DE69310422T2 - Vorrichtung für Dampfphasenepitaxie von zusammengesetzten Halbleitern - Google Patents
Vorrichtung für Dampfphasenepitaxie von zusammengesetzten HalbleiternInfo
- Publication number
- DE69310422T2 DE69310422T2 DE69310422T DE69310422T DE69310422T2 DE 69310422 T2 DE69310422 T2 DE 69310422T2 DE 69310422 T DE69310422 T DE 69310422T DE 69310422 T DE69310422 T DE 69310422T DE 69310422 T2 DE69310422 T2 DE 69310422T2
- Authority
- DE
- Germany
- Prior art keywords
- vapor phase
- phase epitaxy
- compound semiconductors
- semiconductors
- epitaxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/14—Feed and outlet means for the gases; Modifying the flow of the reactive gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP04049711A JP3131005B2 (ja) | 1992-03-06 | 1992-03-06 | 化合物半導体気相成長装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69310422D1 DE69310422D1 (de) | 1997-06-12 |
DE69310422T2 true DE69310422T2 (de) | 1997-11-06 |
Family
ID=12838776
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69310422T Expired - Fee Related DE69310422T2 (de) | 1992-03-06 | 1993-02-01 | Vorrichtung für Dampfphasenepitaxie von zusammengesetzten Halbleitern |
Country Status (4)
Country | Link |
---|---|
US (1) | US5370738A (de) |
EP (1) | EP0559326B1 (de) |
JP (1) | JP3131005B2 (de) |
DE (1) | DE69310422T2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102016101003A1 (de) | 2016-01-21 | 2017-07-27 | Aixtron Se | CVD-Vorrichtung mit einem als Baugruppe aus dem Reaktorgehäuse entnehmbaren Prozesskammergehäuse |
Families Citing this family (60)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5821175A (en) * | 1988-07-08 | 1998-10-13 | Cauldron Limited Partnership | Removal of surface contaminants by irradiation using various methods to achieve desired inert gas flow over treated surface |
JP3008782B2 (ja) | 1994-07-15 | 2000-02-14 | 信越半導体株式会社 | 気相成長方法およびその装置 |
JP3042335B2 (ja) * | 1994-10-25 | 2000-05-15 | 信越半導体株式会社 | 気相成長方法及びその装置 |
FI97730C (fi) * | 1994-11-28 | 1997-02-10 | Mikrokemia Oy | Laitteisto ohutkalvojen valmistamiseksi |
FI100409B (fi) | 1994-11-28 | 1997-11-28 | Asm Int | Menetelmä ja laitteisto ohutkalvojen valmistamiseksi |
FI97731C (fi) * | 1994-11-28 | 1997-02-10 | Mikrokemia Oy | Menetelmä ja laite ohutkalvojen valmistamiseksi |
US6093252A (en) | 1995-08-03 | 2000-07-25 | Asm America, Inc. | Process chamber with inner support |
WO1997036320A1 (fr) * | 1996-03-22 | 1997-10-02 | Nippon Sanso Corporation | Appareil de tirage en phase vapeur et procede de tirage en phase vapeur |
US6090211A (en) * | 1996-03-27 | 2000-07-18 | Matsushita Electric Industrial Co., Ltd. | Apparatus and method for forming semiconductor thin layer |
US5653808A (en) * | 1996-08-07 | 1997-08-05 | Macleish; Joseph H. | Gas injection system for CVD reactors |
US5891251A (en) * | 1996-08-07 | 1999-04-06 | Macleish; Joseph H. | CVD reactor having heated process chamber within isolation chamber |
JPH1154442A (ja) * | 1997-08-07 | 1999-02-26 | Shin Etsu Handotai Co Ltd | 化合物半導体エピタキシャルウェーハの製造方法およびこれに用いる気相成長装置 |
KR100712241B1 (ko) * | 1999-05-13 | 2007-04-27 | 이엠에프 아일랜드 리미티드 | 기판상에 재료를 에피택셜성장시키는 방법 및 장치 |
US6383330B1 (en) | 1999-09-10 | 2002-05-07 | Asm America, Inc. | Quartz wafer processing chamber |
EP1292970B1 (de) * | 2000-06-08 | 2011-09-28 | Genitech Inc. | Verfahren zur herstellung einer dünnen schicht |
JP4588894B2 (ja) * | 2001-01-31 | 2010-12-01 | 信越半導体株式会社 | 気相成長装置及びエピタキシャルウェーハの製造方法 |
TW544775B (en) * | 2001-02-28 | 2003-08-01 | Japan Pionics | Chemical vapor deposition apparatus and chemical vapor deposition method |
JP2002371361A (ja) * | 2001-06-18 | 2002-12-26 | Japan Pionics Co Ltd | 気相成長装置及び気相成長方法 |
US6820570B2 (en) * | 2001-08-15 | 2004-11-23 | Nobel Biocare Services Ag | Atomic layer deposition reactor |
US7163587B2 (en) * | 2002-02-08 | 2007-01-16 | Axcelis Technologies, Inc. | Reactor assembly and processing method |
US6800134B2 (en) | 2002-03-26 | 2004-10-05 | Micron Technology, Inc. | Chemical vapor deposition methods and atomic layer deposition methods |
DE10320597A1 (de) * | 2003-04-30 | 2004-12-02 | Aixtron Ag | Verfahren und Vorrichtung zum Abscheiden von Halbleiterschichten mit zwei Prozessgasen, von denen das eine vorkonditioniert ist |
US20050221618A1 (en) * | 2004-03-31 | 2005-10-06 | Amrhein Frederick J | System for controlling a plenum output flow geometry |
JP2006080374A (ja) * | 2004-09-10 | 2006-03-23 | Sharp Corp | 窒化物半導体の製造装置および窒化物半導体レーザ素子 |
US8211230B2 (en) | 2005-01-18 | 2012-07-03 | Asm America, Inc. | Reaction system for growing a thin film |
JP4598568B2 (ja) * | 2005-03-09 | 2010-12-15 | 大陽日酸株式会社 | 気相成長装置 |
KR101272321B1 (ko) * | 2005-05-09 | 2013-06-07 | 한국에이에스엠지니텍 주식회사 | 복수의 기체 유입구를 가지는 원자층 증착 장치의 반응기 |
US7396415B2 (en) * | 2005-06-02 | 2008-07-08 | Asm America, Inc. | Apparatus and methods for isolating chemical vapor reactions at a substrate surface |
JP4534978B2 (ja) * | 2005-12-21 | 2010-09-01 | トヨタ自動車株式会社 | 半導体薄膜製造装置 |
JP4193883B2 (ja) | 2006-07-05 | 2008-12-10 | 住友電気工業株式会社 | 有機金属気相成長装置 |
JP2008034780A (ja) * | 2006-07-07 | 2008-02-14 | Fuji Electric Holdings Co Ltd | エピタキシャルSiC膜付き半導体SiC基板の製造方法およびそのエピタキシャルSiC成膜装置 |
KR101355638B1 (ko) * | 2006-11-09 | 2014-01-29 | 한국에이에스엠지니텍 주식회사 | 원자층 증착 장치 |
US20080131979A1 (en) * | 2006-12-04 | 2008-06-05 | Sumitomo Electric Industries, Ltd. | Vapor-Phase Growth System and Vapor-Phase Growth Method |
US20080241387A1 (en) * | 2007-03-29 | 2008-10-02 | Asm International N.V. | Atomic layer deposition reactor |
US20080241384A1 (en) * | 2007-04-02 | 2008-10-02 | Asm Genitech Korea Ltd. | Lateral flow deposition apparatus and method of depositing film by using the apparatus |
JP5064132B2 (ja) * | 2007-07-25 | 2012-10-31 | シャープ株式会社 | 気相成長装置、及び半導体素子の製造方法 |
JP4466723B2 (ja) | 2007-11-21 | 2010-05-26 | 住友電気工業株式会社 | 有機金属気相成長装置 |
US8282735B2 (en) * | 2007-11-27 | 2012-10-09 | Asm Genitech Korea Ltd. | Atomic layer deposition apparatus |
JP5587205B2 (ja) * | 2007-12-20 | 2014-09-10 | ソイテック | エピタキシャル成長基板に前駆体ガスを送出するための装置 |
JP5060324B2 (ja) * | 2008-01-31 | 2012-10-31 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法及び処理容器 |
US8383525B2 (en) | 2008-04-25 | 2013-02-26 | Asm America, Inc. | Plasma-enhanced deposition process for forming a metal oxide thin film and related structures |
US20100266765A1 (en) * | 2009-04-21 | 2010-10-21 | White Carl L | Method and apparatus for growing a thin film onto a substrate |
CN101924023A (zh) * | 2009-06-09 | 2010-12-22 | 日本派欧尼株式会社 | Iii族氮化物半导体的气相生长装置 |
US9243329B2 (en) | 2009-08-12 | 2016-01-26 | Georgia State University Research Foundation, Inc. | High pressure chemical vapor deposition apparatuses, methods, and compositions produced therewith |
WO2011063007A2 (en) * | 2009-11-18 | 2011-05-26 | Rec Silicon Inc | Fluid bed reactor |
WO2012127305A1 (en) * | 2011-03-21 | 2012-09-27 | Centrotherm Photovoltaics Ag | Gas supply for a processing furnace |
US9512520B2 (en) * | 2011-04-25 | 2016-12-06 | Applied Materials, Inc. | Semiconductor substrate processing system |
JP2012248803A (ja) * | 2011-05-31 | 2012-12-13 | Hitachi Cable Ltd | 金属塩化物ガスの発生装置および金属塩化物ガスの発生方法、並びに、ハイドライド気相成長装置、窒化物半導体ウエハ、窒化物半導体デバイス、窒化物半導体発光ダイオード用ウエハ、窒化物半導体自立基板の製造方法および窒化物半導体結晶 |
US9644285B2 (en) | 2011-08-22 | 2017-05-09 | Soitec | Direct liquid injection for halide vapor phase epitaxy systems and methods |
WO2013027098A1 (en) * | 2011-08-22 | 2013-02-28 | Soitec | Deposition systems including a precursor gas furnace within a reaction chamber, and related methods |
TWI565825B (zh) * | 2012-06-07 | 2017-01-11 | 索泰克公司 | 沉積系統之氣體注入組件及相關使用方法 |
TWI480414B (zh) * | 2012-11-14 | 2015-04-11 | Ind Tech Res Inst | 噴氣系統及氣相磊晶設備 |
US20160194753A1 (en) * | 2012-12-27 | 2016-07-07 | Showa Denko K.K. | SiC-FILM FORMATION DEVICE AND METHOD FOR PRODUCING SiC FILM |
US20150345046A1 (en) * | 2012-12-27 | 2015-12-03 | Showa Denko K.K. | Film-forming device |
CN107587117B (zh) * | 2017-08-16 | 2019-06-11 | 武汉华星光电半导体显示技术有限公司 | 一种气体扩散装置 |
US10872803B2 (en) | 2017-11-03 | 2020-12-22 | Asm Ip Holding B.V. | Apparatus and methods for isolating a reaction chamber from a loading chamber resulting in reduced contamination |
US10872804B2 (en) | 2017-11-03 | 2020-12-22 | Asm Ip Holding B.V. | Apparatus and methods for isolating a reaction chamber from a loading chamber resulting in reduced contamination |
US11032945B2 (en) * | 2019-07-12 | 2021-06-08 | Applied Materials, Inc. | Heat shield assembly for an epitaxy chamber |
KR102564228B1 (ko) * | 2021-04-29 | 2023-08-09 | 주식회사 테스 | 유기금속화학기상증착장치 |
WO2023175826A1 (ja) * | 2022-03-17 | 2023-09-21 | 株式会社Kokusai Electric | 基板処理装置、ガスノズル、半導体装置の製造方法、基板処理方法及びプログラム |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6055478B2 (ja) * | 1982-10-19 | 1985-12-05 | 松下電器産業株式会社 | 気相成長方法 |
US4731255A (en) * | 1984-09-26 | 1988-03-15 | Applied Materials Japan, Inc. | Gas-phase growth process and an apparatus for the same |
JPS61186288A (ja) * | 1985-02-14 | 1986-08-19 | Nec Corp | 炭化珪素化合物半導体の気相エピタキシヤル成長装置 |
JPH0691020B2 (ja) * | 1986-02-14 | 1994-11-14 | 日本電信電話株式会社 | 気相成長方法および装置 |
US5373171A (en) * | 1987-03-12 | 1994-12-13 | Sumitomo Electric Industries, Ltd. | Thin film single crystal substrate |
JPH01136971A (ja) * | 1987-11-20 | 1989-05-30 | Fujitsu Ltd | 気相成長装置 |
GB2213837B (en) * | 1987-12-22 | 1992-03-11 | Philips Electronic Associated | Electronic device manufacture with deposition of material |
JPH0225577A (ja) * | 1988-07-15 | 1990-01-29 | Mitsubishi Electric Corp | 薄膜形成装置 |
JPH02150040A (ja) * | 1988-11-30 | 1990-06-08 | Fujitsu Ltd | 気相成長装置 |
JPH03250623A (ja) * | 1990-02-28 | 1991-11-08 | Nec Corp | 3―5族化合物半導体の気相成長方法 |
FR2661554A1 (fr) * | 1990-04-30 | 1991-10-31 | Philips Electronique Lab | Dispositif d'introduction des gaz dans la chambre d'un reacteur d'epitaxie, chambre de reacteur comportant un tel dispositif d'introduction de gaz, et utilisation d'une telle chambre pour la realisation de couches semiconductrices. |
JP2722833B2 (ja) * | 1991-03-18 | 1998-03-09 | 富士通株式会社 | 気相エピタキシャル成長装置および気相エピタキシャル成長方法 |
US5254210A (en) * | 1992-04-27 | 1993-10-19 | The United States Of America As Represented By The Secretary Of The Army | Method and apparatus for growing semiconductor heterostructures |
-
1992
- 1992-03-06 JP JP04049711A patent/JP3131005B2/ja not_active Expired - Fee Related
-
1993
- 1993-02-01 DE DE69310422T patent/DE69310422T2/de not_active Expired - Fee Related
- 1993-02-01 EP EP93300724A patent/EP0559326B1/de not_active Expired - Lifetime
- 1993-02-03 US US08/012,780 patent/US5370738A/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102016101003A1 (de) | 2016-01-21 | 2017-07-27 | Aixtron Se | CVD-Vorrichtung mit einem als Baugruppe aus dem Reaktorgehäuse entnehmbaren Prozesskammergehäuse |
Also Published As
Publication number | Publication date |
---|---|
DE69310422D1 (de) | 1997-06-12 |
US5370738A (en) | 1994-12-06 |
EP0559326A1 (de) | 1993-09-08 |
EP0559326B1 (de) | 1997-05-07 |
JPH06216030A (ja) | 1994-08-05 |
JP3131005B2 (ja) | 2001-01-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8320 | Willingness to grant licences declared (paragraph 23) | ||
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |