DE60328596D1 - Verbesserte elektrode für dünnschichtkondensatorvorrichtungen - Google Patents
Verbesserte elektrode für dünnschichtkondensatorvorrichtungenInfo
- Publication number
- DE60328596D1 DE60328596D1 DE60328596T DE60328596T DE60328596D1 DE 60328596 D1 DE60328596 D1 DE 60328596D1 DE 60328596 T DE60328596 T DE 60328596T DE 60328596 T DE60328596 T DE 60328596T DE 60328596 D1 DE60328596 D1 DE 60328596D1
- Authority
- DE
- Germany
- Prior art keywords
- thin
- improved electrode
- film condenser
- condenser devices
- devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6938—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides
- H10P14/6939—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal
- H10P14/69393—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal the material containing tantalum, e.g. Ta2O5
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/10—Metal-oxide dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
- H10D1/692—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6302—Non-deposition formation processes
- H10P14/6304—Formation by oxidation, e.g. oxidation of the substrate
- H10P14/6314—Formation by oxidation, e.g. oxidation of the substrate of a metallic layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6302—Non-deposition formation processes
- H10P14/6322—Formation by thermal treatments
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Semiconductor Memories (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/147,093 US7335552B2 (en) | 2002-05-15 | 2002-05-15 | Electrode for thin film capacitor devices |
| PCT/US2003/014934 WO2003098646A1 (en) | 2002-05-15 | 2003-05-12 | Improved electrode for thin film capacitor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE60328596D1 true DE60328596D1 (de) | 2009-09-10 |
Family
ID=29418951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE60328596T Expired - Lifetime DE60328596D1 (de) | 2002-05-15 | 2003-05-12 | Verbesserte elektrode für dünnschichtkondensatorvorrichtungen |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US7335552B2 (https=) |
| EP (1) | EP1504460B1 (https=) |
| JP (1) | JP5059290B2 (https=) |
| KR (1) | KR100699397B1 (https=) |
| DE (1) | DE60328596D1 (https=) |
| WO (1) | WO2003098646A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100634509B1 (ko) * | 2004-08-20 | 2006-10-13 | 삼성전자주식회사 | 3차원 반도체 캐패시터 및 그 제조 방법 |
| US20060065916A1 (en) | 2004-09-29 | 2006-03-30 | Xubai Zhang | Varactors and methods of manufacture and use |
| CN101124638A (zh) * | 2004-12-06 | 2008-02-13 | 哈佛大学 | 基于纳米尺度线的数据存储 |
| DE102005048774B4 (de) * | 2005-10-07 | 2009-04-02 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Substrat, das zumindest bereichsweise an einer Oberfläche mit einer Beschichtung eines Metalls versehen ist, sowie dessen Verwendung |
| US7560392B2 (en) | 2006-05-10 | 2009-07-14 | Micron Technology, Inc. | Electrical components for microelectronic devices and methods of forming the same |
| KR100849187B1 (ko) * | 2006-06-30 | 2008-07-30 | 주식회사 하이닉스반도체 | 반도체 소자의 캐패시터 제조 방법 |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US19874A (en) * | 1858-04-06 | Improvement in cotton-seed planters | ||
| DE2513858C3 (de) | 1975-03-27 | 1981-08-06 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Herstellung eines Tantal-Dünnschichtkondensators |
| JPS5874079A (ja) * | 1981-10-28 | 1983-05-04 | Japan Electronic Ind Dev Assoc<Jeida> | 薄膜トランジスタ |
| KR930012120B1 (ko) * | 1991-07-03 | 1993-12-24 | 삼성전자 주식회사 | 반도체장치 및 그의 제조방법 |
| US5142438A (en) * | 1991-11-15 | 1992-08-25 | Micron Technology, Inc. | Dram cell having a stacked capacitor with a tantalum lower plate, a tantalum oxide dielectric layer, and a silicide buried contact |
| US5390072A (en) * | 1992-09-17 | 1995-02-14 | Research Foundation Of State University Of New York | Thin film capacitors |
| US5723171A (en) * | 1992-10-23 | 1998-03-03 | Symetrix Corporation | Integrated circuit electrode structure and process for fabricating same |
| US5479317A (en) * | 1994-10-05 | 1995-12-26 | Bell Communications Research, Inc. | Ferroelectric capacitor heterostructure and method of making same |
| US6204111B1 (en) * | 1994-12-28 | 2001-03-20 | Matsushita Electronics Corporation | Fabrication method of capacitor for integrated circuit |
| JP3098923B2 (ja) * | 1994-12-28 | 2000-10-16 | 松下電子工業株式会社 | 半導体装置およびその製造方法 |
| JP3480624B2 (ja) * | 1995-06-09 | 2003-12-22 | シャープ株式会社 | 強誘電体薄膜被覆基板、その製造方法、及びキャパシタ構造素子 |
| GB9512529D0 (en) * | 1995-06-20 | 1995-08-23 | Bnfl Fluorchem Ltd | Cell treatment |
| JP3929513B2 (ja) * | 1995-07-07 | 2007-06-13 | ローム株式会社 | 誘電体キャパシタおよびその製造方法 |
| KR100234000B1 (ko) * | 1996-09-04 | 1999-12-15 | 박호군 | 피제트티 박막 및 그 제조방법 |
| KR19980077149A (ko) * | 1997-04-17 | 1998-11-16 | 윤종용 | 다층전극 구조를 갖는 강유전체 메모리의 커패시터 및 그 제조방법 |
| US6054355A (en) * | 1997-06-30 | 2000-04-25 | Kabushiki Kaisha Toshiba | Method of manufacturing a semiconductor device which includes forming a dummy gate |
| JPH11195768A (ja) * | 1997-10-22 | 1999-07-21 | Fujitsu Ltd | ペロブスカイト型酸化物膜を含む電子装置とその製造方法及び強誘電体キャパシタ |
| US6180481B1 (en) * | 1998-01-09 | 2001-01-30 | Micron Technology, Inc. | Barrier layer fabrication methods |
| JPH11205898A (ja) * | 1998-01-16 | 1999-07-30 | Mitsubishi Electric Corp | 誘電体薄膜素子用電極およびその製造方法とそれを用いた超音波振動子 |
| JP3125922B2 (ja) * | 1998-01-20 | 2001-01-22 | ソニー株式会社 | 誘電体メモリおよびその製造方法 |
| JP3226166B2 (ja) * | 1998-02-06 | 2001-11-05 | ソニー株式会社 | 強誘電体キャパシタおよびその製造方法並びに強誘電体メモリ |
| KR100324601B1 (ko) * | 1998-12-30 | 2002-04-17 | 박종섭 | 계면의 특성 향상을 위한 강유전체 캐패시터 제조 방법 |
| EP1150354A4 (en) * | 1999-02-04 | 2002-08-28 | Rohm Co Ltd | CAPACITY AND THEIR PRODUCTION |
| US6101102A (en) * | 1999-04-28 | 2000-08-08 | Raytheon Company | Fixed frequency regulation circuit employing a voltage variable dielectric capacitor |
| JP2001223345A (ja) * | 1999-11-30 | 2001-08-17 | Hitachi Ltd | 半導体装置とその製造方法 |
| US6417537B1 (en) * | 2000-01-18 | 2002-07-09 | Micron Technology, Inc. | Metal oxynitride capacitor barrier layer |
| US6682772B1 (en) * | 2000-04-24 | 2004-01-27 | Ramtron International Corporation | High temperature deposition of Pt/TiOx for bottom electrodes |
| KR100604662B1 (ko) * | 2000-06-30 | 2006-07-25 | 주식회사 하이닉스반도체 | 상부전극과 층간절연막 사이의 접착력을 향상시킬 수 있는반도체 메모리 소자 및 그 제조 방법 |
| US6492242B1 (en) * | 2000-07-03 | 2002-12-10 | Chartered Semiconductor Manufacturing Ltd. | Method of forming of high K metallic dielectric layer |
| JP2002094018A (ja) * | 2000-09-14 | 2002-03-29 | Fujitsu Ltd | 電子装置の製造方法 |
| KR100338780B1 (ko) * | 2000-09-15 | 2002-06-01 | 윤종용 | 층간절연막의 손상을 방지할 수 있는 반도체 메모리 소자및 그 제조방법 |
| JP2002124647A (ja) * | 2000-10-18 | 2002-04-26 | Sharp Corp | 半導体装置 |
| KR100506082B1 (ko) * | 2000-12-18 | 2005-08-04 | 삼성전자주식회사 | 반구형 잉크 챔버를 가진 잉크 젯 프린트 헤드의 제조 방법 |
| JP2003031806A (ja) * | 2001-05-09 | 2003-01-31 | Hitachi Ltd | Mosトランジスタ及びその製造方法 |
| US6461914B1 (en) * | 2001-08-29 | 2002-10-08 | Motorola, Inc. | Process for making a MIM capacitor |
| JP4067079B2 (ja) * | 2001-12-26 | 2008-03-26 | 松下電器産業株式会社 | 半導体装置及びその製造方法 |
-
2002
- 2002-05-15 US US10/147,093 patent/US7335552B2/en not_active Expired - Lifetime
-
2003
- 2003-05-12 KR KR1020047018348A patent/KR100699397B1/ko not_active Expired - Fee Related
- 2003-05-12 EP EP03734002A patent/EP1504460B1/en not_active Expired - Lifetime
- 2003-05-12 DE DE60328596T patent/DE60328596D1/de not_active Expired - Lifetime
- 2003-05-12 WO PCT/US2003/014934 patent/WO2003098646A1/en not_active Ceased
- 2003-05-12 JP JP2004506049A patent/JP5059290B2/ja not_active Expired - Fee Related
-
2007
- 2007-12-20 US US12/004,178 patent/US7545625B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| KR100699397B1 (ko) | 2007-03-27 |
| JP5059290B2 (ja) | 2012-10-24 |
| EP1504460B1 (en) | 2009-07-29 |
| KR20040106543A (ko) | 2004-12-17 |
| US20030216017A1 (en) | 2003-11-20 |
| JP2005526390A (ja) | 2005-09-02 |
| US20080106846A1 (en) | 2008-05-08 |
| EP1504460A1 (en) | 2005-02-09 |
| US7335552B2 (en) | 2008-02-26 |
| WO2003098646A1 (en) | 2003-11-27 |
| US7545625B2 (en) | 2009-06-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition |