DE60328596D1 - Verbesserte elektrode für dünnschichtkondensatorvorrichtungen - Google Patents

Verbesserte elektrode für dünnschichtkondensatorvorrichtungen

Info

Publication number
DE60328596D1
DE60328596D1 DE60328596T DE60328596T DE60328596D1 DE 60328596 D1 DE60328596 D1 DE 60328596D1 DE 60328596 T DE60328596 T DE 60328596T DE 60328596 T DE60328596 T DE 60328596T DE 60328596 D1 DE60328596 D1 DE 60328596D1
Authority
DE
Germany
Prior art keywords
thin
improved electrode
film condenser
condenser devices
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60328596T
Other languages
German (de)
English (en)
Inventor
John J Drab
Thomas K Dougherty
Kathleen A Kehle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Application granted granted Critical
Publication of DE60328596D1 publication Critical patent/DE60328596D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • H01G4/008Selection of materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69Inorganic materials
    • H10P14/692Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6938Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides
    • H10P14/6939Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal
    • H10P14/69393Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal the material containing tantalum, e.g. Ta2O5
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/10Metal-oxide dielectrics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/33Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00Resistors, capacitors or inductors
    • H10D1/60Capacitors
    • H10D1/68Capacitors having no potential barriers
    • H10D1/692Electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6302Non-deposition formation processes
    • H10P14/6304Formation by oxidation, e.g. oxidation of the substrate
    • H10P14/6314Formation by oxidation, e.g. oxidation of the substrate of a metallic layer
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6302Non-deposition formation processes
    • H10P14/6322Formation by thermal treatments

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Semiconductor Memories (AREA)
  • Formation Of Insulating Films (AREA)
DE60328596T 2002-05-15 2003-05-12 Verbesserte elektrode für dünnschichtkondensatorvorrichtungen Expired - Lifetime DE60328596D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/147,093 US7335552B2 (en) 2002-05-15 2002-05-15 Electrode for thin film capacitor devices
PCT/US2003/014934 WO2003098646A1 (en) 2002-05-15 2003-05-12 Improved electrode for thin film capacitor devices

Publications (1)

Publication Number Publication Date
DE60328596D1 true DE60328596D1 (de) 2009-09-10

Family

ID=29418951

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60328596T Expired - Lifetime DE60328596D1 (de) 2002-05-15 2003-05-12 Verbesserte elektrode für dünnschichtkondensatorvorrichtungen

Country Status (6)

Country Link
US (2) US7335552B2 (https=)
EP (1) EP1504460B1 (https=)
JP (1) JP5059290B2 (https=)
KR (1) KR100699397B1 (https=)
DE (1) DE60328596D1 (https=)
WO (1) WO2003098646A1 (https=)

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KR100634509B1 (ko) * 2004-08-20 2006-10-13 삼성전자주식회사 3차원 반도체 캐패시터 및 그 제조 방법
US20060065916A1 (en) 2004-09-29 2006-03-30 Xubai Zhang Varactors and methods of manufacture and use
CN101124638A (zh) * 2004-12-06 2008-02-13 哈佛大学 基于纳米尺度线的数据存储
DE102005048774B4 (de) * 2005-10-07 2009-04-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Substrat, das zumindest bereichsweise an einer Oberfläche mit einer Beschichtung eines Metalls versehen ist, sowie dessen Verwendung
US7560392B2 (en) 2006-05-10 2009-07-14 Micron Technology, Inc. Electrical components for microelectronic devices and methods of forming the same
KR100849187B1 (ko) * 2006-06-30 2008-07-30 주식회사 하이닉스반도체 반도체 소자의 캐패시터 제조 방법

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US19874A (en) * 1858-04-06 Improvement in cotton-seed planters
DE2513858C3 (de) 1975-03-27 1981-08-06 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung eines Tantal-Dünnschichtkondensators
JPS5874079A (ja) * 1981-10-28 1983-05-04 Japan Electronic Ind Dev Assoc<Jeida> 薄膜トランジスタ
KR930012120B1 (ko) * 1991-07-03 1993-12-24 삼성전자 주식회사 반도체장치 및 그의 제조방법
US5142438A (en) * 1991-11-15 1992-08-25 Micron Technology, Inc. Dram cell having a stacked capacitor with a tantalum lower plate, a tantalum oxide dielectric layer, and a silicide buried contact
US5390072A (en) * 1992-09-17 1995-02-14 Research Foundation Of State University Of New York Thin film capacitors
US5723171A (en) * 1992-10-23 1998-03-03 Symetrix Corporation Integrated circuit electrode structure and process for fabricating same
US5479317A (en) * 1994-10-05 1995-12-26 Bell Communications Research, Inc. Ferroelectric capacitor heterostructure and method of making same
US6204111B1 (en) * 1994-12-28 2001-03-20 Matsushita Electronics Corporation Fabrication method of capacitor for integrated circuit
JP3098923B2 (ja) * 1994-12-28 2000-10-16 松下電子工業株式会社 半導体装置およびその製造方法
JP3480624B2 (ja) * 1995-06-09 2003-12-22 シャープ株式会社 強誘電体薄膜被覆基板、その製造方法、及びキャパシタ構造素子
GB9512529D0 (en) * 1995-06-20 1995-08-23 Bnfl Fluorchem Ltd Cell treatment
JP3929513B2 (ja) * 1995-07-07 2007-06-13 ローム株式会社 誘電体キャパシタおよびその製造方法
KR100234000B1 (ko) * 1996-09-04 1999-12-15 박호군 피제트티 박막 및 그 제조방법
KR19980077149A (ko) * 1997-04-17 1998-11-16 윤종용 다층전극 구조를 갖는 강유전체 메모리의 커패시터 및 그 제조방법
US6054355A (en) * 1997-06-30 2000-04-25 Kabushiki Kaisha Toshiba Method of manufacturing a semiconductor device which includes forming a dummy gate
JPH11195768A (ja) * 1997-10-22 1999-07-21 Fujitsu Ltd ペロブスカイト型酸化物膜を含む電子装置とその製造方法及び強誘電体キャパシタ
US6180481B1 (en) * 1998-01-09 2001-01-30 Micron Technology, Inc. Barrier layer fabrication methods
JPH11205898A (ja) * 1998-01-16 1999-07-30 Mitsubishi Electric Corp 誘電体薄膜素子用電極およびその製造方法とそれを用いた超音波振動子
JP3125922B2 (ja) * 1998-01-20 2001-01-22 ソニー株式会社 誘電体メモリおよびその製造方法
JP3226166B2 (ja) * 1998-02-06 2001-11-05 ソニー株式会社 強誘電体キャパシタおよびその製造方法並びに強誘電体メモリ
KR100324601B1 (ko) * 1998-12-30 2002-04-17 박종섭 계면의 특성 향상을 위한 강유전체 캐패시터 제조 방법
EP1150354A4 (en) * 1999-02-04 2002-08-28 Rohm Co Ltd CAPACITY AND THEIR PRODUCTION
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Also Published As

Publication number Publication date
KR100699397B1 (ko) 2007-03-27
JP5059290B2 (ja) 2012-10-24
EP1504460B1 (en) 2009-07-29
KR20040106543A (ko) 2004-12-17
US20030216017A1 (en) 2003-11-20
JP2005526390A (ja) 2005-09-02
US20080106846A1 (en) 2008-05-08
EP1504460A1 (en) 2005-02-09
US7335552B2 (en) 2008-02-26
WO2003098646A1 (en) 2003-11-27
US7545625B2 (en) 2009-06-09

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Legal Events

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