DE69320540T2 - Herstellungsverfahren von Verbindungshalbleitern - Google Patents

Herstellungsverfahren von Verbindungshalbleitern

Info

Publication number
DE69320540T2
DE69320540T2 DE69320540T DE69320540T DE69320540T2 DE 69320540 T2 DE69320540 T2 DE 69320540T2 DE 69320540 T DE69320540 T DE 69320540T DE 69320540 T DE69320540 T DE 69320540T DE 69320540 T2 DE69320540 T2 DE 69320540T2
Authority
DE
Germany
Prior art keywords
manufacturing process
compound semiconductors
semiconductors
compound
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69320540T
Other languages
English (en)
Other versions
DE69320540D1 (de
Inventor
Hideki Goto
Kenji Shimoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP14180792A external-priority patent/JP3158651B2/ja
Application filed by Mitsubishi Chemical Corp filed Critical Mitsubishi Chemical Corp
Publication of DE69320540D1 publication Critical patent/DE69320540D1/de
Application granted granted Critical
Publication of DE69320540T2 publication Critical patent/DE69320540T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02019—Chemical etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02387—Group 13/15 materials
    • H01L21/02395—Arsenides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02538—Group 13/15 materials
    • H01L21/02546—Arsenides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/0257—Doping during depositing
    • H01L21/02573—Conductivity type
    • H01L21/02576—N-type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02656—Special treatments
    • H01L21/02658—Pretreatments
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604—Chemical etching
    • H01L21/30612—Etching of AIIIBV compounds
    • H01L21/30621—Vapour phase etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
DE69320540T 1992-06-02 1993-06-02 Herstellungsverfahren von Verbindungshalbleitern Expired - Fee Related DE69320540T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14180792A JP3158651B2 (ja) 1991-07-04 1992-06-02 化合物半導体及びその製造方法

Publications (2)

Publication Number Publication Date
DE69320540D1 DE69320540D1 (de) 1998-10-01
DE69320540T2 true DE69320540T2 (de) 1999-02-18

Family

ID=15300589

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69320540T Expired - Fee Related DE69320540T2 (de) 1992-06-02 1993-06-02 Herstellungsverfahren von Verbindungshalbleitern

Country Status (3)

Country Link
US (1) US5400740A (de)
EP (1) EP0573270B1 (de)
DE (1) DE69320540T2 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5346581A (en) * 1993-04-01 1994-09-13 At&T Bell Laboratories Method of making a compound semiconductor device
JPH07211692A (ja) * 1994-01-12 1995-08-11 Sumitomo Electric Ind Ltd ＩｎＰ系化合物半導体の加工方法
KR0162865B1 (ko) * 1995-03-09 1999-02-01 김은영 반도체 패턴 측면의 에피성장율 조절방법
TW290743B (de) * 1995-03-27 1996-11-11 Sumitomo Electric Industries
JP3341763B2 (ja) * 2000-04-27 2002-11-05 住友電気工業株式会社 化合物半導体装置の製造方法および化合物半導体装置の製造装置
JP2004343139A (ja) * 2001-11-19 2004-12-02 Sanyo Electric Co Ltd 化合物半導体発光素子
JP2005005727A (ja) * 2001-11-19 2005-01-06 Sanyo Electric Co Ltd 化合物半導体発光素子
EP1460694A1 (de) 2001-11-19 2004-09-22 Sanyo Electric Co., Ltd. Zusammengesetzte halbleiterlichtemissionseinrichtung und verfahren zu ihrer herstellung
JP2004055975A (ja) * 2002-07-23 2004-02-19 Sharp Corp 半導体発光装置およびその製造方法
US20070020933A1 (en) * 2003-09-24 2007-01-25 Koichi Naniwae Method of cleaning treatment and method for manufacturing semiconductor device
JP2009088074A (ja) * 2007-09-28 2009-04-23 Mitsubishi Electric Corp 半導体装置の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4147571A (en) * 1977-07-11 1979-04-03 Hewlett-Packard Company Method for vapor epitaxial deposition of III/V materials utilizing organometallic compounds and a halogen or halide in a hot wall system
JPS5670630A (en) * 1979-11-14 1981-06-12 Mitsubishi Monsanto Chem Co Manufacture of compound semiconductor by gas phase epitaxial growth
US4488914A (en) * 1982-10-29 1984-12-18 The United States Of America As Represented By The Secretary Of The Air Force Process for the epitaxial deposition of III-V compounds utilizing a continuous in-situ hydrogen chloride etch
US4671847A (en) * 1985-11-18 1987-06-09 The United States Of America As Represented By The Secretary Of The Navy Thermally-activated vapor etchant for InP
JP2735190B2 (ja) * 1987-04-02 1998-04-02 日本電気株式会社 分子線エピタキシヤル成長方法及び成長装置
US5068007A (en) * 1990-09-24 1991-11-26 Motorola, Inc. Etching of materials in a noncorrosive environment

Also Published As

Publication number Publication date
EP0573270A3 (de) 1994-02-16
DE69320540D1 (de) 1998-10-01
EP0573270A2 (de) 1993-12-08
EP0573270B1 (de) 1998-08-26
US5400740A (en) 1995-03-28

Similar Documents

Publication Publication Date Title
DE69333619D1 (de) Herstellungsverfahren für Halbleitersubstrate
DE69325325T2 (de) Verfahren zur Herstellung von Halbleiterscheiben
EP0466335A3 (en) Process of manufacturing semiconductor devices
DE69332140T2 (de) Leiterrahmen-Kondensator
DE69326262D1 (de) Verbindungshalbleiterbauelemente
DE69025805D1 (de) Herstellen von Halbleitervorrichtungen
DE69231910D1 (de) Herstellungsverfahren von Verbindungen
EP0442414A3 (en) Compound semiconductor substrate and method of manufacturing the same
DE69327600D1 (de) Herstellungsverfahren von Submikronkontakten
DE69329844T2 (de) Beschichtungsverfahren
DE69210213D1 (de) Bürstenherstellungsverfahren
DE69320540T2 (de) Herstellungsverfahren von Verbindungshalbleitern
DE69315370D1 (de) Herstellung von rauhen Silizium-Oberflächen
DE69310623T2 (de) Herstellungsverfahren von geformten hohlen Werkzeugen
DE69319317T2 (de) Halbleiterlaser und Herstellungsverfahren
ITMI921157A0 (it) Processo per la preparazione di alchilpoliglucosidi
DE69327487T2 (de) Herstellungsverfahren von Verbindungshalbleitern
FI932571A0 (fi) Kemisk process
ITMI920134A0 (it) Procedimento migliorato per la produzione di calcourea
DE69310997D1 (de) Prillverfahren
DE68910873T2 (de) Herstellungsverfahren von Halbleitervorrichtungen.
ITMI910319A1 (it) Processo di dealogenazione di 1, 3-diossolani
DE69309870D1 (de) Drehverfahren
ITMI921156A0 (it) Processo per la produzione di idrossialchil-glucosidi
FI943660A0 (fi) Menetelmä 3-karbonyyliandrostadieeni-17-karboksamidien valmistamiseksi

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee