DE60309150D1 - Emv-abschirmung mit verbesserter waermeableitung - Google Patents
Emv-abschirmung mit verbesserter waermeableitungInfo
- Publication number
- DE60309150D1 DE60309150D1 DE60309150T DE60309150T DE60309150D1 DE 60309150 D1 DE60309150 D1 DE 60309150D1 DE 60309150 T DE60309150 T DE 60309150T DE 60309150 T DE60309150 T DE 60309150T DE 60309150 D1 DE60309150 D1 DE 60309150D1
- Authority
- DE
- Germany
- Prior art keywords
- electrically conductive
- board
- electrical component
- heat removal
- improved heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
- H05K9/0028—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet with retainers or specific soldering features
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
- H05K9/0035—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids with retainers mounted beforehand on the PCB, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
- H01L2924/16153—Cap enclosing a plurality of side-by-side cavities [e.g. E-shaped cap]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Water Treatment By Sorption (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
- Thermotherapy And Cooling Therapy Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US120251 | 2002-04-10 | ||
US10/120,251 US6744640B2 (en) | 2002-04-10 | 2002-04-10 | Board-level EMI shield with enhanced thermal dissipation |
PCT/US2003/007507 WO2003088729A1 (en) | 2002-04-10 | 2003-03-11 | Board-level emi shield with enhanced thermal dissipation |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60309150D1 true DE60309150D1 (de) | 2006-11-30 |
DE60309150T2 DE60309150T2 (de) | 2007-08-30 |
Family
ID=28790069
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60309150T Expired - Lifetime DE60309150T2 (de) | 2002-04-10 | 2003-03-11 | Emv-abschirmung mit verbesserter waermeableitung |
Country Status (15)
Country | Link |
---|---|
US (1) | US6744640B2 (de) |
EP (1) | EP1493314B1 (de) |
JP (1) | JP4317033B2 (de) |
KR (1) | KR100590662B1 (de) |
CN (1) | CN100438737C (de) |
AT (1) | ATE343316T1 (de) |
AU (1) | AU2003213838B2 (de) |
BR (1) | BR0309043A (de) |
CA (1) | CA2481842C (de) |
DE (1) | DE60309150T2 (de) |
HK (1) | HK1068204A1 (de) |
IL (1) | IL164453A (de) |
MX (1) | MXPA04009895A (de) |
NO (1) | NO336280B1 (de) |
WO (1) | WO2003088729A1 (de) |
Families Citing this family (114)
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US7259969B2 (en) * | 2003-02-26 | 2007-08-21 | Wavezero, Inc. | Methods and devices for connecting and grounding an EMI shield to a printed circuit board |
CN1810068A (zh) * | 2003-06-19 | 2006-07-26 | 波零公司 | 印刷电路板的emi吸收屏蔽 |
US7106588B2 (en) * | 2003-10-27 | 2006-09-12 | Delphi Technologies, Inc. | Power electronic system with passive cooling |
KR100652621B1 (ko) * | 2003-11-21 | 2006-12-06 | 엘지전자 주식회사 | 휴대용 단말기의 방열장치 |
US7880282B2 (en) * | 2003-12-18 | 2011-02-01 | Rf Module & Optical Design Ltd. | Semiconductor package with integrated heatsink and electromagnetic shield |
US20050231932A1 (en) * | 2004-04-15 | 2005-10-20 | Motorola, Inc. | Reinforcement for substrate assemblies |
US7813145B2 (en) * | 2004-06-30 | 2010-10-12 | Endwave Corporation | Circuit structure with multifunction circuit cover |
US20060002099A1 (en) * | 2004-06-30 | 2006-01-05 | Stoneham Edward B | Electromagnetic shield assembly |
US7190053B2 (en) * | 2004-09-16 | 2007-03-13 | Rosemount Inc. | Field device incorporating circuit card assembly as environmental and EMI/RFI shield |
US20060082986A1 (en) * | 2004-10-14 | 2006-04-20 | Chen Chi H | Housing for memory card |
US7254034B2 (en) * | 2004-12-15 | 2007-08-07 | Lucent Technologies Inc. | Thermal management for shielded circuit packs |
US7273357B2 (en) * | 2005-08-10 | 2007-09-25 | Mitsubishi Heavy Industries, Ltd. | Control device for electric compressor |
TWI286921B (en) * | 2005-09-09 | 2007-09-11 | Quanta Comp Inc | Apparatus for minimizing electromagnetic interference and manufacturing method thereof |
US7491899B2 (en) * | 2005-10-06 | 2009-02-17 | Laird Technologies, Inc. | EMI shields and related manufacturing methods |
US20070090533A1 (en) * | 2005-10-24 | 2007-04-26 | Texas Instruments Incorporated | Closed loop thermally enhanced flip chip BGA |
US7595468B2 (en) * | 2005-11-07 | 2009-09-29 | Intel Corporation | Passive thermal solution for hand-held devices |
US7287432B2 (en) * | 2005-11-17 | 2007-10-30 | Rosemount Inc. | Process transmitter with overpressure vent |
US20080080160A1 (en) * | 2005-12-16 | 2008-04-03 | Laird Technologies, Inc. | Emi shielding assemblies |
US7262369B1 (en) * | 2006-03-09 | 2007-08-28 | Laird Technologies, Inc. | Combined board level EMI shielding and thermal management |
JP2007194830A (ja) * | 2006-01-18 | 2007-08-02 | Mitsumi Electric Co Ltd | チューナモジュール |
US7317618B2 (en) * | 2006-03-09 | 2008-01-08 | Laird Technologies, Inc. | Combined board level shielding and thermal management |
US7623360B2 (en) | 2006-03-09 | 2009-11-24 | Laird Technologies, Inc. | EMI shielding and thermal management assemblies including frames and covers with multi-position latching |
US7463496B2 (en) * | 2006-03-09 | 2008-12-09 | Laird Technologies, Inc. | Low-profile board level EMI shielding and thermal management apparatus and spring clips for use therewith |
WO2007113079A1 (de) * | 2006-03-31 | 2007-10-11 | Siemens Home And Office Communication Devices Gmbh & Co. Kg | Kühlkörper und dessen verwendung als kühl- und abschirmvorrichtung |
US7138584B1 (en) * | 2006-04-07 | 2006-11-21 | Lotes Co., Ltd. | Electrical connector |
US9713258B2 (en) | 2006-04-27 | 2017-07-18 | International Business Machines Corporation | Integrated circuit chip packaging |
US20080002384A1 (en) * | 2006-06-30 | 2008-01-03 | Motorola, Inc. | Apparatus for providing radio frequency shielding and heat dissipation for electronic components |
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US20080115967A1 (en) * | 2006-11-22 | 2008-05-22 | Giboney Kirk S | Shield For A Microwave Circuit Module |
US8081484B2 (en) | 2006-11-30 | 2011-12-20 | Cisco Technology, Inc. | Method and apparatus for supporting a computer chip on a printed circuit board assembly |
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US7928326B2 (en) * | 2009-02-27 | 2011-04-19 | Hewlett-Packard Development Company, L.P. | Thermoformed EMI shield |
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JP5322282B2 (ja) * | 2009-04-24 | 2013-10-23 | Necエンジニアリング株式会社 | 電子機器の放熱装置 |
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JPWO2014080931A1 (ja) * | 2012-11-21 | 2017-01-05 | 株式会社カネカ | 放熱構造体 |
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US9411385B2 (en) * | 2013-05-13 | 2016-08-09 | Google Technology Holdings LLC | Electronic device assembly with compression gasket |
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TWI533793B (zh) * | 2013-10-25 | 2016-05-11 | 緯創資通股份有限公司 | 電子裝置及其電磁波屏蔽模組 |
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- 2003-03-11 MX MXPA04009895A patent/MXPA04009895A/es active IP Right Grant
- 2003-03-11 EP EP03711531A patent/EP1493314B1/de not_active Expired - Lifetime
- 2003-03-11 WO PCT/US2003/007507 patent/WO2003088729A1/en active IP Right Grant
- 2003-03-11 DE DE60309150T patent/DE60309150T2/de not_active Expired - Lifetime
- 2003-03-11 CA CA2481842A patent/CA2481842C/en not_active Expired - Fee Related
- 2003-03-11 JP JP2003585487A patent/JP4317033B2/ja not_active Expired - Fee Related
- 2003-03-11 AU AU2003213838A patent/AU2003213838B2/en not_active Ceased
- 2003-03-11 KR KR1020047016038A patent/KR100590662B1/ko active IP Right Grant
- 2003-03-11 AT AT03711531T patent/ATE343316T1/de not_active IP Right Cessation
- 2003-03-11 CN CNB038133075A patent/CN100438737C/zh not_active Expired - Fee Related
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2004
- 2004-10-08 IL IL164453A patent/IL164453A/en not_active IP Right Cessation
- 2004-10-29 NO NO20044695A patent/NO336280B1/no not_active IP Right Cessation
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2005
- 2005-02-15 HK HK05101200A patent/HK1068204A1/xx not_active IP Right Cessation
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JP4317033B2 (ja) | 2009-08-19 |
CA2481842C (en) | 2012-06-26 |
HK1068204A1 (en) | 2005-04-22 |
KR100590662B1 (ko) | 2006-06-19 |
CN100438737C (zh) | 2008-11-26 |
NO20044695L (no) | 2004-10-29 |
CN1659942A (zh) | 2005-08-24 |
JP2006513556A (ja) | 2006-04-20 |
KR20040099415A (ko) | 2004-11-26 |
EP1493314A1 (de) | 2005-01-05 |
US20030193794A1 (en) | 2003-10-16 |
WO2003088729A1 (en) | 2003-10-23 |
IL164453A (en) | 2009-05-04 |
BR0309043A (pt) | 2005-02-01 |
AU2003213838B2 (en) | 2005-11-03 |
NO336280B1 (no) | 2015-07-06 |
EP1493314B1 (de) | 2006-10-18 |
ATE343316T1 (de) | 2006-11-15 |
IL164453A0 (en) | 2005-12-18 |
DE60309150T2 (de) | 2007-08-30 |
MXPA04009895A (es) | 2004-12-07 |
AU2003213838A1 (en) | 2003-10-27 |
US6744640B2 (en) | 2004-06-01 |
CA2481842A1 (en) | 2003-10-23 |
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