DE69113187T2 - Verfahren zur Herstellung einer elektronische Dünnschichtanordnung. - Google Patents
Verfahren zur Herstellung einer elektronische Dünnschichtanordnung.Info
- Publication number
- DE69113187T2 DE69113187T2 DE69113187T DE69113187T DE69113187T2 DE 69113187 T2 DE69113187 T2 DE 69113187T2 DE 69113187 T DE69113187 T DE 69113187T DE 69113187 T DE69113187 T DE 69113187T DE 69113187 T2 DE69113187 T2 DE 69113187T2
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- thin film
- film device
- electronic thin
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5387—Flexible insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/087—Using a reactive gas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/578,711 US5057969A (en) | 1990-09-07 | 1990-09-07 | Thin film electronic device |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69113187D1 DE69113187D1 (de) | 1995-10-26 |
DE69113187T2 true DE69113187T2 (de) | 1996-05-02 |
Family
ID=24313978
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69113187T Expired - Fee Related DE69113187T2 (de) | 1990-09-07 | 1991-07-26 | Verfahren zur Herstellung einer elektronische Dünnschichtanordnung. |
Country Status (4)
Country | Link |
---|---|
US (1) | US5057969A (de) |
EP (1) | EP0473929B1 (de) |
JP (1) | JPH0810716B2 (de) |
DE (1) | DE69113187T2 (de) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2673993B2 (ja) * | 1990-07-02 | 1997-11-05 | 日本無線株式会社 | 表面弾性波装置 |
JPH04170811A (ja) * | 1990-11-05 | 1992-06-18 | Fujitsu Ltd | 弾性表面波デバイス |
JPH04354363A (ja) * | 1991-05-31 | 1992-12-08 | Fujitsu Ltd | 半導体装置ユニット |
US5786985A (en) * | 1991-05-31 | 1998-07-28 | Fujitsu Limited | Semiconductor device and semiconductor device unit |
US5133495A (en) * | 1991-08-12 | 1992-07-28 | International Business Machines Corporation | Method of bonding flexible circuit to circuitized substrate to provide electrical connection therebetween |
DE4129514A1 (de) * | 1991-09-05 | 1993-03-11 | Telefunken Electronic Gmbh | Gedruckte schaltung mit oberflaechenmontierter steckerleiste |
US5600103A (en) * | 1993-04-16 | 1997-02-04 | Kabushiki Kaisha Toshiba | Circuit devices and fabrication method of the same |
US5371326A (en) * | 1993-08-31 | 1994-12-06 | Clearwaters-Dreager; Cindy | Non-toxic fabric conductors and method for making same |
US5367435A (en) * | 1993-11-16 | 1994-11-22 | International Business Machines Corporation | Electronic package structure and method of making same |
JPH07245133A (ja) * | 1994-03-06 | 1995-09-19 | Yokogawa Hewlett Packard Ltd | 電気接続構造 |
US5583378A (en) * | 1994-05-16 | 1996-12-10 | Amkor Electronics, Inc. | Ball grid array integrated circuit package with thermal conductor |
US5802699A (en) * | 1994-06-07 | 1998-09-08 | Tessera, Inc. | Methods of assembling microelectronic assembly with socket for engaging bump leads |
US5632631A (en) * | 1994-06-07 | 1997-05-27 | Tessera, Inc. | Microelectronic contacts with asperities and methods of making same |
US5615824A (en) * | 1994-06-07 | 1997-04-01 | Tessera, Inc. | Soldering with resilient contacts |
US5983492A (en) * | 1996-11-27 | 1999-11-16 | Tessera, Inc. | Low profile socket for microelectronic components and method for making the same |
US5593083A (en) * | 1995-02-14 | 1997-01-14 | International Business Machines Corporation | Castellated nozzle and method of use therof |
US5565119A (en) * | 1995-04-28 | 1996-10-15 | International Business Machines Corporation | Method and apparatus for soldering with a multiple tip and associated optical fiber heating device |
US5872051A (en) * | 1995-08-02 | 1999-02-16 | International Business Machines Corporation | Process for transferring material to semiconductor chip conductive pads using a transfer substrate |
US6051982A (en) * | 1996-08-02 | 2000-04-18 | International Business Machines Corporation | Electronic component test apparatus with rotational probe and conductive spaced apart means |
US5804984A (en) * | 1996-08-02 | 1998-09-08 | International Business Machines Corporation | Electronic component test apparatus with rotational probe |
US5818697A (en) | 1997-03-21 | 1998-10-06 | International Business Machines Corporation | Flexible thin film ball grid array containing solder mask |
US6281437B1 (en) | 1999-11-10 | 2001-08-28 | International Business Machines Corporation | Method of forming an electrical connection between a conductive member having a dual thickness substrate and a conductor and electronic package including said connection |
US6202293B1 (en) | 2000-01-28 | 2001-03-20 | Visteon Global Technologies, Inc. | Work holder assembly |
JP3590319B2 (ja) * | 2000-03-10 | 2004-11-17 | 株式会社ジャパンユニックス | ガス噴射式はんだ付け方法及び装置 |
DE10314172B4 (de) * | 2003-03-28 | 2006-11-30 | Infineon Technologies Ag | Verfahren zum Betreiben einer Anordnung aus einem elektrischen Bauelement auf einem Substrat und Verfahren zum Herstellen der Anordnung |
US7109732B2 (en) * | 2003-07-31 | 2006-09-19 | Endicott Interconnect Technologies, Inc. | Electronic component test apparatus |
KR100971220B1 (ko) * | 2009-08-17 | 2010-07-20 | 주식회사 에프티랩 | Lc공진주파수 변이를 이용한 정전용량방식 터치스크린패널의 검사방법 |
WO2021011286A1 (en) * | 2019-07-12 | 2021-01-21 | Neuralink Corp. | Sandwich assembly scheme for thin film electrode array and integrated circuits |
Family Cites Families (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3617682A (en) * | 1969-06-23 | 1971-11-02 | Gen Electric | Semiconductor chip bonder |
US3871015A (en) * | 1969-08-14 | 1975-03-11 | Ibm | Flip chip module with non-uniform connector joints |
US3754698A (en) * | 1970-10-29 | 1973-08-28 | North American Rockwell | Hot gas fusion apparatus |
US3722072A (en) * | 1971-11-15 | 1973-03-27 | Signetics Corp | Alignment and bonding method for semiconductor components |
US3868764A (en) * | 1973-11-09 | 1975-03-04 | Gen Motors Corp | Multiple magnetic alignment of semiconductor devices for bonding |
US3868765A (en) * | 1973-11-09 | 1975-03-04 | Gen Motors Corp | Laminated template for semiconductor device bonding |
US3937386A (en) * | 1973-11-09 | 1976-02-10 | General Motors Corporation | Flip chip cartridge loader |
US3887996A (en) * | 1974-05-01 | 1975-06-10 | Gen Motors Corp | iconductor loading apparatus for bonding |
US3912153A (en) * | 1974-11-18 | 1975-10-14 | Gen Motors Corp | Method and apparatus for bonding semiconductor pill-type components to a circuit board |
FR2382101A1 (fr) * | 1977-02-28 | 1978-09-22 | Labo Electronique Physique | Dispositif a semi-conducteur, comportant des pattes metalliques isolees |
JPS5440255A (en) * | 1977-09-06 | 1979-03-29 | Matsushita Electric Ind Co Ltd | Method and apparatus for soldering |
JPS5585037A (en) * | 1978-12-22 | 1980-06-26 | Hitachi Ltd | Bonding method |
US4295596A (en) * | 1979-12-19 | 1981-10-20 | Western Electric Company, Inc. | Methods and apparatus for bonding an article to a metallized substrate |
US4426571A (en) * | 1980-06-19 | 1984-01-17 | Sperry Corporation | Portable electric hot air rework tool for soldering and desoldering printed circuit assemblies |
US4373658A (en) * | 1981-02-23 | 1983-02-15 | Western Electric Co., Inc. | High pressure condensation soldering, fusing or brazing |
US4435740A (en) * | 1981-10-30 | 1984-03-06 | International Business Machines Corporation | Electric circuit packaging member |
US4552300A (en) * | 1983-05-09 | 1985-11-12 | Pace, Incorporated | Method and apparatus for soldering and desoldering leadless semiconductor modules for printed wiring boards |
US4545610A (en) * | 1983-11-25 | 1985-10-08 | International Business Machines Corporation | Method for forming elongated solder connections between a semiconductor device and a supporting substrate |
US4564135A (en) * | 1983-12-29 | 1986-01-14 | Rca Corporation | Chip carrier soldering tool |
US4605152A (en) * | 1984-02-24 | 1986-08-12 | Pace, Incorporated | Device for attaching modular electronic components to or removing them from an insulative substrate |
US4587596A (en) * | 1984-04-09 | 1986-05-06 | Amp Incorporated | High density mother/daughter circuit board connector |
US4604644A (en) * | 1985-01-28 | 1986-08-05 | International Business Machines Corporation | Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making |
US4648547A (en) * | 1985-06-26 | 1987-03-10 | At&T Technologies, Inc. | Method and apparatus for achieving reduced component failure during soldering |
FR2584236B1 (fr) * | 1985-06-26 | 1988-04-29 | Bull Sa | Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques |
US4661192A (en) * | 1985-08-22 | 1987-04-28 | Motorola, Inc. | Low cost integrated circuit bonding process |
US4805827A (en) * | 1985-10-23 | 1989-02-21 | Pace Incorporated | Method of soldering with heated fluid and device therefor |
US4646958A (en) * | 1985-10-31 | 1987-03-03 | International Business Machines Corp. | Fluxless soldering process using a silane atmosphere |
US4890194A (en) * | 1985-11-22 | 1989-12-26 | Texas Instruments Incorporated | A chip carrier and mounting structure connected to the chip carrier |
US4681654A (en) * | 1986-05-21 | 1987-07-21 | International Business Machines Corporation | Flexible film semiconductor chip carrier |
US4720396A (en) * | 1986-06-25 | 1988-01-19 | Fairchild Semiconductor Corporation | Solder finishing integrated circuit package leads |
US4789096A (en) * | 1987-05-04 | 1988-12-06 | Unisys Corporation | Method of soldering joints by moving them through a target area on which a stream of hot gas is focused |
US4752025A (en) * | 1987-05-22 | 1988-06-21 | Austin American Technology | Surface mount assembly repair terminal |
FR2629665B1 (fr) * | 1988-03-30 | 1991-01-11 | Bendix Electronics Sa | Boitier pour circuit electronique |
US4914551A (en) * | 1988-07-13 | 1990-04-03 | International Business Machines Corporation | Electronic package with heat spreader member |
US4849856A (en) * | 1988-07-13 | 1989-07-18 | International Business Machines Corp. | Electronic package with improved heat sink |
-
1990
- 1990-09-07 US US07/578,711 patent/US5057969A/en not_active Expired - Lifetime
-
1991
- 1991-06-18 JP JP3171989A patent/JPH0810716B2/ja not_active Expired - Fee Related
- 1991-07-26 EP EP91112556A patent/EP0473929B1/de not_active Expired - Lifetime
- 1991-07-26 DE DE69113187T patent/DE69113187T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5057969A (en) | 1991-10-15 |
DE69113187D1 (de) | 1995-10-26 |
JPH077038A (ja) | 1995-01-10 |
EP0473929A1 (de) | 1992-03-11 |
EP0473929B1 (de) | 1995-09-20 |
JPH0810716B2 (ja) | 1996-01-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |