DE68921793D1 - Vorrichtung zum Transportieren eines Wafers zu einem und von einem Polierkopf. - Google Patents

Vorrichtung zum Transportieren eines Wafers zu einem und von einem Polierkopf.

Info

Publication number
DE68921793D1
DE68921793D1 DE68921793T DE68921793T DE68921793D1 DE 68921793 D1 DE68921793 D1 DE 68921793D1 DE 68921793 T DE68921793 T DE 68921793T DE 68921793 T DE68921793 T DE 68921793T DE 68921793 D1 DE68921793 D1 DE 68921793D1
Authority
DE
Germany
Prior art keywords
wafer
transporting
polishing head
polishing
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68921793T
Other languages
English (en)
Other versions
DE68921793T2 (de
Inventor
Gerald L Gill
Thomas C Hyde
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Westech Systems Inc
Original Assignee
Westech Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westech Systems Inc filed Critical Westech Systems Inc
Publication of DE68921793D1 publication Critical patent/DE68921793D1/de
Application granted granted Critical
Publication of DE68921793T2 publication Critical patent/DE68921793T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
DE68921793T 1988-06-20 1989-06-13 Vorrichtung zum Transportieren eines Wafers zu einem und von einem Polierkopf. Expired - Fee Related DE68921793T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/208,685 US4944119A (en) 1988-06-20 1988-06-20 Apparatus for transporting wafer to and from polishing head

Publications (2)

Publication Number Publication Date
DE68921793D1 true DE68921793D1 (de) 1995-04-27
DE68921793T2 DE68921793T2 (de) 1995-07-13

Family

ID=22775586

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68921793T Expired - Fee Related DE68921793T2 (de) 1988-06-20 1989-06-13 Vorrichtung zum Transportieren eines Wafers zu einem und von einem Polierkopf.

Country Status (4)

Country Link
US (1) US4944119A (de)
EP (2) EP0347718B1 (de)
JP (1) JP2683279B2 (de)
DE (1) DE68921793T2 (de)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5095661A (en) * 1988-06-20 1992-03-17 Westech Systems, Inc. Apparatus for transporting wafer to and from polishing head
US5018938A (en) * 1990-05-18 1991-05-28 At&T Bell Laboratories Method and apparatus for separating chips
US5193316A (en) * 1991-10-29 1993-03-16 Texas Instruments Incorporated Semiconductor wafer polishing using a hydrostatic medium
US5329732A (en) * 1992-06-15 1994-07-19 Speedfam Corporation Wafer polishing method and apparatus
USRE38878E1 (en) * 1992-09-24 2005-11-15 Ebara Corporation Polishing apparatus
EP0911115B1 (de) * 1992-09-24 2003-11-26 Ebara Corporation Poliergerät
US5733175A (en) 1994-04-25 1998-03-31 Leach; Michael A. Polishing a workpiece using equal velocity at all points overlapping a polisher
US5607341A (en) 1994-08-08 1997-03-04 Leach; Michael A. Method and structure for polishing a wafer during manufacture of integrated circuits
US5681215A (en) * 1995-10-27 1997-10-28 Applied Materials, Inc. Carrier head design for a chemical mechanical polishing apparatus
US6024630A (en) * 1995-06-09 2000-02-15 Applied Materials, Inc. Fluid-pressure regulated wafer polishing head
KR100487590B1 (ko) 1995-08-21 2005-08-04 가부시키가이샤 에바라 세이사꾸쇼 폴리싱장치
US7097544B1 (en) 1995-10-27 2006-08-29 Applied Materials Inc. Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
US5804507A (en) * 1995-10-27 1998-09-08 Applied Materials, Inc. Radially oscillating carousel processing system for chemical mechanical polishing
US5738574A (en) * 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US5762544A (en) * 1995-10-27 1998-06-09 Applied Materials, Inc. Carrier head design for a chemical mechanical polishing apparatus
US5762543A (en) * 1995-11-30 1998-06-09 Speedfam Corporation Polishing apparatus with improved product unloading
JP3580936B2 (ja) 1996-02-26 2004-10-27 株式会社荏原製作所 ポリッシング装置のプッシャー及びポリッシング装置
US6050884A (en) 1996-02-28 2000-04-18 Ebara Corporation Polishing apparatus
US6244946B1 (en) 1997-04-08 2001-06-12 Lam Research Corporation Polishing head with removable subcarrier
US6425812B1 (en) 1997-04-08 2002-07-30 Lam Research Corporation Polishing head for chemical mechanical polishing using linear planarization technology
US5893795A (en) * 1997-07-11 1999-04-13 Applied Materials, Inc. Apparatus for moving a cassette
US5865670A (en) * 1997-09-30 1999-02-02 Memc Electronic Materials, Inc. Wafer demount apparatus
EP0911114B1 (de) 1997-10-20 2007-08-01 Ebara Corporation Poliervorrichtung
US6884721B2 (en) * 1997-12-25 2005-04-26 Shin-Etsu Handotai Co., Ltd. Silicon wafer storage water and silicon wafer storage method
US5954888A (en) * 1998-02-09 1999-09-21 Speedfam Corporation Post-CMP wet-HF cleaning station
US6010392A (en) * 1998-02-17 2000-01-04 International Business Machines Corporation Die thinning apparatus
US5944588A (en) * 1998-06-25 1999-08-31 International Business Machines Corporation Chemical mechanical polisher
US6159083A (en) * 1998-07-15 2000-12-12 Aplex, Inc. Polishing head for a chemical mechanical polishing apparatus
US6074285A (en) * 1998-08-06 2000-06-13 National Science Council Reciprocating friction drive-type ultra precision machine
US6464571B2 (en) * 1998-12-01 2002-10-15 Nutool, Inc. Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein
US7425250B2 (en) * 1998-12-01 2008-09-16 Novellus Systems, Inc. Electrochemical mechanical processing apparatus
US6409585B1 (en) 1998-12-21 2002-06-25 Ebara Corporation Polishing apparatus and holder for holding an article to be polished
US6066030A (en) * 1999-03-04 2000-05-23 International Business Machines Corporation Electroetch and chemical mechanical polishing equipment
US6716086B1 (en) * 1999-06-14 2004-04-06 Applied Materials Inc. Edge contact loadcup
US6666756B1 (en) 2000-03-31 2003-12-23 Lam Research Corporation Wafer carrier head assembly
US6358126B1 (en) 2000-05-23 2002-03-19 Ebara Corporation Polishing apparatus
US6398631B1 (en) 2001-02-02 2002-06-04 Memc Electronic Materials, Inc. Method and apparatus to place wafers into and out of machine
US7101253B2 (en) 2002-08-27 2006-09-05 Applied Materials Inc. Load cup for chemical mechanical polishing
US7044832B2 (en) 2003-11-17 2006-05-16 Applied Materials Load cup for chemical mechanical polishing
US7648622B2 (en) * 2004-02-27 2010-01-19 Novellus Systems, Inc. System and method for electrochemical mechanical polishing
JP4642532B2 (ja) 2005-04-01 2011-03-02 不二越機械工業株式会社 研磨装置
KR102591914B1 (ko) * 2016-11-25 2023-10-23 주식회사 케이씨텍 화학 기계적 연마 시스템의 기판 로딩 장치
CN107671713A (zh) * 2017-11-16 2018-02-09 无锡海特精密模具有限公司 一种研磨装置
CN108527116A (zh) * 2018-04-08 2018-09-14 乐康 一种自动抛光设备
CN108527117A (zh) * 2018-04-08 2018-09-14 乐康 一种新型的自动抛光设备
US11705354B2 (en) 2020-07-10 2023-07-18 Applied Materials, Inc. Substrate handling systems

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3841031A (en) * 1970-10-21 1974-10-15 Monsanto Co Process for polishing thin elements
US4193226A (en) * 1977-09-21 1980-03-18 Kayex Corporation Polishing apparatus
DE3514741A1 (de) * 1985-04-24 1986-10-30 Supfina Maschinenfabrik Hentzen Kg, 5630 Remscheid Vorrichtung zum feinbearbeiten ebener flaechen von scheibenfoermigen werkstuecken mit unbearbeiteter auflageseite und geringer wandstaerke
US4811522A (en) * 1987-03-23 1989-03-14 Gill Jr Gerald L Counterbalanced polishing apparatus

Also Published As

Publication number Publication date
JP2683279B2 (ja) 1997-11-26
EP0347718B1 (de) 1995-03-22
EP0464864A3 (de) 1994-12-21
EP0347718A2 (de) 1989-12-27
EP0347718A3 (de) 1991-01-02
EP0464864A2 (de) 1992-01-08
DE68921793T2 (de) 1995-07-13
JPH0248170A (ja) 1990-02-16
US4944119A (en) 1990-07-31

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee