DE69029510D1 - Methode und Einrichtung zum Montieren einer Schneidstütze auf einem Halbleiter-Wafer - Google Patents

Methode und Einrichtung zum Montieren einer Schneidstütze auf einem Halbleiter-Wafer

Info

Publication number
DE69029510D1
DE69029510D1 DE69029510T DE69029510T DE69029510D1 DE 69029510 D1 DE69029510 D1 DE 69029510D1 DE 69029510 T DE69029510 T DE 69029510T DE 69029510 T DE69029510 T DE 69029510T DE 69029510 D1 DE69029510 D1 DE 69029510D1
Authority
DE
Germany
Prior art keywords
mounting
semiconductor wafer
cutting support
cutting
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69029510T
Other languages
English (en)
Other versions
DE69029510T2 (de
Inventor
Tsutomu Sato
Yasushi Yoshimura
Hirokasu Kimura
Akio Kasahara
Hideo Higuchi
Zenichi Igarashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Naoetsu Electronics Co Ltd
Original Assignee
Naoetsu Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Naoetsu Electronics Co Ltd filed Critical Naoetsu Electronics Co Ltd
Publication of DE69029510D1 publication Critical patent/DE69029510D1/de
Application granted granted Critical
Publication of DE69029510T2 publication Critical patent/DE69029510T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/005—Cutting sheet laminae in planes between faces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
    • H01L21/6733—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls characterized by a material, a roughness, a coating or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE69029510T 1989-12-11 1990-10-25 Methode und Einrichtung zum Montieren einer Schneidstütze auf einem Halbleiter-Wafer Expired - Fee Related DE69029510T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1322222A JPH03181131A (ja) 1989-12-11 1989-12-11 半導体ウエハの補強材形成方法および装置

Publications (2)

Publication Number Publication Date
DE69029510D1 true DE69029510D1 (de) 1997-02-06
DE69029510T2 DE69029510T2 (de) 1997-05-22

Family

ID=18141308

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69029510T Expired - Fee Related DE69029510T2 (de) 1989-12-11 1990-10-25 Methode und Einrichtung zum Montieren einer Schneidstütze auf einem Halbleiter-Wafer

Country Status (5)

Country Link
US (1) US5154873A (de)
EP (1) EP0432422B1 (de)
JP (1) JPH03181131A (de)
KR (1) KR940007059B1 (de)
DE (1) DE69029510T2 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6074442A (en) * 1994-10-28 2000-06-13 Shin-Etsu Handotai Co., Ltd. Method of separating slice base mounting member from wafer and jig adapted therefor
JP4419321B2 (ja) * 2000-12-26 2010-02-24 株式会社デンソー スパークプラグの製造方法
DE10223937A1 (de) * 2002-05-29 2004-01-15 Wacker Siltronic Ag Zweischichtverklebung von Sägehilfen auf Siliciumeinkristallstäben
JP4038679B2 (ja) * 2003-05-13 2008-01-30 住友電気工業株式会社 半導体レーザーバーの固定用治具
DE10359260A1 (de) * 2003-12-17 2005-07-21 Conti Temic Microelectronic Gmbh Elektronisches Gerät sowie Verfahren zum Bonden eines elektronischen Geräts
CN101524877B (zh) * 2008-11-25 2011-08-31 河南鸿昌电子有限公司 一种切割半导体晶片的固定方法
CN110299316B (zh) * 2019-07-24 2024-03-01 常州时创能源股份有限公司 一种可承载半片的硅片花篮

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4261781A (en) * 1979-01-31 1981-04-14 International Business Machines Corporation Process for forming compound semiconductor bodies
JPS6085538A (ja) * 1983-10-18 1985-05-15 Nec Kansai Ltd 半導体製造方法
JPH07118473B2 (ja) * 1987-07-14 1995-12-18 九州電子金属株式会社 半導体ウエ−ハの製造方法
FR2629008B1 (fr) * 1988-03-23 1991-10-11 Commissariat Energie Atomique Procede et dispositif de clivage d'une plaquette de silicium
JPH01293613A (ja) * 1988-05-23 1989-11-27 Naoetsu Denshi Kogyo Kk ディスクリート素子用基板及びその製造方法

Also Published As

Publication number Publication date
JPH03181131A (ja) 1991-08-07
EP0432422A2 (de) 1991-06-19
EP0432422B1 (de) 1996-12-27
KR940007059B1 (ko) 1994-08-04
EP0432422A3 (en) 1991-12-11
KR910013534A (ko) 1991-08-08
JPH0583175B2 (de) 1993-11-25
DE69029510T2 (de) 1997-05-22
US5154873A (en) 1992-10-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee