JP6127429B2 - 冷却装置及び電子装置 - Google Patents
冷却装置及び電子装置 Download PDFInfo
- Publication number
- JP6127429B2 JP6127429B2 JP2012216610A JP2012216610A JP6127429B2 JP 6127429 B2 JP6127429 B2 JP 6127429B2 JP 2012216610 A JP2012216610 A JP 2012216610A JP 2012216610 A JP2012216610 A JP 2012216610A JP 6127429 B2 JP6127429 B2 JP 6127429B2
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- Prior art keywords
- heat
- receiving plate
- generating component
- noise generating
- cooling device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000001816 cooling Methods 0.000 title claims description 70
- 239000000758 substrate Substances 0.000 claims description 37
- 238000012546 transfer Methods 0.000 claims description 32
- 230000002093 peripheral effect Effects 0.000 claims description 13
- 239000013013 elastic material Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 230000020169 heat generation Effects 0.000 claims description 5
- 230000005855 radiation Effects 0.000 description 11
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 2
- 230000010365 information processing Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005325 percolation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D25/00—Pumping installations or systems
- F04D25/02—Units comprising pumps and their driving means
- F04D25/06—Units comprising pumps and their driving means the pump being electrically driven
- F04D25/0606—Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump
- F04D25/0613—Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump the electric motor being of the inside-out type, i.e. the rotor is arranged radially outside a central stator
Description
図1は第1実施形態の電子装置1を上面側から観た斜視図である。図2は第1実施形態の電子装置1を下面側から観た斜視図である。図3は第1実施形態の電子装置1の一部を分解して示す説明図である。図4は第1実施形態の電子装置1の下カバーを取り外した状態を示す斜視図である。図5(A)〜(F)は第1実施形態の電子装置1が備える冷却装置20の一部の6面図である。
つぎに、図6乃至図11を参照しつつ第2実施形態について説明する。図6は第2実施形態の電子装置1の一部を分解して示す斜視図である。図7は第2実施形態の電子装置1の上カバー3を取り外した状態を示す斜視図である。図8は第2実施形態の電子装置1が備える基板50と冷却装置70とを分解して示す斜視図である。図9は第2実施形態の電子装置1が備える基板50と冷却装置70とを組み立てた状態を示す斜視図である。図10(A)は第2実施形態の電子装置1が備える基板50と冷却装置70とを組み立てた状態の平面図であり、図10(B)は図10(A)におけるA−A線断面図であり、図10(C)は図10(A)におけるB−B線断面図である。図11(A)〜(F)は第2実施形態の電子装置1が備える冷却装置70の6面図である。
(付記1)伝熱部材の一端部に設けられた放熱部と、
前記伝熱部材の他端部に設けられ、基板に実装されたノイズ発生部品と対向配置されて前記ノイズ発生部品と熱的に接続される受熱板と、
前記伝熱部材の前記他端部側に設けられ、前記ノイズ発生部品を覆うシールド部を備えた冷却装置。
(付記2)前記シールド部は、前記受熱板と、前記受熱板に連設された周壁部とを含む付記1に記載の冷却装置。
(付記3)前記シールド部は、板金の絞り加工により形成された前記受熱板と前記受熱板に連設された周壁部とを含む付記1に記載の冷却装置。
(付記4)前記受熱板は、弾性素材を介して前記基板に取り付けられる付記1乃至3のいずれか一項に記載の冷却装置。
(付記5)前記シールド部に連設され、前記シールド部が覆う前記ノイズ発生部品とは異なる他のノイズ発生部品を覆う延設部をさらに備えた付記1乃至4のいずれか一項に記載の冷却装置。
(付記6)前記伝熱部材の前記他端部は、前記受熱板上に位置する付記1乃至5のいずれか一項に記載の冷却装置。
(付記7)前記伝熱部材は、ヒートパイプである付記1乃至6のいずれか一項に記載の冷却装置。
(付記8)ノイズ発生部品が実装された基板と、
伝熱部材の一端部に設けられた放熱部と、前記伝熱部材の他端部に設けられ、前記ノイズ発生部品と対向配置されて前記ノイズ発生部品と熱的に接続される受熱板と、前記伝熱部材の前記他端部側に設けられ、前記ノイズ発生部品を覆うシールド部を備えた冷却装置と、
を、備えた電子装置。
(付記9)前記シールド部は、前記受熱板と、前記受熱板に連設された周壁部とを含む付記8に記載の電子装置。
(付記10)前記シールド部は、板金の絞り加工により形成された前記受熱板と前記受熱板に連設された周壁部とを含む付記8に記載の電子装置。
11、51 CPU 11a、51a ダイ
20、70 冷却装置 21、71 放熱部
22、72 ヒートパイプ 22a、72a 一端部
22b、72b 他端部 23 シールド部材
23a 天板部 23b 周壁部
23b1 溝部 24 受熱板
25、74 第1取付部材 26、75 第2取付部材
30 ファン装置 52 チップセット(FCH)
52a ダイ 73 シールド部
73a 受熱板 73b 周壁部
77 延設部 77a 天板部
77b 周壁部 77c 凹部
78 放熱ゴム
Claims (7)
- 伝熱部材の一端部に設けられた放熱部と、
前記伝熱部材の他端部に設けられ、基板に実装されたノイズ発生部品と対向配置されて前記ノイズ発生部品と熱的に接続される受熱板と、
前記伝熱部材の前記他端部側に設けられ、板金の絞り加工により形成された前記受熱板と当該受熱板に連設された周壁部とを含み、前記ノイズ発生部品を覆うシールド部と、
前記シールド部に連設され、前記シールド部が覆う前記ノイズ発生部品とは異なる他のノイズ発生部品を覆う延設部と、を備え、
前記伝熱部材の前記他端部は、前記受熱板上に位置する冷却装置。 - 前記伝熱部材は、ヒートパイプである請求項1に記載の冷却装置。
- 前記受熱板は、前記伝熱部材の一部と重ねて設けられた請求項1又は2に記載の冷却装置。
- 前記受熱板は、弾性素材を介して前記基板に取り付けられる請求項1乃至3のいずれか一項に記載の冷却装置。
- 前記延設部が覆う前記他のノイズ発生部品の発熱量は、前記シールド部に覆われる前記ノイズ発生部品の発熱量より少ない請求項1乃至4のいずれか一項に記載の冷却装置。
- 前記受熱板は前記シールド部と一体である請求項1乃至5のいずれか一項に記載の冷却装置。
- ノイズ発生部品が実装された基板と、
伝熱部材の一端部に設けられた放熱部と、前記伝熱部材の他端部に設けられ、前記ノイズ発生部品と対向配置されて前記ノイズ発生部品と熱的に接続される受熱板と、前記伝熱部材の前記他端部側に設けられ、板金の絞り加工により形成された前記受熱板と当該受熱板に連設された周壁部とを含み、前記ノイズ発生部品を覆うシールド部と、
前記シールド部に連設され、前記シールド部が覆う前記ノイズ発生部品とは異なる他のノイズ発生部品を覆う延設部と、を備え、前記伝熱部材の前記他端部は、前記受熱板上に位置する冷却装置と、
を、備えた電子装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012216610A JP6127429B2 (ja) | 2012-09-28 | 2012-09-28 | 冷却装置及び電子装置 |
US13/912,764 US9357676B2 (en) | 2012-09-28 | 2013-06-07 | Cooling device and electronic apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012216610A JP6127429B2 (ja) | 2012-09-28 | 2012-09-28 | 冷却装置及び電子装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014072333A JP2014072333A (ja) | 2014-04-21 |
JP6127429B2 true JP6127429B2 (ja) | 2017-05-17 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2012216610A Expired - Fee Related JP6127429B2 (ja) | 2012-09-28 | 2012-09-28 | 冷却装置及び電子装置 |
Country Status (2)
Country | Link |
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US (1) | US9357676B2 (ja) |
JP (1) | JP6127429B2 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103081100B (zh) * | 2010-08-31 | 2015-07-15 | 富士通株式会社 | 冷却装置、印制基板单元以及电子装置 |
TWI512444B (zh) * | 2014-03-27 | 2015-12-11 | Quanta Comp Inc | 具熱阻絕效果的電子裝置 |
KR101941024B1 (ko) * | 2014-03-27 | 2019-01-22 | 삼성전자주식회사 | 쉴드 캔 조립체 및 그것을 갖는 전자 장치 |
CN105472940B (zh) * | 2014-08-20 | 2018-08-17 | 南京中兴新软件有限责任公司 | 终端散热装置及移动终端 |
US9648783B1 (en) * | 2016-02-25 | 2017-05-09 | Ebn Technology Corp. | Enhanced heat dissipation module having multi-layer heat isolation |
KR102608994B1 (ko) | 2016-07-28 | 2023-12-06 | 삼성전자주식회사 | 생체 인증을 이용한 결제 방법 및 이를 수행하는 전자 장치 |
US10779801B2 (en) * | 2016-09-21 | 2020-09-22 | Clarius Mobile Health Corp. | Ultrasound apparatus with improved heat dissipation and methods for providing same |
US10485135B2 (en) * | 2017-06-30 | 2019-11-19 | Dell Products, L.P. | Storage device cooling utilizing a removable heat pipe |
US11570411B2 (en) * | 2019-01-10 | 2023-01-31 | Hisense Laser Display Co., Ltd. | Laser light source and laser projection device |
US11592145B2 (en) | 2019-01-10 | 2023-02-28 | Hisense Laser Display Co., Ltd. | Laser light source and laser projection device |
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-
2012
- 2012-09-28 JP JP2012216610A patent/JP6127429B2/ja not_active Expired - Fee Related
-
2013
- 2013-06-07 US US13/912,764 patent/US9357676B2/en active Active
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Publication number | Publication date |
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US9357676B2 (en) | 2016-05-31 |
US20140092559A1 (en) | 2014-04-03 |
JP2014072333A (ja) | 2014-04-21 |
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