DE69020103D1 - Vorrichtung zum Laden und Abschneiden einer Halbleiterscheibe. - Google Patents
Vorrichtung zum Laden und Abschneiden einer Halbleiterscheibe.Info
- Publication number
- DE69020103D1 DE69020103D1 DE69020103T DE69020103T DE69020103D1 DE 69020103 D1 DE69020103 D1 DE 69020103D1 DE 69020103 T DE69020103 T DE 69020103T DE 69020103 T DE69020103 T DE 69020103T DE 69020103 D1 DE69020103 D1 DE 69020103D1
- Authority
- DE
- Germany
- Prior art keywords
- loading
- cutting
- semiconductor wafer
- wafer
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/005—Cutting sheet laminae in planes between faces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1285287A JPH0695504B2 (ja) | 1989-10-31 | 1989-10-31 | ウエハ枚葉式内周刃2分割切断装置におけるウエハ供給回収装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69020103D1 true DE69020103D1 (de) | 1995-07-20 |
DE69020103T2 DE69020103T2 (de) | 1995-09-28 |
Family
ID=17689565
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69020103T Expired - Fee Related DE69020103T2 (de) | 1989-10-31 | 1990-10-25 | Vorrichtung zum Laden und Abschneiden einer Halbleiterscheibe. |
Country Status (5)
Country | Link |
---|---|
US (1) | US5142756A (de) |
EP (1) | EP0426007B1 (de) |
JP (1) | JPH0695504B2 (de) |
KR (1) | KR940005244B1 (de) |
DE (1) | DE69020103T2 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2651065B2 (ja) * | 1991-10-30 | 1997-09-10 | 直江津電子工業株式会社 | ウエハ枚葉式横型切断装置におけるウエハ回収・供給機構 |
US6245184B1 (en) * | 1997-11-26 | 2001-06-12 | General Electric Company | Method of fabricating scintillators for computed tomograph system |
US6139591A (en) * | 1998-03-04 | 2000-10-31 | Tokyo Seimitsu Co., Ltd. | Wafer separating and cleaning apparatus and process |
US6010951A (en) * | 1998-04-14 | 2000-01-04 | National Semiconductor Corporation | Dual side fabricated semiconductor wafer |
US6479382B1 (en) | 2001-03-08 | 2002-11-12 | National Semiconductor Corporation | Dual-sided semiconductor chip and method for forming the chip with a conductive path through the chip that connects elements on each side of the chip |
US7115973B1 (en) | 2001-03-08 | 2006-10-03 | National Semiconductor Corporation | Dual-sided semiconductor device with a resistive element that requires little silicon surface area |
US6677235B1 (en) | 2001-12-03 | 2004-01-13 | National Semiconductor Corporation | Silicon die with metal feed through structure |
US7109571B1 (en) | 2001-12-03 | 2006-09-19 | National Semiconductor Corporation | Method of forming a hermetic seal for silicon die with metal feed through structure |
US7005388B1 (en) | 2003-12-04 | 2006-02-28 | National Semiconductor Corporation | Method of forming through-the-wafer metal interconnect structures |
US7422963B2 (en) * | 2004-06-03 | 2008-09-09 | Owens Technology, Inc. | Method for cleaving brittle materials |
CN111952211B (zh) * | 2019-05-15 | 2023-12-22 | 北京北方华创微电子装备有限公司 | 晶片调度方法及装置、半导体处理设备、存储介质 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR348783A (fr) * | 1904-12-12 | 1905-04-26 | Hugo Schrader | Objectif télé-photographique se mettant à la place de la lentille antérieure d'un objectif photographique double |
US4261781A (en) * | 1979-01-31 | 1981-04-14 | International Business Machines Corporation | Process for forming compound semiconductor bodies |
US4420909B2 (en) * | 1981-11-10 | 1997-06-10 | Silicon Technology | Wafering system |
EP0242489B1 (de) * | 1986-04-17 | 1991-07-10 | Maschinenfabrik Meyer & Burger AG | Verfahren zum Trennen eines Stabes in Teilstücke, Trennschleifmaschine zur Durchführung dieses Verfahrens und Verwendung dieser Trennschleifmaschine |
JPH07118473B2 (ja) * | 1987-07-14 | 1995-12-18 | 九州電子金属株式会社 | 半導体ウエ−ハの製造方法 |
US4899719A (en) * | 1987-07-31 | 1990-02-13 | Mitsubishi Kinsoku Kabushiki Kaisha | Apparatus for collecting wafers |
US4852304A (en) * | 1987-10-29 | 1989-08-01 | Tokyo Seimtsu Co., Ltd. | Apparatus and method for slicing a wafer |
JP2565961B2 (ja) * | 1988-01-07 | 1996-12-18 | 株式会社東京精密 | スライシングマシンのウエハ回収装置 |
JPH01293613A (ja) * | 1988-05-23 | 1989-11-27 | Naoetsu Denshi Kogyo Kk | ディスクリート素子用基板及びその製造方法 |
JPH0210727A (ja) * | 1988-06-28 | 1990-01-16 | Naoetsu Denshi Kogyo Kk | 半導体ウエハの分割方法および装置 |
-
1989
- 1989-10-31 JP JP1285287A patent/JPH0695504B2/ja not_active Expired - Fee Related
-
1990
- 1990-10-19 US US07/599,861 patent/US5142756A/en not_active Expired - Lifetime
- 1990-10-25 EP EP90120471A patent/EP0426007B1/de not_active Expired - Lifetime
- 1990-10-25 DE DE69020103T patent/DE69020103T2/de not_active Expired - Fee Related
- 1990-10-31 KR KR1019900017565A patent/KR940005244B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPH0695504B2 (ja) | 1994-11-24 |
KR910008804A (ko) | 1991-05-31 |
EP0426007A2 (de) | 1991-05-08 |
JPH03145726A (ja) | 1991-06-20 |
DE69020103T2 (de) | 1995-09-28 |
EP0426007B1 (de) | 1995-06-14 |
EP0426007A3 (en) | 1991-12-04 |
KR940005244B1 (ko) | 1994-06-15 |
US5142756A (en) | 1992-09-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3884903D1 (de) | Vorrichtung und Verfahren zum Abschneiden einer Halbleiterscheibe. | |
DE68917046D1 (de) | Verfahren und Vorrichtung zum automatischen Abfasen einer Halbleiterplatte. | |
DE69308482T2 (de) | Vorrichtung zum Polieren von Halbleiterscheiben | |
DE59103186D1 (de) | Vorrichtung zum einseitigen ätzen einer halbleiterscheibe. | |
DE68921793D1 (de) | Vorrichtung zum Transportieren eines Wafers zu einem und von einem Polierkopf. | |
DE68924660D1 (de) | Vorrichtung zum Montieren von Chips. | |
DE69106311D1 (de) | Automatische Vorrichtung zum Läppen von Wafern. | |
DE69108689T2 (de) | Vorrichtung zum Reinigen von Siliciumscheiben. | |
DE3855324D1 (de) | Vorrichtung zum Positionieren eines Wafers | |
DE3889473T2 (de) | Vorrichtung zum Handhaben eines Wafers. | |
DE69020103T2 (de) | Vorrichtung zum Laden und Abschneiden einer Halbleiterscheibe. | |
DE68911936T2 (de) | Gerät zum automatischen Halten einer Bearbeitungsmaschine. | |
DE68924622T2 (de) | Vorrichtung zum Steuern eines Halbleiterlasers. | |
DE68918149D1 (de) | Vorrichtung und Verfahren zum Herstellen einer Vorrichtung. | |
DE68922085D1 (de) | Halbleiteranordung und Verfahren zum Herstellen einer Halbleiteranordung. | |
DE69021952D1 (de) | Vorrichtung zur Handhabung von Halbleiterplättchen. | |
DE59001285D1 (de) | Vorrichtung zum befestigen und wechseln von werkzeugen. | |
DE69308937D1 (de) | Verfahren und Vorrichtung zum Abschneiden einer Halbleiterscheibe | |
DE68922777T2 (de) | Vorrichtung zum Laden einer Kassette. | |
DE69029510D1 (de) | Methode und Einrichtung zum Montieren einer Schneidstütze auf einem Halbleiter-Wafer | |
DE69328590T2 (de) | Verfahren und Vorrichtung zum Abschneiden einer Halbleiterscheibe | |
DE68919065T2 (de) | Vorrichtung zum Aufheben eines Halbleiterplättchens. | |
DE69018871D1 (de) | Gerät zum Laden und Entladen einer Kassette. | |
DE68924758D1 (de) | Vorrichtung zum Behandeln von Halbleitern. | |
DE58908099D1 (de) | Verfahren und Vorrichtung zum Betrieb einer Schaltungsanordnung. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |