DE69017744D1 - Gerät und Verfahren zur Bearbeitung einer Halbleitervorrichtung unter Verwendung eines durch Mikrowellen erzeugten Plasmas. - Google Patents

Gerät und Verfahren zur Bearbeitung einer Halbleitervorrichtung unter Verwendung eines durch Mikrowellen erzeugten Plasmas.

Info

Publication number
DE69017744D1
DE69017744D1 DE69017744T DE69017744T DE69017744D1 DE 69017744 D1 DE69017744 D1 DE 69017744D1 DE 69017744 T DE69017744 T DE 69017744T DE 69017744 T DE69017744 T DE 69017744T DE 69017744 D1 DE69017744 D1 DE 69017744D1
Authority
DE
Germany
Prior art keywords
microwave
processing
semiconductor device
generated plasma
plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69017744T
Other languages
English (en)
Other versions
DE69017744T2 (de
Inventor
Masahiko Doki
Kiyoshi Ooiwa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Fujitsu Ltd
Original Assignee
Fuji Electric Co Ltd
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2049810A external-priority patent/JP2538691B2/ja
Application filed by Fuji Electric Co Ltd, Fujitsu Ltd filed Critical Fuji Electric Co Ltd
Application granted granted Critical
Publication of DE69017744D1 publication Critical patent/DE69017744D1/de
Publication of DE69017744T2 publication Critical patent/DE69017744T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32357—Generation remote from the workpiece, e.g. down-stream
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
DE69017744T 1989-04-27 1990-04-26 Gerät und Verfahren zur Bearbeitung einer Halbleitervorrichtung unter Verwendung eines durch Mikrowellen erzeugten Plasmas. Expired - Fee Related DE69017744T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP10855389 1989-04-27
JP17166289 1989-07-03
JP2049810A JP2538691B2 (ja) 1989-04-27 1990-03-01 プラズマ処理装置およびプラズマ処理方法

Publications (2)

Publication Number Publication Date
DE69017744D1 true DE69017744D1 (de) 1995-04-20
DE69017744T2 DE69017744T2 (de) 1995-09-14

Family

ID=27293746

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69017744T Expired - Fee Related DE69017744T2 (de) 1989-04-27 1990-04-26 Gerät und Verfahren zur Bearbeitung einer Halbleitervorrichtung unter Verwendung eines durch Mikrowellen erzeugten Plasmas.

Country Status (3)

Country Link
US (2) US5160397A (de)
EP (1) EP0395415B1 (de)
DE (1) DE69017744T2 (de)

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JP5305900B2 (ja) * 2005-04-11 2013-10-02 ドクトル・ラウレ・プラスマテヒノロギー・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング プラズマコーティングを施す装置および方法
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JP5486383B2 (ja) * 2010-04-13 2014-05-07 富士フイルム株式会社 ドライエッチング方法及び装置
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KR101909571B1 (ko) 2012-08-28 2018-10-19 어드밴스드 에너지 인더스트리즈 인코포레이티드 넓은 다이내믹 레인지 이온 에너지 바이어스 제어； 고속 이온 에너지 스위칭； 이온 에너지 제어와 펄스동작 바이어스 서플라이； 및 가상 전면 패널
JP6060016B2 (ja) * 2013-03-28 2017-01-11 ブラザー工業株式会社 成膜装置、成膜方法及び成膜プログラム
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Also Published As

Publication number Publication date
EP0395415A2 (de) 1990-10-31
EP0395415B1 (de) 1995-03-15
DE69017744T2 (de) 1995-09-14
US5310452A (en) 1994-05-10
US5160397A (en) 1992-11-03
EP0395415A3 (de) 1991-07-24

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