DE69308937D1 - Verfahren und Vorrichtung zum Abschneiden einer Halbleiterscheibe - Google Patents

Verfahren und Vorrichtung zum Abschneiden einer Halbleiterscheibe

Info

Publication number
DE69308937D1
DE69308937D1 DE69308937T DE69308937T DE69308937D1 DE 69308937 D1 DE69308937 D1 DE 69308937D1 DE 69308937 T DE69308937 T DE 69308937T DE 69308937 T DE69308937 T DE 69308937T DE 69308937 D1 DE69308937 D1 DE 69308937D1
Authority
DE
Germany
Prior art keywords
cutting
semiconductor wafer
wafer
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69308937T
Other languages
English (en)
Other versions
DE69308937T2 (de
Inventor
Shuichi Tsukada
Takeshi Doi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Application granted granted Critical
Publication of DE69308937D1 publication Critical patent/DE69308937D1/de
Publication of DE69308937T2 publication Critical patent/DE69308937T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00—Accessories specially designed for sawing machines or sawing devices
    • B23D59/001—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade
    • B23D59/002—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade for the position of the saw blade
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE69308937T 1992-05-25 1993-05-21 Verfahren und Vorrichtung zum Abschneiden einer Halbleiterscheibe Expired - Fee Related DE69308937T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4132678A JPH05318460A (ja) 1992-05-25 1992-05-25 半導体ウエハのスライシング方法

Publications (2)

Publication Number Publication Date
DE69308937D1 true DE69308937D1 (de) 1997-04-24
DE69308937T2 DE69308937T2 (de) 1997-06-26

Family

ID=15086954

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69308937T Expired - Fee Related DE69308937T2 (de) 1992-05-25 1993-05-21 Verfahren und Vorrichtung zum Abschneiden einer Halbleiterscheibe

Country Status (5)

Country Link
US (1) US5458526A (de)
EP (1) EP0575757B1 (de)
JP (1) JPH05318460A (de)
KR (1) KR0185235B1 (de)
DE (1) DE69308937T2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5628673A (en) * 1993-11-26 1997-05-13 Seiko Seiki Kabushiki Kaisha Dicing machine with non-contact setup function
US5632666A (en) * 1994-10-28 1997-05-27 Memc Electronic Materials, Inc. Method and apparatus for automated quality control in wafer slicing
JP3195504B2 (ja) * 1994-11-24 2001-08-06 トーヨーエイテック株式会社 スライシング装置のブレード変位検出装置
JP2943673B2 (ja) * 1995-10-31 1999-08-30 日本電気株式会社 半導体基板の製造装置及び製造方法
DE19607695A1 (de) * 1996-02-29 1997-09-04 Wacker Siltronic Halbleitermat Verfahren zur Herstellung von Halbleiterscheiben
CN1867435B (zh) * 2003-10-16 2010-05-12 日立金属株式会社 工件切断装置和工件切断方法
CN102229010A (zh) * 2011-04-01 2011-11-02 浙江恒成硬质合金有限公司 切片机
CN117656272A (zh) * 2021-11-01 2024-03-08 青岛高测科技股份有限公司 硅棒切割系统的切割装置及硅棒切割系统

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3327696A (en) * 1964-10-09 1967-06-27 Howard Aiken Ind Saw stabilizing means and method
JPS6147644A (ja) * 1984-08-13 1986-03-08 Hitachi Ltd スライサ−用ブレ−ドのそり制御方法
JPH0818329B2 (ja) * 1986-11-26 1996-02-28 三菱マテリアル株式会社 ウエ−ハの切断不良検出方法
US5025593A (en) * 1988-01-18 1991-06-25 Mazda Motor Corporation Slicing machine and control method thereof
JPH01206006A (ja) * 1988-02-12 1989-08-18 Mazda Motor Corp スライシングマシン切刃変位検出装置
JPH01138565U (de) * 1988-03-11 1989-09-21
JP2598314B2 (ja) * 1988-11-14 1997-04-09 住友シチックス株式会社 硬脆材料の切断装置
JPH03221411A (ja) * 1990-01-29 1991-09-30 Tokyo Seimitsu Co Ltd 柱状体材料の切断方法
JPH03221410A (ja) * 1990-01-29 1991-09-30 Tokyo Seimitsu Co Ltd 柱状体材料の切断方法
JP2505930B2 (ja) * 1990-05-10 1996-06-12 株式会社東京精密 スライシングマシンの切断方法
JPH0439005A (ja) * 1990-06-06 1992-02-10 Tsusho Sangyo Kenkyusha:Kk スライシングマシン及びその制御方法
JPH04122609A (ja) * 1990-09-13 1992-04-23 Tsusho Sangyo Kenkyusha:Kk スライシングマシン及びその制御方法
JPH04122608A (ja) * 1990-09-14 1992-04-23 Shin Etsu Handotai Co Ltd 内周刃スライサーによる単結晶インゴットの切断方法及び装置
JPH0569436A (ja) * 1991-05-17 1993-03-23 Mitsubishi Materials Corp スライシングマシンのブレード位置補正装置

Also Published As

Publication number Publication date
DE69308937T2 (de) 1997-06-26
US5458526A (en) 1995-10-17
EP0575757B1 (de) 1997-03-19
JPH05318460A (ja) 1993-12-03
EP0575757A1 (de) 1993-12-29
KR0185235B1 (ko) 1999-10-01
KR930024111A (ko) 1993-12-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee