DE69607547T2 - Verfahren und Vorrichtung zum Polieren von Halbleiterscheiben - Google Patents

Verfahren und Vorrichtung zum Polieren von Halbleiterscheiben

Info

Publication number
DE69607547T2
DE69607547T2 DE69607547T DE69607547T DE69607547T2 DE 69607547 T2 DE69607547 T2 DE 69607547T2 DE 69607547 T DE69607547 T DE 69607547T DE 69607547 T DE69607547 T DE 69607547T DE 69607547 T2 DE69607547 T2 DE 69607547T2
Authority
DE
Germany
Prior art keywords
semiconductor wafers
polishing semiconductor
polishing
wafers
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69607547T
Other languages
English (en)
Other versions
DE69607547D1 (de
Inventor
Mikio Nishio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69607547D1 publication Critical patent/DE69607547D1/de
Publication of DE69607547T2 publication Critical patent/DE69607547T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
DE69607547T 1995-08-24 1996-07-29 Verfahren und Vorrichtung zum Polieren von Halbleiterscheiben Expired - Fee Related DE69607547T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP21626295 1995-08-24
JP32531995 1995-12-14

Publications (2)

Publication Number Publication Date
DE69607547D1 DE69607547D1 (de) 2000-05-11
DE69607547T2 true DE69607547T2 (de) 2000-08-10

Family

ID=26521330

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69607547T Expired - Fee Related DE69607547T2 (de) 1995-08-24 1996-07-29 Verfahren und Vorrichtung zum Polieren von Halbleiterscheiben

Country Status (5)

Country Link
US (3) US5769697A (de)
EP (1) EP0763401B1 (de)
KR (1) KR100423770B1 (de)
DE (1) DE69607547T2 (de)
TW (2) TW344695B (de)

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US6273796B1 (en) 1999-09-01 2001-08-14 Micron Technology, Inc. Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface
KR20010059876A (ko) * 1999-12-30 2001-07-06 구자홍 광 기록재생기의 제어 방법
US6857942B1 (en) * 2000-01-11 2005-02-22 Taiwan Semiconductor Manufacturing Co., Ltd Apparatus and method for pre-conditioning a conditioning disc
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US6866566B2 (en) * 2001-08-24 2005-03-15 Micron Technology, Inc. Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces
US6652708B2 (en) * 2001-12-28 2003-11-25 Lam Research Corporation Methods and apparatus for conditioning and temperature control of a processing surface
US7727371B2 (en) * 2005-10-07 2010-06-01 Caliper Life Sciences, Inc. Electrode apparatus for use with a microfluidic device
JP5408789B2 (ja) * 2009-03-06 2014-02-05 エルジー・ケム・リミテッド フロートガラス研磨システム
US20100291841A1 (en) * 2009-05-14 2010-11-18 Chien-Min Sung Methods and Systems for Water Jet Assisted CMP Processing
JP2011079076A (ja) * 2009-10-05 2011-04-21 Toshiba Corp 研磨装置及び研磨方法
US8647170B2 (en) 2011-10-06 2014-02-11 Wayne O. Duescher Laser alignment apparatus for rotary spindles
US8740668B2 (en) * 2010-03-12 2014-06-03 Wayne O. Duescher Three-point spindle-supported floating abrasive platen
US8641476B2 (en) 2011-10-06 2014-02-04 Wayne O. Duescher Coplanar alignment apparatus for rotary spindles
US8647172B2 (en) 2010-03-12 2014-02-11 Wayne O. Duescher Wafer pads for fixed-spindle floating-platen lapping
US8602842B2 (en) * 2010-03-12 2013-12-10 Wayne O. Duescher Three-point fixed-spindle floating-platen abrasive system
US8647171B2 (en) * 2010-03-12 2014-02-11 Wayne O. Duescher Fixed-spindle floating-platen workpiece loader apparatus
US8758088B2 (en) 2011-10-06 2014-06-24 Wayne O. Duescher Floating abrading platen configuration
US8500515B2 (en) 2010-03-12 2013-08-06 Wayne O. Duescher Fixed-spindle and floating-platen abrasive system using spherical mounts
US8696405B2 (en) 2010-03-12 2014-04-15 Wayne O. Duescher Pivot-balanced floating platen lapping machine
US8337280B2 (en) 2010-09-14 2012-12-25 Duescher Wayne O High speed platen abrading wire-driven rotary workholder
US8430717B2 (en) 2010-10-12 2013-04-30 Wayne O. Duescher Dynamic action abrasive lapping workholder
US8998677B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Bellows driven floatation-type abrading workholder
US9233452B2 (en) 2012-10-29 2016-01-12 Wayne O. Duescher Vacuum-grooved membrane abrasive polishing wafer workholder
US8845394B2 (en) 2012-10-29 2014-09-30 Wayne O. Duescher Bellows driven air floatation abrading workholder
US9039488B2 (en) 2012-10-29 2015-05-26 Wayne O. Duescher Pin driven flexible chamber abrading workholder
US8998678B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Spider arm driven flexible chamber abrading workholder
US9199354B2 (en) 2012-10-29 2015-12-01 Wayne O. Duescher Flexible diaphragm post-type floating and rigid abrading workholder
US9604339B2 (en) 2012-10-29 2017-03-28 Wayne O. Duescher Vacuum-grooved membrane wafer polishing workholder
US9011207B2 (en) 2012-10-29 2015-04-21 Wayne O. Duescher Flexible diaphragm combination floating and rigid abrading workholder
TWI616278B (zh) * 2015-02-16 2018-03-01 China Grinding Wheel Corp 化學機械研磨修整器
JP6667100B2 (ja) * 2015-12-14 2020-03-18 株式会社ジェイテクト ツルア、これを備えたツルーイング装置、研削装置及びツルーイング方法
US10734765B2 (en) 2016-10-31 2020-08-04 Commscope Technologies Llc Connector with capacitive crosstalk compensation
KR102316563B1 (ko) * 2017-05-22 2021-10-25 엘지디스플레이 주식회사 금속으로 형성된 상부 기판을 포함하는 유기 발광 표시 장치 및 이의 제조 방법
US10926378B2 (en) 2017-07-08 2021-02-23 Wayne O. Duescher Abrasive coated disk islands using magnetic font sheet
US11691241B1 (en) * 2019-08-05 2023-07-04 Keltech Engineering, Inc. Abrasive lapping head with floating and rigid workpiece carrier
CN116394151B (zh) * 2023-03-29 2023-12-26 江苏山水半导体科技有限公司 一种表面具有psg层硅片的化学机械平坦化方法

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EP0911115B1 (de) * 1992-09-24 2003-11-26 Ebara Corporation Poliergerät
TW338125B (en) * 1993-02-26 1998-08-11 Hoechst Celanese Corp Novel matriz resin and its preparation and use in high-temperature stable photoimageable compositions
JPH0794452A (ja) * 1993-09-22 1995-04-07 Toshiba Corp 研磨方法及び研磨装置
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TW367551B (en) * 1993-06-17 1999-08-21 Freescale Semiconductor Inc Polishing pad and a process for polishing
JPH0724708A (ja) * 1993-07-15 1995-01-27 Toshiba Corp 研磨方法及び研磨装置
US5486131A (en) * 1994-01-04 1996-01-23 Speedfam Corporation Device for conditioning polishing pads
JP2914166B2 (ja) * 1994-03-16 1999-06-28 日本電気株式会社 研磨布の表面処理方法および研磨装置
US5547417A (en) * 1994-03-21 1996-08-20 Intel Corporation Method and apparatus for conditioning a semiconductor polishing pad
JPH07297195A (ja) * 1994-04-27 1995-11-10 Speedfam Co Ltd 半導体装置の平坦化方法及び平坦化装置
TW344695B (en) * 1995-08-24 1998-11-11 Matsushita Electric Ind Co Ltd Method for polishing semiconductor substrate

Also Published As

Publication number Publication date
TW334379B (en) 1998-06-21
EP0763401B1 (de) 2000-04-05
EP0763401A1 (de) 1997-03-19
US5997385A (en) 1999-12-07
DE69607547D1 (de) 2000-05-11
US5868610A (en) 1999-02-09
TW344695B (en) 1998-11-11
KR100423770B1 (ko) 2004-06-30
KR970013085A (ko) 1997-03-29
US5769697A (en) 1998-06-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee