CN100438737C - 具有增强热耗散的板级emi屏蔽 - Google Patents
具有增强热耗散的板级emi屏蔽 Download PDFInfo
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Abstract
一种具有其上设置的至少一个电元件(11)的基板(10);在基板上按一定的图案设置并包围至少一个电元件的多个分散的导电性紧固单元(14);包括导电层(26)的板级的电磁干扰(EMI)屏蔽(20);形成于板级EMI屏蔽(20)中的多个孔(23),从而孔(23)对应于导电性紧固单元(14)的图案;设置于至少一个电元件上的至少一个导热对接(TCI)材料(40);以及其中,板级EMI屏蔽的导电层(26)与至少一个导电性紧固单元(14)电接触。
Description
发明领域
本发明一般涉及用于热耗散很重要的应用中的改进的板级(board-level)电磁干扰(EMI)屏蔽。本发明尤其涉及一种屏蔽,它便于拆卸、与单隔室或多隔室屏蔽设计兼容、侧面较薄、重量较轻并支持屏蔽元件的改进的热耗散。该解决方案对于在较小的电子装置中使用特别有利,诸如移动电话、个人数字助理、手持和膝上计算机等等。
发明背景
EMI屏蔽限制电磁辐射进入或离开包含电子元件的印刷电路板(PCB)的区域。如果它直接附着到PCB表面上并没有外部或自由的固定件(诸如螺丝或螺栓),从而从屏蔽设计中除去尺寸和重量的重要来源,则EMI屏蔽进一步被定义为“板级”。同样作为到PCB的该直接表面附着的结果,板级屏蔽允许PCB表面的一个或多个区域与给定装置内的相同(或其它PCB)的一个或多个区域EMI隔离。如同采用其它(非板级)屏蔽方案,板级屏蔽也允许装置上的PCB表面的一个或多个区域与其它外部装置EMI隔离。
经常,需要屏蔽的电元件在工作时还产生热量,诸如功率放大器、中央处理单元(CPU)、图形芯片等等。由于这些元件的性能常在较高温度时劣化,通常期望初始热量转移离开它们。这通常是通过使用传导以及通过使用导热对接(TCI)材料和散热片进行的。TCI材料填充元件和散热片之间层叠中的间隙,并具有比空气的导热率更高的导热率,且通常尽可能地高。TCI材料常由充满导热微粒的合适的弹性体(诸如硅酮)制成。散热片可以是有翼的金属块、由片金属或塑料构成的涂布板、热管组件或者能增强离开电元件和TCI材料的热耗散的任何结构。
板级EMI屏蔽的普通类型被称为“密封外壳(can)”。可以将密封外壳焊接到PCB上的接地轨迹,直接位于需要屏蔽的电元件上。这种密封外壳提供极高水平的屏蔽效率,它们通常非常可靠并且是工业上公知的。通过使用焊膏和回流工艺,它们常在将元件本身安装到PCB的同时按全自动化的方式通过表面安装技术(SMT)工艺安装。密封外壳很难拆卸和替换(如果被屏蔽的元件需要重新加工),因为去焊和再焊工艺非常复杂。
常常,通过密封外壳屏蔽的元件生成大量热量。但是,密封外壳需要它们在PCB上屏蔽的元件之上的机械间隙(即,气隙),以允许在回流工艺期间密封外壳到接地轨迹的适当焊接。因为该必要的间隙,TCI材料不能用来填充该气隙,这负面地影响热量从被屏蔽的元件转移离开。这使得密封外壳成为需要热耗散的情况中的不期望的解决方案。
Reis的美国专利序号09/793754中揭示了一种创新的板级屏蔽,该文献描述了一种可拆卸的多室屏蔽,其将多个分立的导电性紧固单元(诸如BGA焊料球)用作可拆卸的附着机构。但是,它没有考虑到对被屏蔽的元件的热耗散进行改善的需要。
US6347035中揭示了一种用于组合EMI屏蔽和热耗散的技术。虽然考虑了解决这两种问题的需要,但它仅教导了如何实现整个PCB(即,主板)的屏蔽,这必定包括两侧。这样,由于所描述的屏蔽密封不是板级的,屏蔽就不能使相同PCB的各区域(在同一侧或相对侧)相互隔离。参考文献5436803和5597979教导了类似的袋状屏蔽方案,它们不在板级处屏蔽,且不考虑对热耗散的需要。
参考文献5175613揭示了一种封装,它组合了EMI、ESD、电路芯片的热和机械电击保护。同样,参考文献6122167揭示了具有用于便携式计算机的EMI屏蔽的集成混合冷却装置。但是,这两个参考文献中的屏蔽方案都不是板级的,因为它们不允许使相同PCB的各区域相互屏蔽(即,一芯片与另一芯片)。此外,这些解决方案需要涉及螺丝或螺栓以及穿过PCB的孔的附着机构。这消耗了有价值的PCB空间,并给设计增加了重量。
迄今尚未提供但又需要的是板级的屏蔽,它同时可拆除、与单个或多个隔室的设计兼容、较薄、较轻并允许被屏蔽元件的热耗散。
发明内容
本发明提供了一种装置,它具有含其上设置的至少一个电元件的基板;在基板上按一定的图案设置并包围上述至少一个电元件的多个分立的导电性紧固单元;包括导电层的板级的电磁干扰(EMI)屏蔽;形成于板级EMI屏蔽中的多个孔,从而这些孔对应于导电性紧固单元的图案;设置于所述至少一个电元件上的至少一个导热对接(TCI)材料;以及其中,板级EMI屏蔽的导电层与至少一个导电性紧固单元电接触。
在另一个方面中,本发明提供了一种基板,它具有设置于其上的至少一个电元件;多个焊料球,它们设置于基板上包围至少一个电元件;板级电磁干扰(EMI)屏蔽,它包括适合于覆盖至少一个电元件的至少一个隔室,板级EMI屏蔽进一步包括导电层;至少一个导热对接(TCI)材料,其设置于至少一个电元件上;散热片,设置于至少一个TCI材料上;其中,板级EMI屏蔽的导电层与至少一个焊料球电接触,且其中板级EMI屏蔽和焊料球组合以限制电磁辐射进入或离开至少一个隔室;以及(g)其中,散热片和至少一个TCI材料组合以使热量从至少一个电元件散去。
在另一个方面中,本发明提供了一种用于基板和多个分立的导电性紧固单元的板级电磁干扰(EMI)屏蔽,该基板具有设置于其上的至少一个电元件且所述多个分立的导电性紧固单元在基板上设置成一定图案并包围至少一个电元件,其特征在于,所述板级EMI屏蔽包括:导电层;多个孔,它们形成于所述板级EMI屏蔽中从而所述孔对应于导电性紧固单元的图案;至少一个导热对接(TCI)材料,其附着到所述板级EMI屏蔽上;其中,至少一个所述孔具有接触区,且其中所述孔的所述接触区处的所述板级EMI屏蔽的所述导电层可偏斜到必要的程度以允许所述接触区啮合和保持所述导电性紧固单元中的至少一个;以及其中,所述接触区处的所述EMI屏蔽的所述导电层适合于形成与至少一个所述导电性紧固单元的电接触。
附图概述
图1是根据本发明的实例性实施例的基板的平面图。
图2是根据本发明的实例性实施例的导电性紧固单元的侧视图。
图3是根据本发明的实例性屏蔽的侧视图。
图4是图3的屏蔽的剖视图。
图5是根据本发明的另一个实例性屏蔽的侧视图。
图6a是根据本发明的另一个实例性屏蔽的侧视图。
图6b是根据本发明的另一个实例性屏蔽的侧视图。
图7是根据本发明的另一个实例性屏蔽的侧视图。
图8是根据本发明的另一个实例性屏蔽的侧视图。
具体实施方式
现在参考附图,本发明提供了板级EMI屏蔽,它增强了被屏蔽的元件的热耗散。图1是根据本发明实施例的PCB(10)的平面图。PCB(10)是具有在区域(12)中组合在一起的多个电元件(11)的基板。围绕区域(12)的是多个接地轨迹焊盘(13)。设置在每个接地轨迹焊盘(13)上的是导电性紧固单元(14)。导电性紧固单元(14)例如通过使用焊料机械和电气地耦合到接地轨迹焊盘(13)。为便于说明,仅示出一些接地轨迹焊盘(13)以具有设置其上的导电性紧固单元(14),但较佳地,所有接地轨迹焊盘(13)都具有设置其上的导电性紧固单元(14)。多个分立的导电性紧固单元(14)按围绕区域(12)的图案设置于PCB(10)上。
在较佳实施例中,导电性紧固单元(14)是焊料球。但是,导电性紧固单元(14)可以是任何形状或者任何材料,只要它导电、分立、可靠地机械和电气地可附着到PCB(10)上的接地轨迹焊盘(13),并且还适合于可拆卸地机械和电气附着到屏蔽上。导电性紧固单元(14)的其它实例在Reis的美国专利申请序号09/793754中有所描述,该文献结合在此作为参考。
图2示出了适合于覆盖PCB(10)上的区域(12)的隔室(21)的屏蔽(20)。屏蔽(20)具有包含多个孔(23)的凸缘(22)。孔(23)也形成于隔室(21)之间的屏蔽20中。孔(23)形成的图案与通过导电性紧固单元(14)形成的图案相对应,从而就有孔(23)适合于与每一个(或基本上每一个)导电性紧固单元(14)配合。
屏蔽(20)置于PCB(10)上并附着其上,如图3所示。图3示出通过孔(23)突出的导电性紧固单元(14),以提供屏蔽(20)到PCB(10)的可靠机械附着。每个孔(23)的直径优选小于导电性紧固单元(14)的最大宽度(例如,大于焊料球的直径)。因为导电性紧固单元(14)大于孔(23),该附着形成可以通过使屏蔽(20)脱离PCB(10)而方便地脱扣的搭扣配合或静配合(snap or interference fit)。因此,屏蔽(20)可拆卸地附着到PCB(10)上。作为静配合的结果,导电性紧固单元(14)与屏蔽(20)电接触。关于搭扣配合的进一步的细节在Reis的美国专利申请序号09/793754中有所描述。
当屏蔽(20)在PCB(10)上就位且导电性紧固单元(14)搭扣配合入孔(23)时,通过在区域(12)中密封元件(11)的隔室(21)形成板级EMI屏蔽。这防止或限制了不期望的电磁辐射进入或离开区域(12)。
图4表示从图3获得的界面A-A示图,并示出了两个隔室(21),它们每一个都包围一个需要增强的热耗散的元件(11)。屏蔽(20)被示出为通过导电性紧固单元(14)安装在PCB(10)上。设置在元件(11)上和屏蔽(20)下的是TCI材料(40)。TCI材料(40)可以是充满导热微粒的弹性体,但也可以是导热性高于空气的导热性的任何材料。例如,这种TCI材料(40)可以从W.L.Gore&Associates,Inc.的商品名称POLAR-Chomerics,Div.Of Parker Hannifin Corp.的Cho-和TheBerquist Company的Sil-获得。TCI材料(40)与元件(11)和屏蔽(20)物理接触。TCI材料(40)可以通过机械或粘合装置(未示出)附着到元件(11)或屏蔽(20)。在工作情况下,元件(11)产生热量,随后通过TCI材料(40)传导到屏蔽(20)。因此,TCI材料(40)帮助将热量转移到屏蔽(20),在这种情况中,它同时用作散热片以便将热量从元件(11)散去。
屏蔽(20)可以部分地由塑料、电介质材料、填充的电介质材料、金属、金属箔、金属镀上或涂覆的电介质材料或其组合制成,但必须至少包括导电层。该导电层可以包含孔(诸如具有金属网孔),但优选是基本上连续的。根据其结构,现有几种形成方法来生成这种屏蔽(20)。对于用塑料进行工作来说,热形成或真空形成是优选的方法,这是由于它们较低的加工成本、较低的制造成本和在三维中形成复杂的屏蔽形状的能力。用于屏蔽(20)的最优选塑料材料是诸如聚碳酸酯、乙腈-丁二烯-苯乙烯(ABS)、ABS-聚碳酸酯掺合物、聚醚酰亚胺、聚四氟乙烯、或者膨胀的聚四氟乙烯、它们可以镀上、涂覆或层压上高电导率的金属,如铝、镍、铜、银、锡或者其组合或合金。或者,屏蔽(20)可以是拉伸的或折叠的金属或箔,具有或没有涂覆或者层压其上的电介质层。如果屏蔽(20)将用作散热片(如图4所示),屏蔽(20)优选尽可能导热。由于多数电介质和塑料不是非常导热,因此,期望图4中的屏蔽(20)主要由金属制成,且如果存在电介质层,它应尽可能地薄。
如图5所示,在较佳实施例中,屏蔽(20)由两个层构成,包括任选的电介质材料层(27)和导电层(26)。电介质材料层(27)具有内表面(25a)和外表面(25)。导电层(26)至少设置于外表面(25)的一部分上。电介质材料层(27)是具有非常低的导电率的任何材料(例如,小于一百万分之一mho/cm)。电介质材料层(27)还优选尽可能薄以帮助屏蔽(20)的最大导热性。导电层(26)优选通过诸如溅射、真空或汽相沉积、无电镀或电解电镀的工艺形成。导电层(26)或者是层压到外表面(25)上的箔。该双层结构特别有利,因为它减少或消除了内表面(25a)与PCB(10)上的任何元件(11)形成不需要的电接触的可能性,即使机械接触仍会产生。这允许消除屏蔽(20)下会消耗电子器件容积中的有价值空间的任何较大间隙,从而允许更薄的设计。只要屏蔽(20)在导电性紧固单元(14)上搭咬就位,导电层(26)可以是适合于与导电性紧固单元(14)形成电接触的任何材料。TCI材料(40)与元件(11)和屏蔽(20)的电介质层(27)的内表面(25a)两者物理接触。TCI材料(40)可以通过机械或粘合装置(未示出)附着到元件(11)或屏蔽(20)上。在工作情况下,元件(11)产生热量,随后通过TCI材料(40)传导到屏蔽(20)。从而,TCI材料(40)帮助将热量转移到屏蔽(20)。因此,屏蔽(20)同时用作散热片以便将热量从元件(11)散去。
在对于图5所示的可选结构中(未示出),导电层(26)至少设置于内表面(25a)的一部分上,而不是电介质材料层(27)的外表面(25)上。在这种情况中,导电层(26)可以通过交替的搭扣结构与接地轨迹焊盘(13)或导电性紧固单元(14)直接接触,如Reis的美国专利申请序号09/793754中所描述的。
如图6a所示,在较佳实施例中,屏蔽(20)在此由两个层构成,包括电介质材料层(27)和至少设置在外表面(25)的一部分上的导电层(26)。还示出了散热片(50),它可以是有翼的金属块、由片金属或塑料构成的涂布板、热管组件或者能增强离开元件(11)和TCI材料(40)的热耗散的任何结构。散热片通过外部装置(未示出)位于相对于屏蔽(20)和PCB(10)的固定位置。TCI材料(40)设置于元件(11)上并与元件(11)和屏蔽(20)的电介质层(27)的内表面(25a)物理接触。或者,TCI材料(41)设置于屏蔽(20)上并与导电层(26)和散热片(50)物理接触。或者,如图6b所示,同时使用TCI材料(40)和(41)。TCI材料(40)和/或(41)可以通过机械或粘合装置(未示出)附着到散热片(50)、元件(11)或屏蔽(20)上。在工作情况下,元件(11)产生热量,随后通过TCI材料(40)和/或(41)以及屏蔽(20)传导到散热片(50)。因此,TCI材料(40)和/或(41)有助于将热量转移到散热片(50),以便将热量从元件(11)散去。
如图7所示,在另一个较佳实施例中,屏蔽(20)再次由两个层构成,包括电介质材料层(27)和至少设置在外表面(25)的一部分上的导电层(26)。还示出了散热片(50),具有导电表面(50a)。一个开口(28)或多个开口(29)的组位于屏蔽(20)中元件(11)上。开口(28)或多个开口(29)优选小于元件(11)的尺寸。还示出了EMI垫圈(30)。EMI垫圈(30)是可压缩的导电材料,用于电桥接两个导电表面之间的间隙。例如,EMI垫圈(30)可以是充满了导电微粒的弹性体。例如,这种EMI垫圈(30)可以从W.L.Gore&Associates,Inc.的商品名称GORE-以及Chomerics,Div.Of Parker Hannifin Corp.的Cho-获得。EMI垫圈(30)被设置成基本包围一个开口(28)或多个开口(29),并与屏蔽(20)的导电层(26)和散热片(50)的导电表面(50a)物理接触。因此,EMI垫圈(30)电桥接屏蔽(20)和散热片(50)之间的间隙,从而消除对于EMI来说进入/离开的势源。EMI垫圈(30)可以通过机械或粘合装置(未示出)附着到屏蔽(20)或散热片(50)上。设置TCI材料(40)以便至少部分通过一个开口(28)或多个开口(29)并与元件(11)和散热片(50)的表面(50a)物理接触。TCI材料(40)可以通过机械或粘合装置(未示出)附着到散热片(50)、元件(11)或屏蔽(20)上。在工作情况下,元件(11)产生热量,随后通过TCI材料(40)传导到散热片(50)。因此,TCI材料(40)有助于将热量转移到散热片(50)以便将热量从元件(11)散去。
如图8所示,在另一个较佳实施例中,屏蔽(20)再次由两个层构成,电介质材料层(27)和至少设置于外表面(25)的一部分上的导电层(26)。还示出了散热片(50),具有导电表面(50a)。一个开口(28)或多个开口(29)的组位于屏蔽(20)中元件(11)上。开口(28)或多个开口(29)的组优选小于元件(11)的尺寸。还示出了导电TCI材料(42)。设置导电TCI材料(42)以便基本覆盖一个孔(28)或多个孔(29),并与屏蔽(20)的导电层(26)和散热片(50)的导电表面(50a)物理接触。还设置导电TCI材料(42)以便至少部分通过开口(28)或多个开口(29)的组并与元件(11)和散热片(50)的表面(50a)物理接触。导电TCI材料(42)可以通过机械或粘合装置(未示出)附着到屏蔽(20)或散热片(50)上。因此,导电TCI材料(42)电桥接屏蔽(20)和散热片(50)之间的间隙并有助于将热量转移到散热片(50)以便将热量从元件(11)散去。
虽然这里已说明和描述了本发明的特殊实施例,但本发明不限于这些说明和描述。可以理解,在以下权利要求书的范围内,各种变化和修改可以结合在本发明中并作为本发明的一部分。
Claims (17)
1.一种装置,其特征在于,包括:
(a)一基板,至少一个电元件设置于其上;
(b)多个分立的导电性紧固单元,它们在所述基板上按一定的图案设置并包围所述至少一个电元件;
(c)板级的电磁干扰EMI屏蔽,它包括一导电层;
(d)多个孔,其形成于所述板级EMI屏蔽中,使得所述孔对应于所述导电性紧固单元的所述图案;
(e)至少一个导热对接TCI材料,其设置于所述至少一个电元件上;以及
(f)其中,所述板级EMI屏蔽的所述导电层与至少一个所述导电性紧固单元电接触,其中所述导电性紧固单元大于所述孔,使得所述EMI屏蔽和所述基板间的机械附着形成搭扣配合或静配合,所述的搭扣配合或静配合可以通过将EMI屏蔽推离基板而脱扣。
2.如权利要求1所述的装置,其特征在于,至少一个所述孔具有接触区,且其中所述板级电磁干扰EMI屏蔽的所述导电层是适用于搭扣结构的可偏斜材料,从而使得所述接触区啮合并夹持所述导电性紧固单元中的至少一个。
3.如权利要求1所述的装置,其特征在于,所述导电性紧固单元中的至少一个是焊料球。
4.如权利要求1所述的装置,其特征在于,所述板级电磁干扰EMI屏蔽进一步包括电介质材料层。
5.如权利要求4所述的装置,其特征在于,所述电介质材料层具有外表面,且其中所述导电层设置于所述电介质材料层的所述外表面上。
6.如权利要求1所述的装置,其特征在于,所述导电层选自铝、锡、金、镍、银、铜或者其组合或合金。
7.如权利要求1所述的装置,其特征在于,所述导电层是箔。
8.如权利要求1所述的装置,其特征在于,所述基板具有多个电元件且所述板级电磁干扰EMI屏蔽进一步包括多个隔室,它们适合于覆盖所述多个电元件。
9.如权利要求1所述的装置,其特征在于,所述至少一个TCI材料包括充满了导热微粒的弹性体。
10.如权利要求1所述的装置,其特征在于,进一步包括散热片。
11.如权利要求10所述的装置,其特征在于,所述板级电磁干扰EMI屏蔽包括至少一个开口,且其中所述至少一个导热对接TCI材料至少部分地通过所述至少一个开口并形成与所述散热片和所述至少一个电元件的物理接触。
12.如权利要求11所述的装置,其特征在于,进一步包括所述散热片上的导电表面和EMI垫圈,其中所述EMI垫圈与所述板级EMI屏蔽的所述导电层以及所述散热片的所述导电表面电接触,并基本包围所述至少一个开口。
13.如权利要求11所述的装置,其特征在于,进一步包括所述散热片上的导电表面,且其中所述至少一个导热对接TCI材料基本覆盖所述至少一个开口,且其中所述至少一个TCI材料也是导电的,且其中所述导电TCI材料与所述散热片上的所述导电表面以及所述板级电磁干扰EMI屏蔽的所述导电层电接触。
14.如权利要求1所述的装置,其特征在于,所述导电性紧固单元是焊料球。
15.如权利要求1所述的装置,其特征在于,还包括设置于所述至少一个TCI材料上的散热片,其中,所述散热片和所述至少一个TCI材料组合以使热量从所述至少一个电气元件散去。
16.如权利要求14所述的装置,其特征在于,所述板级EMI屏蔽和所述焊料球组合以限制电磁辐射进入或离开所述多个隔室。
17.一种用于基板和多个分立的导电性紧固单元的板级电磁干扰EMI屏蔽,该基板具有设置于其上的至少一个电元件且所述多个分立的导电性紧固单元在基板上设置成一定图案并包围至少一个电元件,其特征在于,所述板级EMI屏蔽包括:
(a)导电层;
(b)多个孔,它们形成于所述板级EMI屏蔽中从而所述孔对应于导电性紧固单元的图案;
(c)至少一个导热对接TCI材料,其附着到所述板级EMI屏蔽上;
(d)其中,至少一个所述孔具有接触区,且其中所述孔的所述接触区处的所述板级EMI屏蔽的所述导电层是适用于搭扣结构的可偏斜材料,从而使得所述接触区啮合并夹持所述导电性紧固单元中的至少一个;以及
(e)其中,所述接触区处的所述EMI屏蔽的所述导电层适合于形成与至少一个所述导电性紧固单元的电接触。
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- 2003-03-11 CA CA2481842A patent/CA2481842C/en not_active Expired - Fee Related
- 2003-03-11 BR BR0309043-4A patent/BR0309043A/pt not_active Application Discontinuation
- 2003-03-11 AT AT03711531T patent/ATE343316T1/de not_active IP Right Cessation
- 2003-03-11 DE DE60309150T patent/DE60309150T2/de not_active Expired - Lifetime
- 2003-03-11 AU AU2003213838A patent/AU2003213838B2/en not_active Ceased
- 2003-03-11 CN CNB038133075A patent/CN100438737C/zh not_active Expired - Fee Related
- 2003-03-11 WO PCT/US2003/007507 patent/WO2003088729A1/en active IP Right Grant
- 2003-03-11 EP EP03711531A patent/EP1493314B1/en not_active Expired - Lifetime
- 2003-03-11 MX MXPA04009895A patent/MXPA04009895A/es active IP Right Grant
- 2003-03-11 KR KR1020047016038A patent/KR100590662B1/ko active IP Right Grant
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2004
- 2004-10-08 IL IL164453A patent/IL164453A/en not_active IP Right Cessation
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN106879238A (zh) * | 2015-11-09 | 2017-06-20 | 摩托罗拉解决方案公司 | 电磁干扰屏蔽组件和提供电磁干扰屏蔽的方法 |
CN106879238B (zh) * | 2015-11-09 | 2019-03-01 | 摩托罗拉解决方案公司 | 电磁干扰屏蔽组件和提供电磁干扰屏蔽的方法 |
Also Published As
Publication number | Publication date |
---|---|
US20030193794A1 (en) | 2003-10-16 |
KR20040099415A (ko) | 2004-11-26 |
DE60309150D1 (de) | 2006-11-30 |
EP1493314B1 (en) | 2006-10-18 |
DE60309150T2 (de) | 2007-08-30 |
CA2481842C (en) | 2012-06-26 |
ATE343316T1 (de) | 2006-11-15 |
NO336280B1 (no) | 2015-07-06 |
IL164453A0 (en) | 2005-12-18 |
IL164453A (en) | 2009-05-04 |
BR0309043A (pt) | 2005-02-01 |
KR100590662B1 (ko) | 2006-06-19 |
JP2006513556A (ja) | 2006-04-20 |
HK1068204A1 (en) | 2005-04-22 |
EP1493314A1 (en) | 2005-01-05 |
MXPA04009895A (es) | 2004-12-07 |
AU2003213838B2 (en) | 2005-11-03 |
WO2003088729A1 (en) | 2003-10-23 |
JP4317033B2 (ja) | 2009-08-19 |
NO20044695L (no) | 2004-10-29 |
US6744640B2 (en) | 2004-06-01 |
AU2003213838A1 (en) | 2003-10-27 |
CA2481842A1 (en) | 2003-10-23 |
CN1659942A (zh) | 2005-08-24 |
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