DE60334958D1 - Ultraschallsonde und Herstellungsverfahren hiervon - Google Patents

Ultraschallsonde und Herstellungsverfahren hiervon

Info

Publication number
DE60334958D1
DE60334958D1 DE60334958T DE60334958T DE60334958D1 DE 60334958 D1 DE60334958 D1 DE 60334958D1 DE 60334958 T DE60334958 T DE 60334958T DE 60334958 T DE60334958 T DE 60334958T DE 60334958 D1 DE60334958 D1 DE 60334958D1
Authority
DE
Germany
Prior art keywords
manufacturing
ultrasonic probe
probe
ultrasonic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60334958T
Other languages
English (en)
Inventor
Shohei Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Aloka Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2003169658A external-priority patent/JP3840204B2/ja
Priority claimed from JP2003169659A external-priority patent/JP3840205B2/ja
Application filed by Aloka Co Ltd filed Critical Aloka Co Ltd
Application granted granted Critical
Publication of DE60334958D1 publication Critical patent/DE60334958D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • B06B1/064—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface with multiple active layers
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • A61B8/4494—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer characterised by the arrangement of the transducer elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/092—Forming composite materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/852—Composite materials, e.g. having 1-3 or 2-2 type connectivity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/4908—Acoustic transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y10T29/49798—Dividing sequentially from leading end, e.g., by cutting or breaking

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Composite Materials (AREA)
  • Chemical & Material Sciences (AREA)
  • Molecular Biology (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Medical Informatics (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Mechanical Engineering (AREA)
  • Biophysics (AREA)
  • Physics & Mathematics (AREA)
  • Gynecology & Obstetrics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
DE60334958T 2002-07-19 2003-07-15 Ultraschallsonde und Herstellungsverfahren hiervon Expired - Lifetime DE60334958D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002210891 2002-07-19
JP2003169658A JP3840204B2 (ja) 2002-07-19 2003-06-13 超音波探触子及びその製造方法
JP2003169659A JP3840205B2 (ja) 2002-07-19 2003-06-13 超音波探触子及びその製造方法

Publications (1)

Publication Number Publication Date
DE60334958D1 true DE60334958D1 (de) 2010-12-30

Family

ID=29783100

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60334958T Expired - Lifetime DE60334958D1 (de) 2002-07-19 2003-07-15 Ultraschallsonde und Herstellungsverfahren hiervon

Country Status (4)

Country Link
US (2) US7148607B2 (de)
EP (2) EP1616525A3 (de)
CN (1) CN100403990C (de)
DE (1) DE60334958D1 (de)

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US20070222339A1 (en) * 2004-04-20 2007-09-27 Mark Lukacs Arrayed ultrasonic transducer
WO2005104210A2 (en) * 2004-04-20 2005-11-03 Visualsonics Inc. Arrayed ultrasonic transducer
JP4847039B2 (ja) * 2004-05-28 2011-12-28 日本碍子株式会社 圧電／電歪構造体及び圧電／電歪構造体の製造方法
JP4991722B2 (ja) * 2005-08-08 2012-08-01 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 超音波トランスデューサアレイ
US20070046149A1 (en) * 2005-08-23 2007-03-01 Zipparo Michael J Ultrasound probe transducer assembly and production method
CA2627927A1 (en) * 2005-11-02 2007-06-14 Visualsonics Inc. Arrayed ultrasonic transducer
JP5630958B2 (ja) 2005-11-02 2014-11-26 ビジュアルソニックス インコーポレイテッド 高周波数アレイ超音波システム
JP4801989B2 (ja) * 2005-12-22 2011-10-26 株式会社東芝 超音波プローブ
US7622848B2 (en) * 2006-01-06 2009-11-24 General Electric Company Transducer assembly with z-axis interconnect
US20080238259A1 (en) * 2007-04-02 2008-10-02 Fujifilm Corporation Ultrasonic probe and production method thereof
JP5095593B2 (ja) * 2008-03-21 2012-12-12 富士フイルム株式会社 超音波探触子及びその製造方法
JP2009239208A (ja) * 2008-03-28 2009-10-15 Fujifilm Corp 圧電アクチュエータの製造方法及び液体吐出ヘッド
US8040116B2 (en) * 2008-06-17 2011-10-18 Texas Instruments Incorporated Automatically configurable dual regulator type circuits and methods
US9173047B2 (en) 2008-09-18 2015-10-27 Fujifilm Sonosite, Inc. Methods for manufacturing ultrasound transducers and other components
US20110144494A1 (en) 2008-09-18 2011-06-16 James Mehi Methods for acquisition and display in ultrasound imaging
US9184369B2 (en) 2008-09-18 2015-11-10 Fujifilm Sonosite, Inc. Methods for manufacturing ultrasound transducers and other components
WO2010073920A1 (ja) * 2008-12-25 2010-07-01 コニカミノルタエムジー株式会社 超音波探触子及び超音波探触子の作製方法
JP5286369B2 (ja) * 2009-01-16 2013-09-11 株式会社日立メディコ 超音波探触子の製造方法および超音波探触子
US8978216B2 (en) * 2009-03-18 2015-03-17 General Electric Company Method for forming an acoustical stack for an ultrasound probe
JP2011250119A (ja) * 2010-05-26 2011-12-08 Toshiba Corp 超音波プローブ
US8299687B2 (en) 2010-07-21 2012-10-30 Transducerworks, Llc Ultrasonic array transducer, associated circuit and method of making the same
JP2013543670A (ja) * 2010-09-20 2013-12-05 ビー−ケー メディカル エーピーエス イメージングトランスデューサアレイ
FR2965249B1 (fr) * 2010-09-28 2013-03-15 Eurocopter France Systeme de degivrage ameliore pour voilure fixe ou tournante d'un aeronef
DE102012201715A1 (de) * 2011-03-03 2012-09-06 Intelligendt Systems & Services Gmbh Prüfkopf zum Prüfen eines Werkstückes mit einer eine Mehrzahl von Wandlerelementen enthaltenden Ultraschallwandleranordnung und Verfahren zum Herstellen eines solchen Prüfkopfes
CN102398030B (zh) * 2011-12-08 2013-10-16 大连理工大学 一种弹性波阻抗匹配与阻尼吸收梯度材料的制备方法
KR101540714B1 (ko) * 2013-04-30 2015-07-31 알피니언메디칼시스템 주식회사 트랜스듀서 제작방법
KR20140145427A (ko) * 2013-06-13 2014-12-23 삼성전기주식회사 압전 소자용 내부 전극, 이를 포함하는 압전 소자 및 압전 소자 제조 방법
JP6102622B2 (ja) * 2013-08-07 2017-03-29 コニカミノルタ株式会社 超音波探触子
US9871444B2 (en) 2014-12-24 2018-01-16 Texas Instruments Incorporated Integrated circuit with configurable control and power switches
US9862592B2 (en) 2015-03-13 2018-01-09 Taiwan Semiconductor Manufacturing Co., Ltd. MEMS transducer and method for manufacturing the same
JP6617504B2 (ja) * 2015-10-02 2019-12-11 セイコーエプソン株式会社 圧電素子、プローブ及び超音波測定装置
EP3370621B1 (de) * 2015-11-02 2019-01-09 Koninklijke Philips N.V. Ultraschallwandlerarray, sonde und system
US10596598B2 (en) * 2016-12-20 2020-03-24 General Electric Company Ultrasound transducer and method for wafer level front face attachment
CN107905269B (zh) * 2017-11-24 2019-10-25 武汉中岩科技股份有限公司 一种用于超声波成孔成槽质量检测的双电缆绞车装置
US10697939B2 (en) * 2018-03-02 2020-06-30 B-K Medical Aps Synthetic fine-pitch ultrasound imaging
CN108417707B (zh) * 2018-03-16 2021-06-11 上海爱声生物医疗科技有限公司 一种压电复合材料的制备方法及压电复合材料
US11806191B2 (en) * 2018-05-21 2023-11-07 General Electric Company Phased array transducers and wafer scale manufacturing for making the same
US11850416B2 (en) * 2018-06-22 2023-12-26 The Regents Of The University Of Michigan Method of manufacturing a probe array
JP2022025321A (ja) * 2020-07-29 2022-02-10 キヤノンメディカルシステムズ株式会社 超音波探触子及びその製造方法

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Also Published As

Publication number Publication date
US20060119222A1 (en) 2006-06-08
US7316059B2 (en) 2008-01-08
EP1382301A1 (de) 2004-01-21
EP1382301B1 (de) 2010-11-17
EP1616525A3 (de) 2006-02-01
US20040011134A1 (en) 2004-01-22
CN1480100A (zh) 2004-03-10
US7148607B2 (en) 2006-12-12
CN100403990C (zh) 2008-07-23
EP1616525A2 (de) 2006-01-18

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