DE68922231T2 - Bipolartransistor und Verfahren für seine Herstellung. - Google Patents

Bipolartransistor und Verfahren für seine Herstellung.

Info

Publication number
DE68922231T2
DE68922231T2 DE68922231T DE68922231T DE68922231T2 DE 68922231 T2 DE68922231 T2 DE 68922231T2 DE 68922231 T DE68922231 T DE 68922231T DE 68922231 T DE68922231 T DE 68922231T DE 68922231 T2 DE68922231 T2 DE 68922231T2
Authority
DE
Germany
Prior art keywords
manufacture
bipolar transistor
bipolar
transistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE68922231T
Other languages
English (en)
Other versions
DE68922231D1 (de
Inventor
Takayuki C O Patents Divi Gomi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of DE68922231D1 publication Critical patent/DE68922231D1/de
Application granted granted Critical
Publication of DE68922231T2 publication Critical patent/DE68922231T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70—Bipolar devices
    • H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66234—Bipolar junction transistors [BJT]
    • H01L29/66272—Silicon vertical transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/0821—Collector regions of bipolar transistors
    • H01L29/0826—Pedestal collectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/36—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the concentration or distribution of impurities in the bulk material
DE68922231T 1988-02-16 1989-02-15 Bipolartransistor und Verfahren für seine Herstellung. Expired - Lifetime DE68922231T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63033686A JP2623635B2 (ja) 1988-02-16 1988-02-16 バイポーラトランジスタ及びその製造方法

Publications (2)

Publication Number Publication Date
DE68922231D1 DE68922231D1 (de) 1995-05-24
DE68922231T2 true DE68922231T2 (de) 1995-08-31

Family

ID=12393312

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68922231T Expired - Lifetime DE68922231T2 (de) 1988-02-16 1989-02-15 Bipolartransistor und Verfahren für seine Herstellung.

Country Status (5)

Country Link
US (1) US4994881A (de)
EP (1) EP0329401B1 (de)
JP (1) JP2623635B2 (de)
KR (1) KR0134887B1 (de)
DE (1) DE68922231T2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2748420B2 (ja) * 1988-08-12 1998-05-06 ソニー株式会社 バイポーラトランジスタ及びその製造方法
IT1230895B (it) * 1989-06-22 1991-11-08 Sgs Thomson Microelectronics Transistore di potenza integrabile con ottimizzazione dei fenomeni di rottura secondaria diretta.
JPH03138946A (ja) * 1989-10-24 1991-06-13 Sony Corp 半導体装置
DE69032597T2 (de) * 1990-02-20 1999-03-25 Toshiba Kawasaki Kk Bipolartransistor mit Heteroübergang
KR920007211A (ko) * 1990-09-06 1992-04-28 김광호 고속 바이폴라 트랜지스터 및 그의 제조방법
US5204277A (en) * 1992-02-03 1993-04-20 Motorola, Inc. Method of forming bipolar transistor having substrate to polysilicon extrinsic base contact
US5294558A (en) * 1993-06-01 1994-03-15 International Business Machines Corporation Method of making double-self-aligned bipolar transistor structure
JPH0831841A (ja) * 1994-07-12 1996-02-02 Sony Corp 半導体装置及びその製造方法
US6808999B2 (en) * 1994-09-26 2004-10-26 Sony Corporation Method of making a bipolar transistor having a reduced base transit time
US5719082A (en) * 1995-08-25 1998-02-17 Micron Technology, Inc. Angled implant to improve high current operation of bipolar transistors
US7199447B2 (en) * 1995-08-25 2007-04-03 Micron Technology, Inc. Angled implant to improve high current operation of bipolar transistors
JP2000252294A (ja) 1999-03-01 2000-09-14 Nec Corp 半導体装置及びその製造方法
US6838350B2 (en) * 2003-04-25 2005-01-04 Micrel, Inc. Triply implanted complementary bipolar transistors
CN112151532B (zh) * 2020-09-07 2022-10-25 杰华特微电子股份有限公司 用于静电防护的半导体器件

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4495512A (en) * 1982-06-07 1985-01-22 International Business Machines Corporation Self-aligned bipolar transistor with inverted polycide base contact
JPS60251664A (ja) * 1984-05-28 1985-12-12 Sony Corp 半導体装置の製造方法
US4706378A (en) * 1985-01-30 1987-11-17 Texas Instruments Incorporated Method of making vertical bipolar transistor having base above buried nitride dielectric formed by deep implantation
JPS6218763A (ja) * 1985-07-18 1987-01-27 Sanyo Electric Co Ltd バイポ−ラトランジスタ
US4755476A (en) * 1985-12-17 1988-07-05 Siemens Aktiengesellschaft Process for the production of self-adjusted bipolar transistor structures having a reduced extrinsic base resistance
IT1188309B (it) * 1986-01-24 1988-01-07 Sgs Microelettrica Spa Procedimento per la fabbricazione di dispositivi elettronici integrati,in particolare transistori mos a canale p ad alta tensione
CA1298921C (en) * 1986-07-02 1992-04-14 Madhukar B. Vora Bipolar transistor with polysilicon stringer base contact

Also Published As

Publication number Publication date
JP2623635B2 (ja) 1997-06-25
KR0134887B1 (ko) 1998-04-18
EP0329401A2 (de) 1989-08-23
KR890013746A (ko) 1989-09-25
JPH01208864A (ja) 1989-08-22
US4994881A (en) 1991-02-19
DE68922231D1 (de) 1995-05-24
EP0329401B1 (de) 1995-04-19
EP0329401A3 (en) 1990-02-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition