DE68919065T2 - Vorrichtung zum Aufheben eines Halbleiterplättchens. - Google Patents

Vorrichtung zum Aufheben eines Halbleiterplättchens.

Info

Publication number
DE68919065T2
DE68919065T2 DE1989619065 DE68919065T DE68919065T2 DE 68919065 T2 DE68919065 T2 DE 68919065T2 DE 1989619065 DE1989619065 DE 1989619065 DE 68919065 T DE68919065 T DE 68919065T DE 68919065 T2 DE68919065 T2 DE 68919065T2
Authority
DE
Germany
Prior art keywords
picking
semiconductor wafer
wafer
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE1989619065
Other languages
English (en)
Other versions
DE68919065D1 (de
Inventor
Masayuki Moroi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/286,916 external-priority patent/US5052886A/en
Priority claimed from US07/287,367 external-priority patent/US4960298A/en
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of DE68919065D1 publication Critical patent/DE68919065D1/de
Publication of DE68919065T2 publication Critical patent/DE68919065T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
DE1989619065 1988-12-20 1989-12-07 Vorrichtung zum Aufheben eines Halbleiterplättchens. Expired - Fee Related DE68919065T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/286,916 US5052886A (en) 1988-12-20 1988-12-20 Semiconductor wafer orientation device
US07/287,367 US4960298A (en) 1988-12-20 1988-12-20 Semiconductor wafer pick-up device

Publications (2)

Publication Number Publication Date
DE68919065D1 DE68919065D1 (de) 1994-12-01
DE68919065T2 true DE68919065T2 (de) 1995-03-02

Family

ID=26964138

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1989619065 Expired - Fee Related DE68919065T2 (de) 1988-12-20 1989-12-07 Vorrichtung zum Aufheben eines Halbleiterplättchens.

Country Status (3)

Country Link
EP (1) EP0375209B1 (de)
JP (1) JP2842447B2 (de)
DE (1) DE68919065T2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3208562B2 (ja) * 1997-07-15 2001-09-17 東京エレクトロン株式会社 位置決め装置及び位置決め方法
JP6987832B2 (ja) * 2019-12-25 2022-01-05 株式会社ジーテクト ディスタックフィーダのバキュームカップ構造体

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60153788U (ja) * 1984-03-21 1985-10-14 シャープ株式会社 位置検知センサ付ロボツトハンド
US4648588A (en) * 1985-06-12 1987-03-10 Rca Corporation Articulated manipulation device
JPH061047B2 (ja) * 1985-07-30 1994-01-05 ヤマハ発動機株式会社 ピストンの枢支部冷却装置
US4808059A (en) * 1986-07-15 1989-02-28 Peak Systems, Inc. Apparatus and method for transferring workpieces
US4828304A (en) * 1986-09-09 1989-05-09 Kabushiki Kaisha Yakult Honsha Vacuum adsorption hand
US4763941A (en) * 1987-06-11 1988-08-16 Unisys Corporation Automatic vacuum gripper

Also Published As

Publication number Publication date
EP0375209B1 (de) 1994-10-26
JPH02269589A (ja) 1990-11-02
JP2842447B2 (ja) 1999-01-06
EP0375209A2 (de) 1990-06-27
EP0375209A3 (de) 1991-09-11
DE68919065D1 (de) 1994-12-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee