steckbare Leiterplatte für die elektrische Nachrichtentechnik
DE3790062C2 (de) * 1986-02-06 1992-01-23 Fujitsu Ltd., Kawasaki, Kanagawa, Jp
DE8711015U1 (de) * 1987-08-12 1987-10-08 Tandberg Data A/S, Oslo Tastatur
IT8819772A0 (it) * 1988-03-15 1988-03-15 Honeywell Bull Spa Dispositivo selettivo a terra per apparecchiature elettroniche.
JPH02250287A (ja) * 1989-03-23 1990-10-08 Matsushita Electric Ind Co Ltd 高周波加熱装置
JPH05205868A (ja) * 1992-01-22 1993-08-13 Sanyo Electric Co Ltd 高周波加熱装置
KR950012114U (ko) * 1993-10-07 1995-05-16 전자레인지 콘트롤부의 접지구조
JPH08233286A (ja) * 1995-02-28 1996-09-10 Toshiba Corp 電子レンジ
KR200151883Y1 (ko) * 1995-04-28 1999-07-15 전주범 테이프 레코더의 접지 구조 장치
US5563761A (en) * 1995-08-11 1996-10-08 The Whitaker Corporation Transient voltage surge protection assembly for telecommunications lines

Also Published As

Publication number Publication date
DE69718252T2 (de) 2003-10-30
EP0822734B1 (de) 2003-01-08
MY117375A (en) 2004-06-30
KR100239514B1 (ko) 2000-01-15
JPH10169994A (ja) 1998-06-26
EP0822734A1 (de) 1998-02-04
CN1093621C (zh) 2002-10-30
CN1172230A (zh) 1998-02-04
US5856656A (en) 1999-01-05
KR980010148A (ko) 1998-04-30
JP2818160B2 (ja) 1998-10-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee