DE68929131T2 - LSI-Halbleiteranordnung - Google Patents
LSI-HalbleiteranordnungInfo
- Publication number
- DE68929131T2 DE68929131T2 DE68929131T DE68929131T DE68929131T2 DE 68929131 T2 DE68929131 T2 DE 68929131T2 DE 68929131 T DE68929131 T DE 68929131T DE 68929131 T DE68929131 T DE 68929131T DE 68929131 T2 DE68929131 T2 DE 68929131T2
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor device
- lsi semiconductor
- lsi
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8248—Combination of bipolar and field-effect technology
- H01L21/8249—Bipolar and MOS technology
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/74—Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
- H01L27/0623—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with bipolar transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
- H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63104861A JP2889246B2 (ja) | 1988-04-27 | 1988-04-27 | 半導体装置 |
JP63170683A JP2573319B2 (ja) | 1988-07-08 | 1988-07-08 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68929131D1 DE68929131D1 (de) | 2000-02-10 |
DE68929131T2 true DE68929131T2 (de) | 2000-06-15 |
Family
ID=26445235
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68929131T Expired - Fee Related DE68929131T2 (de) | 1988-04-27 | 1989-04-27 | LSI-Halbleiteranordnung |
DE68929415T Expired - Fee Related DE68929415T2 (de) | 1988-04-27 | 1989-04-27 | Verfahren zur Herstellung eines BiCMOS-Halbleiterbauteils mit vergrabener Schicht |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68929415T Expired - Fee Related DE68929415T2 (de) | 1988-04-27 | 1989-04-27 | Verfahren zur Herstellung eines BiCMOS-Halbleiterbauteils mit vergrabener Schicht |
Country Status (4)
Country | Link |
---|---|
US (1) | US5093707A (de) |
EP (2) | EP0339637B1 (de) |
KR (1) | KR920005511B1 (de) |
DE (2) | DE68929131T2 (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3282172B2 (ja) * | 1994-07-29 | 2002-05-13 | ソニー株式会社 | BiMOS半導体装置の製造方法 |
JPH03296260A (ja) * | 1990-04-16 | 1991-12-26 | Toshiba Corp | Mos型半導体装置 |
US5001073A (en) * | 1990-07-16 | 1991-03-19 | Sprague Electric Company | Method for making bipolar/CMOS IC with isolated vertical PNP |
EP0809286B1 (de) * | 1996-05-14 | 2003-10-01 | STMicroelectronics S.r.l. | Verfahren zur Herstellung von Halbleiterbauteilen mit verschiedenartigen vergrabenen Dotierungsgebieten |
GB2374456A (en) * | 2000-12-09 | 2002-10-16 | Esm Ltd | High-voltage metal oxide semiconductor device and method of forming the device |
JP2003197908A (ja) * | 2001-09-12 | 2003-07-11 | Seiko Instruments Inc | 半導体素子及びその製造方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56155562A (en) * | 1980-05-06 | 1981-12-01 | Nec Corp | Manufacture of semiconductor device |
JPS5994861A (ja) * | 1982-11-24 | 1984-05-31 | Hitachi Ltd | 半導体集積回路装置及びその製造方法 |
JPS59177960A (ja) * | 1983-03-28 | 1984-10-08 | Hitachi Ltd | 半導体装置およびその製造方法 |
JPS6080267A (ja) * | 1983-10-07 | 1985-05-08 | Toshiba Corp | 半導体集積回路装置の製造方法 |
JPS62500340A (ja) * | 1984-09-28 | 1987-02-05 | モトロ−ラ・インコ−ポレ−テツド | 電荷蓄積空乏領域放電保護装置及び方法 |
JPH073811B2 (ja) * | 1985-04-12 | 1995-01-18 | 株式会社日立製作所 | 半導体記憶装置 |
JPH0834244B2 (ja) * | 1985-06-19 | 1996-03-29 | 三洋電機株式会社 | 半導体集積回路装置 |
JPH0671067B2 (ja) * | 1985-11-20 | 1994-09-07 | 株式会社日立製作所 | 半導体装置 |
JPH0628296B2 (ja) * | 1985-10-17 | 1994-04-13 | 日本電気株式会社 | 半導体装置の製造方法 |
JPH0770606B2 (ja) * | 1985-11-29 | 1995-07-31 | 株式会社日立製作所 | 半導体装置 |
JPS62291165A (ja) * | 1986-06-11 | 1987-12-17 | Nec Corp | 半導体装置 |
US4929570A (en) * | 1986-10-06 | 1990-05-29 | National Semiconductor Corporation | Selective epitaxy BiCMOS process |
JPS63304657A (ja) * | 1987-06-04 | 1988-12-12 | Fujitsu Ltd | 半導体装置の製造方法 |
JPS6410656A (en) * | 1987-07-03 | 1989-01-13 | Hitachi Ltd | Complementary type semiconductor device |
-
1989
- 1989-04-26 US US07/343,302 patent/US5093707A/en not_active Expired - Lifetime
- 1989-04-27 KR KR1019890005546A patent/KR920005511B1/ko not_active IP Right Cessation
- 1989-04-27 EP EP89107639A patent/EP0339637B1/de not_active Expired - Lifetime
- 1989-04-27 DE DE68929131T patent/DE68929131T2/de not_active Expired - Fee Related
- 1989-04-27 EP EP96105283A patent/EP0723295B1/de not_active Expired - Lifetime
- 1989-04-27 DE DE68929415T patent/DE68929415T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0339637B1 (de) | 2000-01-05 |
KR900017202A (ko) | 1990-11-15 |
DE68929415D1 (de) | 2002-08-14 |
DE68929131D1 (de) | 2000-02-10 |
DE68929415T2 (de) | 2003-01-16 |
US5093707A (en) | 1992-03-03 |
KR920005511B1 (ko) | 1992-07-06 |
EP0339637A3 (de) | 1992-09-23 |
EP0723295A1 (de) | 1996-07-24 |
EP0339637A2 (de) | 1989-11-02 |
EP0723295B1 (de) | 2002-07-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |