DE60203113T2 - Vorrichtungen,Zusammensetzungen und verfahren unter Einbeziehung von Kleb- stoffen, deren Leistung durch Organophile Tonbestandteile verbessert ist - Google Patents
Vorrichtungen,Zusammensetzungen und verfahren unter Einbeziehung von Kleb- stoffen, deren Leistung durch Organophile Tonbestandteile verbessert ist Download PDFInfo
- Publication number
- DE60203113T2 DE60203113T2 DE60203113T DE60203113T DE60203113T2 DE 60203113 T2 DE60203113 T2 DE 60203113T2 DE 60203113 T DE60203113 T DE 60203113T DE 60203113 T DE60203113 T DE 60203113T DE 60203113 T2 DE60203113 T2 DE 60203113T2
- Authority
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- Germany
- Prior art keywords
- electrically conductive
- adhesive
- adhesive composition
- clay
- conductive adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- VGIBGUSAECPPNB-UHFFFAOYSA-L nonaaluminum;magnesium;tripotassium;1,3-dioxido-2,4,5-trioxa-1,3-disilabicyclo[1.1.1]pentane;iron(2+);oxygen(2-);fluoride;hydroxide Chemical compound [OH-].[O-2].[O-2].[O-2].[O-2].[O-2].[F-].[Mg+2].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[K+].[K+].[K+].[Fe+2].O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2 VGIBGUSAECPPNB-UHFFFAOYSA-L 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- VLTOSDJJTWPWLS-UHFFFAOYSA-N pent-2-ynal Chemical compound CCC#CC=O VLTOSDJJTWPWLS-UHFFFAOYSA-N 0.000 description 1
- 239000000546 pharmaceutical excipient Substances 0.000 description 1
- 229910052615 phyllosilicate Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920001289 polyvinyl ether Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 150000003856 quaternary ammonium compounds Chemical class 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007560 sedimentation technique Methods 0.000 description 1
- 238000007873 sieving Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 150000003388 sodium compounds Chemical class 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 230000000153 supplemental effect Effects 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 230000009044 synergistic interaction Effects 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/346—Clay
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2477/00—Presence of polyamide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/50—Improvements relating to the production of bulk chemicals
- Y02P20/582—Recycling of unreacted starting or intermediate materials
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/896,655 US6884833B2 (en) | 2001-06-29 | 2001-06-29 | Devices, compositions, and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents |
| US896655 | 2001-06-29 | ||
| PCT/US2002/011309 WO2003002682A1 (en) | 2001-06-29 | 2002-04-12 | Devices, compositions, and methods incorporating adhesives whose preformance is enhanced by organophilic clay constituents |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE60203113D1 DE60203113D1 (de) | 2005-04-07 |
| DE60203113T2 true DE60203113T2 (de) | 2006-01-19 |
Family
ID=25406577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE60203113T Expired - Lifetime DE60203113T2 (de) | 2001-06-29 | 2002-04-12 | Vorrichtungen,Zusammensetzungen und verfahren unter Einbeziehung von Kleb- stoffen, deren Leistung durch Organophile Tonbestandteile verbessert ist |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US6884833B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP1399519B8 (cg-RX-API-DMAC7.html) |
| JP (1) | JP4417710B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR100877444B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN1246410C (cg-RX-API-DMAC7.html) |
| AT (1) | ATE290055T1 (cg-RX-API-DMAC7.html) |
| DE (1) | DE60203113T2 (cg-RX-API-DMAC7.html) |
| MY (1) | MY132559A (cg-RX-API-DMAC7.html) |
| TW (1) | TWI301145B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2003002682A1 (cg-RX-API-DMAC7.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102017010605A1 (de) * | 2017-11-16 | 2019-05-16 | Lohmann Gmbh & Co. Kg | Elektrisch leitfähige klebende Verbindung als Einbruchsschutz |
Families Citing this family (92)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100671312B1 (ko) * | 1999-08-25 | 2007-01-19 | 히다치 가세고교 가부시끼가이샤 | 배선단자 접속용 필름 |
| USRE44145E1 (en) | 2000-07-07 | 2013-04-09 | A.V. Topchiev Institute Of Petrochemical Synthesis | Preparation of hydrophilic pressure sensitive adhesives having optimized adhesive properties |
| KR100505201B1 (ko) * | 2000-10-13 | 2005-07-29 | 가부시키가이샤 덴소 | 터치 패널, 및 그 제조방법 |
| DE60233217D1 (de) | 2001-05-01 | 2009-09-17 | Corium Internat Inc | Hydrogel-zusammensetzungen |
| US20050113510A1 (en) | 2001-05-01 | 2005-05-26 | Feldstein Mikhail M. | Method of preparing polymeric adhesive compositions utilizing the mechanism of interaction between the polymer components |
| RU2286801C2 (ru) * | 2001-05-01 | 2006-11-10 | Институт Нефтехимического Синтеза Имени А.В. Топчиева Российской Академии Наук | Двухфазные биоадгезионные композиции, абсорбирующие воду |
| US8840918B2 (en) | 2001-05-01 | 2014-09-23 | A. V. Topchiev Institute of Petrochemical Synthesis, Russian Academy of Sciences | Hydrogel compositions for tooth whitening |
| US8206738B2 (en) | 2001-05-01 | 2012-06-26 | Corium International, Inc. | Hydrogel compositions with an erodible backing member |
| US8541021B2 (en) | 2001-05-01 | 2013-09-24 | A.V. Topchiev Institute Of Petrochemical Synthesis | Hydrogel compositions demonstrating phase separation on contact with aqueous media |
| US20050215727A1 (en) | 2001-05-01 | 2005-09-29 | Corium | Water-absorbent adhesive compositions and associated methods of manufacture and use |
| DE10153562A1 (de) * | 2001-10-30 | 2003-05-15 | Infineon Technologies Ag | Verfahren zur Verringerung des elektrischen Kontaktwiderstandes in organischen Feldeffekt-Transistoren durch Einbetten von Nanopartikeln zur Erzeugung von Feldüberhöhungen an der Grenzfläche zwischen dem Kontaktmaterial und dem organischen Halbleitermaterial |
| DE10206818A1 (de) * | 2002-02-18 | 2003-08-28 | Infineon Technologies Ag | Elektronisches Bauteil mit Klebstoffschicht und Verfahren zur Herstellung derselben |
| US7754976B2 (en) * | 2002-04-15 | 2010-07-13 | Hamilton Sundstrand Corporation | Compact circuit carrier package |
| US7217853B2 (en) * | 2002-05-24 | 2007-05-15 | Corium International, Inc. | Composition for cushions, wound dressings and other skin-contacting products |
| JP2004051755A (ja) | 2002-07-18 | 2004-02-19 | Ricoh Co Ltd | 弾性導電樹脂及び弾性導電接合構造 |
| US7285583B2 (en) * | 2002-07-30 | 2007-10-23 | Liquamelt Licensing Llc | Hybrid plastisol/hot melt compositions |
| US20040245648A1 (en) * | 2002-09-18 | 2004-12-09 | Hiroshi Nagasawa | Bonding material and bonding method |
| US6867978B2 (en) * | 2002-10-08 | 2005-03-15 | Intel Corporation | Integrated heat spreader package for heat transfer and for bond line thickness control and process of making |
| DE10313121A1 (de) * | 2003-01-29 | 2004-08-05 | Tesa Ag | Klebeband und Verwendung dessen zur Verklebung von Drucktüchern |
| US8518304B1 (en) | 2003-03-31 | 2013-08-27 | The Research Foundation Of State University Of New York | Nano-structure enhancements for anisotropic conductive material and thermal interposers |
| ATE361965T1 (de) * | 2003-04-10 | 2007-06-15 | 3M Innovative Properties Co | Durch wärme aktivierbarer klebstoff |
| US7034403B2 (en) * | 2003-04-10 | 2006-04-25 | 3M Innovative Properties Company | Durable electronic assembly with conductive adhesive |
| US8062734B2 (en) * | 2003-04-28 | 2011-11-22 | Eastman Kodak Company | Article comprising conductive conduit channels |
| FR2854899B1 (fr) * | 2003-05-16 | 2006-07-07 | Atofina | Compositions de polymeres thermoplastiques olefiniques et de charges de taille nanometrique sous forme de melanges-maitres |
| US7352070B2 (en) * | 2003-06-27 | 2008-04-01 | Delphi Technologies, Inc. | Polymer encapsulated electrical devices |
| US7408787B2 (en) * | 2003-07-30 | 2008-08-05 | Intel Corporation | Phase change thermal interface materials including polyester resin |
| US7163967B2 (en) * | 2003-12-01 | 2007-01-16 | Cryovac, Inc. | Method of increasing the gas transmission rate of a film |
| US7335327B2 (en) * | 2003-12-31 | 2008-02-26 | Cryovac, Inc. | Method of shrinking a film |
| AU2005210637B2 (en) | 2004-01-30 | 2010-09-16 | A.V. Topchiev Institute Of Petrochemical Synthesis | Rapidly dissolving film for delivery of an active agent |
| KR100604984B1 (ko) * | 2004-06-10 | 2006-07-31 | 한국생산기술연구원 | 나노점토가 포함된 부식방지 코팅제 및 그 제법 |
| JP4517225B2 (ja) * | 2004-06-14 | 2010-08-04 | ▲晧▼一 新原 | 感圧導電性エラストマー |
| KR100584962B1 (ko) * | 2004-07-26 | 2006-05-29 | 삼성전기주식회사 | 액정 중합체로 커버레이 성형된 경연성 인쇄회로기판 및그 제조 방법 |
| CA2576158C (en) * | 2004-08-05 | 2020-10-27 | Corium International, Inc. | Adhesive composition |
| DE102004049663B3 (de) * | 2004-10-11 | 2006-04-13 | Infineon Technologies Ag | Kunststoffgehäuse und Halbleiterbauteil mit derartigem Kunststoffgehäuse sowie Verfahren zur Herstellung derselben |
| WO2006047509A2 (en) | 2004-10-22 | 2006-05-04 | Societe De Technologie Michelin | Barrier layer for elastomeric articles |
| JP2006140052A (ja) * | 2004-11-12 | 2006-06-01 | Three M Innovative Properties Co | 熱硬化性接着フィルム付きコネクタ及びそれを用いた接続方法 |
| CN100405506C (zh) * | 2004-11-26 | 2008-07-23 | 鸿富锦精密工业（深圳）有限公司 | 各向异性导电材料 |
| TWI323901B (en) * | 2004-11-26 | 2010-04-21 | Hon Hai Prec Ind Co Ltd | Anisotropic conductive material |
| US7842156B2 (en) * | 2005-04-27 | 2010-11-30 | Avery Dennison Corporation | Webs and methods of making same |
| US7749350B2 (en) * | 2005-04-27 | 2010-07-06 | Avery Dennison Retail Information Services | Webs and methods of making same |
| US8802214B2 (en) | 2005-06-13 | 2014-08-12 | Trillion Science, Inc. | Non-random array anisotropic conductive film (ACF) and manufacturing processes |
| US20060280912A1 (en) * | 2005-06-13 | 2006-12-14 | Rong-Chang Liang | Non-random array anisotropic conductive film (ACF) and manufacturing processes |
| DE102005030627A1 (de) * | 2005-06-30 | 2007-01-04 | Bundesdruckerei Gmbh | Sicherheits- oder Wertdokument mit einer Einrichtung zur kontaktlosen Kommunikation mit einem externen Lese- und/oder Schreibgerät |
| US7678841B2 (en) * | 2005-08-19 | 2010-03-16 | Cryovac, Inc. | Increasing the gas transmission rate of a film comprising fullerenes |
| US7888419B2 (en) * | 2005-09-02 | 2011-02-15 | Naturalnano, Inc. | Polymeric composite including nanoparticle filler |
| JP5034206B2 (ja) * | 2005-10-03 | 2012-09-26 | 株式会社デンソー | 導電性接着剤 |
| JP4761952B2 (ja) * | 2005-12-14 | 2011-08-31 | 富士通株式会社 | Ｒｆｉｄタグ |
| GB2433926A (en) * | 2005-12-22 | 2007-07-11 | Lifescan Scotland Inc | Container with RFID for storing calibration information |
| US7923488B2 (en) * | 2006-10-16 | 2011-04-12 | Trillion Science, Inc. | Epoxy compositions |
| US8124678B2 (en) * | 2006-11-27 | 2012-02-28 | Naturalnano, Inc. | Nanocomposite master batch composition and method of manufacture |
| WO2008112362A2 (en) * | 2007-02-07 | 2008-09-18 | Naturalnano, Inc. | Nanocomposite method of manufacture |
| JP2008189858A (ja) * | 2007-02-07 | 2008-08-21 | Nitto Denko Corp | 感圧性粘着テープ |
| JP5019434B2 (ja) * | 2007-02-07 | 2012-09-05 | 日東電工株式会社 | 粘着テープ |
| JP2008214518A (ja) * | 2007-03-06 | 2008-09-18 | Nitto Denko Corp | 粘着テープ |
| WO2009029310A1 (en) * | 2007-05-23 | 2009-03-05 | Naturalnano Research, Inc. | Fire and flame retardant polymer composites |
| TWI334746B (en) * | 2008-03-31 | 2010-12-11 | Raydium Semiconductor Corp | Assembly structure |
| US20120080418A1 (en) * | 2008-05-15 | 2012-04-05 | Atsunobu Sakamoto | Impulse sealer including ceramic-covered heater |
| EP2311048B1 (de) * | 2008-08-08 | 2015-04-29 | pp-mid GmbH | Polymerformkörper und leiterplatten-anordnung, sowie verfahren zu deren herstellung |
| US8486305B2 (en) | 2009-11-30 | 2013-07-16 | Lockheed Martin Corporation | Nanoparticle composition and methods of making the same |
| WO2010056689A1 (en) * | 2008-11-14 | 2010-05-20 | Naturalnano, Inc. | Nanocomposite including heat-treated clay and polymer |
| US8784879B2 (en) * | 2009-01-14 | 2014-07-22 | Corium International, Inc. | Transdermal administration of tamsulosin |
| US8488271B2 (en) * | 2009-07-06 | 2013-07-16 | Samsung Electro-Mechanics Japan Advanced Technology Co., Ltd. | Adhesion structure and method using electrically conductive adhesive, disk drive device using the adhesion structure and method, and method for manufacturing the disk drive device |
| US9011570B2 (en) | 2009-07-30 | 2015-04-21 | Lockheed Martin Corporation | Articles containing copper nanoparticles and methods for production and use thereof |
| US9072185B2 (en) * | 2009-07-30 | 2015-06-30 | Lockheed Martin Corporation | Copper nanoparticle application processes for low temperature printable, flexible/conformal electronics and antennas |
| JP5691147B2 (ja) * | 2009-08-25 | 2015-04-01 | 東ソー株式会社 | エチレン−酢酸ビニル共重合体樹脂組成物、それからなる接着剤、接着フィルム、及びそれを含む積層体 |
| HRP20180741T1 (hr) * | 2009-10-30 | 2018-06-15 | Research Frontiers Incorporated | Spd filmovi i lagane ventilirajuće prevlake s poboljšanim priključcima sabirnica-šina |
| US20110132537A1 (en) * | 2009-12-03 | 2011-06-09 | 3M Innovative Properties Company | Composition, tape, and use thereof |
| US8061624B2 (en) * | 2009-12-28 | 2011-11-22 | Avery Dennison Corporation | RFID strap and cutting device |
| WO2011109660A2 (en) * | 2010-03-04 | 2011-09-09 | Lockheed Martin Corporation | Compositions containing tin nanoparticles and methods for use thereof |
| US10544483B2 (en) | 2010-03-04 | 2020-01-28 | Lockheed Martin Corporation | Scalable processes for forming tin nanoparticles, compositions containing tin nanoparticles, and applications utilizing same |
| DE102010024523B4 (de) * | 2010-06-21 | 2017-03-23 | Leonhard Kurz Stiftung & Co. Kg | Mehrschichtiges Folienelement |
| KR20110121662A (ko) * | 2010-08-03 | 2011-11-08 | 삼성전기주식회사 | 터치패널 및 그 제조방법 |
| TWI398198B (zh) * | 2010-09-13 | 2013-06-01 | Zhen Ding Technology Co Ltd | 具有接地屏蔽結構之電路板及其製作方法 |
| WO2012116193A1 (en) * | 2011-02-25 | 2012-08-30 | Carey & Co. | Dry adhesive |
| WO2012145865A1 (zh) | 2011-04-29 | 2012-11-01 | Yang Chang-Ming | 布料电子化的产品及方法 |
| US9102851B2 (en) | 2011-09-15 | 2015-08-11 | Trillion Science, Inc. | Microcavity carrier belt and method of manufacture |
| US9475963B2 (en) | 2011-09-15 | 2016-10-25 | Trillion Science, Inc. | Fixed array ACFs with multi-tier partially embedded particle morphology and their manufacturing processes |
| CN104169386B (zh) * | 2012-03-12 | 2016-10-26 | Lg化学株式会社 | 压敏性粘合剂组合物 |
| CN102627669B (zh) * | 2012-04-12 | 2015-01-07 | 天津药物研究院 | 含有磷酸酯的哌嗪衍生物及其制备方法和用途 |
| US9261336B2 (en) | 2013-03-15 | 2016-02-16 | Mattel, Inc. | Toy projectile and method of making |
| WO2014192881A1 (ja) * | 2013-05-31 | 2014-12-04 | 積水化学工業株式会社 | 液晶表示素子用シール剤、上下導通材料、液晶表示素子、及び、液晶表示素子用シール剤の製造方法 |
| KR20140141208A (ko) * | 2013-05-31 | 2014-12-10 | 제일모직주식회사 | 전기전도성이 우수한 캐리어 테이프용 폴리카보네이트계 수지 조성물 |
| KR20150043787A (ko) * | 2013-10-15 | 2015-04-23 | 삼성전기주식회사 | 터치 스크린 패널 및 이의 제조방법 |
| US10490521B2 (en) * | 2014-06-26 | 2019-11-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Advanced structure for info wafer warpage reduction |
| US10893728B2 (en) * | 2017-01-30 | 2021-01-19 | Chi Huynh | Jewelry having druzy or geode effect and methods of manufacture |
| TWI755492B (zh) | 2017-03-06 | 2022-02-21 | 美商卡爾拜斯有限公司 | 基於碳納米管的熱界面材料及其製造和使用方法 |
| KR102450758B1 (ko) * | 2018-01-30 | 2022-10-04 | 쇼와덴코머티리얼즈가부시끼가이샤 | 반도체 장치의 제조 방법, 및 필름형 접착제 |
| US12022642B2 (en) | 2018-08-21 | 2024-06-25 | Laird Technologies, Inc. | Patterned electromagnetic interference (EMI) mitigation materials including carbon nanotubes |
| US10707596B2 (en) * | 2018-09-21 | 2020-07-07 | Carbice Corporation | Coated electrical connectors and methods of making and using thereof |
| CN111642076A (zh) * | 2020-04-29 | 2020-09-08 | 信维通信（江苏）有限公司 | 一种二维材料填充覆铜板的制造工艺 |
| JP7513430B2 (ja) * | 2020-06-05 | 2024-07-09 | デクセリアルズ株式会社 | 接合体の製造方法、接合体、及び導電粒子含有ホットメルト接着シート |
| KR102798129B1 (ko) * | 2025-02-06 | 2025-04-22 | 주식회사 대림산업 | 기능성 우레탄 접착제 제조방법 및 이에 의해 제조된 우레탄 접착제 |
Family Cites Families (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3084117A (en) * | 1961-04-04 | 1963-04-02 | Union Oil Co | Organoclay-polyolefin compositions |
| GB1054111A (cg-RX-API-DMAC7.html) * | 1962-06-26 | |||
| NL295858A (cg-RX-API-DMAC7.html) * | 1962-07-27 | |||
| US3671190A (en) * | 1970-11-10 | 1972-06-20 | Laporte Industries Ltd | Synthetic clay-like minerals of the smectite type and method of preparation |
| US3666407A (en) * | 1971-01-28 | 1972-05-30 | Pfizer | Process for producing synthetic hectorite-type clays |
| US3855147A (en) * | 1972-05-26 | 1974-12-17 | Nl Industries Inc | Synthetic smectite compositions, their preparation, and their use as thickeners in aqueous systems |
| US3852405A (en) * | 1972-09-22 | 1974-12-03 | Nl Industries Inc | Laminar heavy metal aluminosilicates |
| US3844978A (en) * | 1972-12-01 | 1974-10-29 | Chevron Res | Layered clay minerals and processes for using |
| US3844979A (en) * | 1972-12-01 | 1974-10-29 | Chevron Res | Layered clay minerals, catalysts, and processes for using |
| US4606962A (en) * | 1983-06-13 | 1986-08-19 | Minnesota Mining And Manufacturing Company | Electrically and thermally conductive adhesive transfer tape |
| US4698242A (en) * | 1985-08-12 | 1987-10-06 | National Starch And Chemical Corporation | Thermoplastic elastic adhesive containing polyether block amides |
| US4695402A (en) * | 1985-08-20 | 1987-09-22 | Nl Chemicals, Inc. | Organophilic clay gellants and process for preparation |
| JPH0623349B2 (ja) | 1986-01-30 | 1994-03-30 | 富士高分子工業株式会社 | 異方導電性接着剤 |
| US4740657A (en) * | 1986-02-14 | 1988-04-26 | Hitachi, Chemical Company, Ltd | Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained |
| DE3806548C2 (de) * | 1987-03-04 | 1996-10-02 | Toyoda Chuo Kenkyusho Kk | Verbundmaterial und Verfahren zu dessen Herstellung |
| JPH02206670A (ja) | 1989-02-06 | 1990-08-16 | Hitachi Chem Co Ltd | 異方導電性を有する回路接続用熱伝導性接着剤組成物及び熱伝導性接着フィルム |
| JPH03223380A (ja) | 1990-01-30 | 1991-10-02 | Oki Electric Ind Co Ltd | 異方性導電接着剤 |
| DE4122211A1 (de) * | 1991-07-04 | 1993-01-21 | Inventa Ag | Thermoplastische formmassen aus semikristallinem und amorphem polyamid, deren verwendung und verfahren zu ihrer herstellung |
| CA2115255A1 (en) | 1991-08-12 | 1993-03-04 | Macrae Maxfield | Melt process formation of polymer nanocomposite of exfoliated layered material |
| US5336647A (en) * | 1991-11-14 | 1994-08-09 | Rheox, Inc. | Organoclay compositions prepared with a mixture of two organic cations and their use in non-aqueous systems |
| US5429999A (en) * | 1991-11-14 | 1995-07-04 | Rheox, Inc. | Organoclay compositions containing two or more cations and one or more organic anions, their preparation and use in non-aqueous systems |
| WO1993011190A1 (en) | 1991-11-26 | 1993-06-10 | Allied-Signal Inc. | Polymer nanocomposites formed by melt processing of a polymer and an exfoliated layered material derivatized with reactive organo silanes |
| US5244707A (en) * | 1992-01-10 | 1993-09-14 | Shores A Andrew | Enclosure for electronic devices |
| JPH09504568A (ja) * | 1993-11-03 | 1997-05-06 | ダブリュ．エル．ゴア アンド アソシエイツ，インコーポレイティド | 導電性接着剤 |
| US5443876A (en) * | 1993-12-30 | 1995-08-22 | Minnesota Mining And Manufacturing Company | Electrically conductive structured sheets |
| US5686703A (en) * | 1994-12-16 | 1997-11-11 | Minnesota Mining And Manufacturing Company | Anisotropic, electrically conductive adhesive film |
| EP1029823A3 (en) | 1995-06-05 | 2001-02-14 | Kabushiki Kaisha Toyota Chuo Kenkyusho | Composite clay rubber material, composite clay material and processes for producing same |
| US5760106A (en) * | 1995-07-05 | 1998-06-02 | Board Of Trustees Operating Michigan State University | Sealant method of epoxy resin-clay composites |
| WO1997003143A1 (en) * | 1995-07-10 | 1997-01-30 | Minnesota Mining And Manufacturing Company | Screen printable adhesive compositions |
| US5672400A (en) * | 1995-12-21 | 1997-09-30 | Minnesota Mining And Manufacturing Company | Electronic assembly with semi-crystalline copolymer adhesive |
| US5780376A (en) | 1996-02-23 | 1998-07-14 | Southern Clay Products, Inc. | Organoclay compositions |
| US5730791A (en) * | 1997-02-26 | 1998-03-24 | Tomah Products, Inc. | Asphalt-base coating composition with novel hindered acid/amine salt surfactant |
| NL1006743C2 (nl) | 1997-08-08 | 1999-02-09 | Tno | Nanocomposiet-materiaal. |
| CA2320988A1 (en) | 1998-02-13 | 1999-08-19 | Solutia Inc. | Polymer nanocomposite composition |
| EP1155079B1 (en) | 1998-12-07 | 2003-08-20 | University of South Carolina Research Foundation | Polymer/clay nanocomposite and process for making same |
| US6025119A (en) * | 1998-12-18 | 2000-02-15 | Eastman Kodak Company | Antistatic layer for imaging element |
| US6060230A (en) * | 1998-12-18 | 2000-05-09 | Eastman Kodak Company | Imaging element comprising an electrically-conductive layer containing metal-containing particles and clay particles and a transparent magnetic recording layer |
| US6767951B2 (en) * | 2001-11-13 | 2004-07-27 | Eastman Kodak Company | Polyester nanocomposites |
-
2001
- 2001-06-29 US US09/896,655 patent/US6884833B2/en not_active Expired - Lifetime
-
2002
- 2002-04-12 AT AT02723819T patent/ATE290055T1/de not_active IP Right Cessation
- 2002-04-12 JP JP2003509047A patent/JP4417710B2/ja not_active Expired - Fee Related
- 2002-04-12 EP EP02723819A patent/EP1399519B8/en not_active Expired - Lifetime
- 2002-04-12 CN CNB028132300A patent/CN1246410C/zh not_active Expired - Fee Related
- 2002-04-12 KR KR1020037016981A patent/KR100877444B1/ko not_active Expired - Fee Related
- 2002-04-12 WO PCT/US2002/011309 patent/WO2003002682A1/en not_active Ceased
- 2002-04-12 DE DE60203113T patent/DE60203113T2/de not_active Expired - Lifetime
- 2002-06-18 MY MYPI20022281A patent/MY132559A/en unknown
- 2002-06-19 TW TW091113362A patent/TWI301145B/zh not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102017010605A1 (de) * | 2017-11-16 | 2019-05-16 | Lohmann Gmbh & Co. Kg | Elektrisch leitfähige klebende Verbindung als Einbruchsschutz |
| DE102017010605B4 (de) * | 2017-11-16 | 2025-07-24 | Lohmann Gmbh & Co. Kg | Elektrisch leitfähige klebende Verbindung als Einbruchsschutz |
Also Published As
| Publication number | Publication date |
|---|---|
| DE60203113D1 (de) | 2005-04-07 |
| WO2003002682A1 (en) | 2003-01-09 |
| KR20040030710A (ko) | 2004-04-09 |
| EP1399519B1 (en) | 2005-03-02 |
| EP1399519B8 (en) | 2005-04-20 |
| US6884833B2 (en) | 2005-04-26 |
| TWI301145B (en) | 2008-09-21 |
| JP2004534129A (ja) | 2004-11-11 |
| CN1246410C (zh) | 2006-03-22 |
| JP4417710B2 (ja) | 2010-02-17 |
| EP1399519A1 (en) | 2004-03-24 |
| CN1522287A (zh) | 2004-08-18 |
| ATE290055T1 (de) | 2005-03-15 |
| MY132559A (en) | 2007-10-31 |
| KR100877444B1 (ko) | 2009-01-07 |
| US20030100654A1 (en) | 2003-05-29 |
| HK1064404A1 (en) | 2005-01-28 |
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