DE60334428D1 - Halter, lithographisches Gerät und Verfahren zur Herstellung einer Vorrichtung - Google Patents

Halter, lithographisches Gerät und Verfahren zur Herstellung einer Vorrichtung

Info

Publication number
DE60334428D1
DE60334428D1 DE60334428T DE60334428T DE60334428D1 DE 60334428 D1 DE60334428 D1 DE 60334428D1 DE 60334428 T DE60334428 T DE 60334428T DE 60334428 T DE60334428 T DE 60334428T DE 60334428 D1 DE60334428 D1 DE 60334428D1
Authority
DE
Germany
Prior art keywords
holder
making
lithographic apparatus
lithographic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60334428T
Other languages
English (en)
Inventor
Martinus Hendricus Hendricus Hoeks
Joost Jeroen Ottens
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Netherlands BV
Original Assignee
ASML Netherlands BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASML Netherlands BV filed Critical ASML Netherlands BV
Application granted granted Critical
Publication of DE60334428D1 publication Critical patent/DE60334428D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE60334428T 2002-08-23 2003-08-20 Halter, lithographisches Gerät und Verfahren zur Herstellung einer Vorrichtung Expired - Lifetime DE60334428D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP02255915 2002-08-23

Publications (1)

Publication Number Publication Date
DE60334428D1 true DE60334428D1 (de) 2010-11-18

Family

ID=32241343

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60334428T Expired - Lifetime DE60334428D1 (de) 2002-08-23 2003-08-20 Halter, lithographisches Gerät und Verfahren zur Herstellung einer Vorrichtung

Country Status (7)

Country Link
US (1) US7092231B2 (de)
JP (1) JP2004104114A (de)
KR (1) KR100532522B1 (de)
CN (1) CN100492172C (de)
DE (1) DE60334428D1 (de)
SG (1) SG108323A1 (de)
TW (1) TWI240153B (de)

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US10503084B2 (en) 2002-11-12 2019-12-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9482966B2 (en) 2002-11-12 2016-11-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7213963B2 (en) * 2003-06-09 2007-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1498777A1 (de) * 2003-07-15 2005-01-19 ASML Netherlands B.V. Substrathalter und lithographischer Projektionsapparat
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JP2005175016A (ja) * 2003-12-08 2005-06-30 Canon Inc 基板保持装置およびそれを用いた露光装置ならびにデバイス製造方法
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US7041989B1 (en) * 2004-10-22 2006-05-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
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US20070139855A1 (en) 2005-12-21 2007-06-21 Asml Netherlands B.V. Lithographic apparatus and method of manufacturing an electrostatic clamp for a lithographic apparatus
US7626681B2 (en) * 2005-12-28 2009-12-01 Asml Netherlands B.V. Lithographic apparatus and method
US7649611B2 (en) 2005-12-30 2010-01-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7352438B2 (en) * 2006-02-14 2008-04-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1840657A1 (de) * 2006-03-28 2007-10-03 Carl Zeiss SMT AG Halterungsstruktur zur vorübergehenden Halterung eines Substrats
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KR100755395B1 (ko) * 2006-08-31 2007-09-04 삼성전자주식회사 반사 마스크, 반사 마스크 고정 장치 및 방법
WO2008083002A1 (en) * 2006-12-26 2008-07-10 Fujifilm Dimatix, Inc. Printing system with conductive element
JP4418032B2 (ja) * 2007-09-11 2010-02-17 キヤノンアネルバ株式会社 静電チャック
EP2199049A4 (de) 2007-09-13 2014-08-27 Asahi Glass Co Ltd TiO2-HALTIGES QUARZGLASSUBSTRAT
US7940511B2 (en) * 2007-09-21 2011-05-10 Asml Netherlands B.V. Electrostatic clamp, lithographic apparatus and method of manufacturing an electrostatic clamp
JP5017232B2 (ja) * 2007-10-31 2012-09-05 エーエスエムエル ネザーランズ ビー．ブイ． クリーニング装置および液浸リソグラフィ装置
CN102187447B (zh) * 2008-10-20 2013-03-27 创意科技股份有限公司 静电吸盘的检查方法以及静电吸盘装置
US8139340B2 (en) * 2009-01-20 2012-03-20 Plasma-Therm Llc Conductive seal ring electrostatic chuck
WO2012005294A1 (ja) * 2010-07-09 2012-01-12 株式会社クリエイティブ テクノロジー 静電チャック装置及びその製造方法
WO2012026421A1 (ja) * 2010-08-24 2012-03-01 株式会社クリエイティブ テクノロジー 静電チャック装置及びその製造方法
JP5960154B2 (ja) 2010-12-08 2016-08-02 エーエスエムエル ホールディング エヌ．ブイ． 静電クランプ、リソグラフィ装置、および静電クランプの製造方法
NL2007768A (en) 2010-12-14 2012-06-18 Asml Netherlands Bv Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder.
EP2490073B1 (de) * 2011-02-18 2015-09-23 ASML Netherlands BV Substrathalter, lithografische Vorrichtung und Verfahren zur Herstellung eines Substrathalters
KR101872886B1 (ko) * 2011-03-17 2018-06-29 에이에스엠엘 네델란즈 비.브이. 정전기 클램프, 리소그래피 장치, 및 디바이스 제조 방법
NL2008630A (en) 2011-04-27 2012-10-30 Asml Netherlands Bv Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder.
EP2555234B1 (de) * 2011-08-02 2020-08-19 ASML Holding N.V. Elektrostatische Klemme, lithografische Vorrichtung und Verfahren zur Herstellung einer elektrostatischen Klemme
NL2009487A (en) * 2011-10-14 2013-04-16 Asml Netherlands Bv Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder.
CN104272190A (zh) 2012-02-03 2015-01-07 Asml荷兰有限公司 衬底保持器和光刻装置
JP6192711B2 (ja) 2012-04-23 2017-09-06 エーエスエムエル ネザーランズ ビー．ブイ． 静電クランプ、リソグラフィ装置および方法
EP2875404B1 (de) 2012-07-17 2019-08-07 ASML Netherlands B.V. Elektrostatische klemme, lithografievorrichtung und -verfahren
NL2011592A (en) 2012-10-31 2014-05-06 Asml Netherlands Bv Compensation for patterning device deformation.
US10937684B2 (en) * 2012-11-28 2021-03-02 Kyocera Corporation Placement member and method of manufacturing the same
WO2015154917A1 (en) * 2014-04-09 2015-10-15 Asml Netherlands B.V. Apparatus for cleaning an object
WO2016159239A1 (ja) 2015-04-02 2016-10-06 株式会社アルバック 吸着装置及び真空処理装置
KR102630782B1 (ko) * 2016-08-19 2024-01-31 삼성전자주식회사 기판 처리 장치
WO2020017314A1 (ja) * 2018-07-19 2020-01-23 ボンドテック株式会社 基板接合装置
US11373890B2 (en) * 2018-12-17 2022-06-28 Applied Materials, Inc. Wireless in-situ real-time measurement of electrostatic chucking force in semiconductor wafer processing
DE102019101657A1 (de) 2019-01-23 2020-07-23 Berliner Glas Kgaa Herbert Kubatz Gmbh & Co Haltevorrichtung zur elektrostatischen Halterung eines Bauteils mit einem durch Diffusionsbonden gefügten Grundkörper und Verfahren zu deren Herstellung
DE102020104907A1 (de) 2020-02-25 2021-08-26 Berliner Glas GmbH Verfahren zur Herstellung eines Bauelements durch atomares Diffusionsbonden
US11699611B2 (en) * 2021-02-23 2023-07-11 Applied Materials, Inc. Forming mesas on an electrostatic chuck
EP4206822A1 (de) * 2021-12-28 2023-07-05 ASML Netherlands B.V. Objekthalter, lithographische vorrichtung mit einem solchen objekthalter und verfahren für einen objekthalter
WO2024056552A1 (en) * 2022-09-13 2024-03-21 Asml Netherlands B.V. A patterning device voltage biasing system for use in euv lithography
EP4390541A1 (de) * 2022-12-23 2024-06-26 ASML Netherlands B.V. Objekttisch

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Also Published As

Publication number Publication date
KR20040030259A (ko) 2004-04-09
US20040114124A1 (en) 2004-06-17
TW200413864A (en) 2004-08-01
KR100532522B1 (ko) 2005-12-01
SG108323A1 (en) 2005-01-28
US7092231B2 (en) 2006-08-15
CN1487360A (zh) 2004-04-07
TWI240153B (en) 2005-09-21
JP2004104114A (ja) 2004-04-02
CN100492172C (zh) 2009-05-27

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